公开(公告)号：US20110024160A1

公开(公告)日：2011-02-03

申请号：US12534077

申请日：2009-07-31

申请人： Clifton Quan ,  Hee Kyung Kim ,  Fangchou Yang ,  Kevin C. Rolston ,  Edward Marsh Jackson

发明人： Clifton Quan ,  Hee Kyung Kim ,  Fangchou Yang ,  Kevin C. Rolston ,  Edward Marsh Jackson

IPC分类号： H05K1/00 ,  H05K3/36

CPC分类号： H05K1/028 ,  H05K1/024 ,  H05K1/144 ,  H05K1/147 ,  H05K3/361 ,  H05K3/4069 ,  H05K3/4614 ,  H05K3/4635 ,  H05K2201/055 ,  H05K2201/058 ,  H05K2201/09109 ,  H05K2201/09318 ,  H05K2201/10378 ,  H05K2203/063 ,  Y10T29/49126 ,  Y10T29/49155

摘要： A multi-layer microwave corrugated printed circuit board is provided. In one embodiment, the invention relates to a method for interconnecting components of a corrugated printed circuit board, the components including a first flexible layer having a first signal line on a surface of the first flexible layer and a second flexible layer having a second signal line on a surface of the second flexible layer, the method including forming at least one first hole in the first flexible layer, forming a conductive pad on the second flexible layer, forming at least one second hole in a non-conductive adhesive layer, aligning the at least one second hole with the at least one first hole and the conductive pad, bonding the first flexible layer and the second flexible layer, with the non-conductive adhesive layer disposed there between, and filling the at least one first hole and the at least one second hole with a conductive paste to electrically couple the first signal line with the second signal line.

摘要翻译： 提供多层微波波纹印刷电路板。 在一个实施例中，本发明涉及一种用于互连波纹印刷电路板的部件的方法，所述部件包括在第一柔性层的表面上具有第一信号线的第一柔性层和具有第二信号线的第二柔性层 在所述第二柔性层的表面上，所述方法包括在所述第一柔性层中形成至少一个第一孔，在所述第二柔性层上形成导电垫，在非导电粘合剂层中形成至少一个第二孔， 至少一个具有所述至少一个第一孔和所述导电垫的第二孔，将所述第一柔性层和所述第二柔性层结合，所述非导电粘合剂层设置在所述第一孔和所述第二柔性层之间，并填充所述至少一个第一孔和所述第二孔 至少一个具有导电膏的第二孔，用于将第一信号线与第二信号线电耦合。