利索-全球专利检索

  1. 登录
  2. 注册

搜索结果

10 条记录 (耗时 0.023 秒)

    MULTI-LAYER MICROWAVE CORRUGATED PRINTED CIRCUIT BOARD AND METHOD
    1.
    发明申请
    MULTI-LAYER MICROWAVE CORRUGATED PRINTED CIRCUIT BOARD AND METHOD 审中-公开
    多层微波校正印刷电路板及方法

    公开(公告)号：US20110024160A1

    公开(公告)日：2011-02-03

    申请号：US12534077

    申请日：2009-07-31

    申请人： Clifton Quan ,  Hee Kyung Kim ,  Fangchou Yang ,  Kevin C. Rolston ,  Edward Marsh Jackson

    发明人： Clifton Quan ,  Hee Kyung Kim ,  Fangchou Yang ,  Kevin C. Rolston ,  Edward Marsh Jackson

    IPC分类号： H05K1/00 ,  H05K3/36

    CPC分类号： H05K1/028 ,  H05K1/024 ,  H05K1/144 ,  H05K1/147 ,  H05K3/361 ,  H05K3/4069 ,  H05K3/4614 ,  H05K3/4635 ,  H05K2201/055 ,  H05K2201/058 ,  H05K2201/09109 ,  H05K2201/09318 ,  H05K2201/10378 ,  H05K2203/063 ,  Y10T29/49126 ,  Y10T29/49155

    摘要： A multi-layer microwave corrugated printed circuit board is provided. In one embodiment, the invention relates to a method for interconnecting components of a corrugated printed circuit board, the components including a first flexible layer having a first signal line on a surface of the first flexible layer and a second flexible layer having a second signal line on a surface of the second flexible layer, the method including forming at least one first hole in the first flexible layer, forming a conductive pad on the second flexible layer, forming at least one second hole in a non-conductive adhesive layer, aligning the at least one second hole with the at least one first hole and the conductive pad, bonding the first flexible layer and the second flexible layer, with the non-conductive adhesive layer disposed there between, and filling the at least one first hole and the at least one second hole with a conductive paste to electrically couple the first signal line with the second signal line.

    摘要翻译： 提供多层微波波纹印刷电路板。 在一个实施例中，本发明涉及一种用于互连波纹印刷电路板的部件的方法，所述部件包括在第一柔性层的表面上具有第一信号线的第一柔性层和具有第二信号线的第二柔性层 在所述第二柔性层的表面上，所述方法包括在所述第一柔性层中形成至少一个第一孔，在所述第二柔性层上形成导电垫，在非导电粘合剂层中形成至少一个第二孔， 至少一个具有所述至少一个第一孔和所述导电垫的第二孔，将所述第一柔性层和所述第二柔性层结合，所述非导电粘合剂层设置在所述第一孔和所述第二柔性层之间，并填充所述至少一个第一孔和所述第二孔 至少一个具有导电膏的第二孔，用于将第一信号线与第二信号线电耦合。

    Adhesive reinforced open hole interconnect
    9.
    发明授权
    Adhesive reinforced open hole interconnect 有权
    粘合剂增强开孔互连

    公开(公告)号：US08354595B2

    公开(公告)日：2013-01-15

    申请号：US12764854

    申请日：2010-04-21

    申请人： Kevin C. Rolston ,  Alberto F. Viscarra ,  Derek Pruden ,  Cindy W. Ma

    发明人： Kevin C. Rolston ,  Alberto F. Viscarra ,  Derek Pruden ,  Cindy W. Ma

    IPC分类号： H05K1/00

    CPC分类号： H05K3/361 ,  H05K1/118 ,  H05K3/321 ,  H05K3/4635 ,  H05K2201/10666 ,  H05K2203/0455

    摘要： A method for interconnecting a first flex printed circuit board (PCB) with a second flex PCB. The method includes: providing the first flex PCB with holes at contact locations to be electrically coupled to the second flex PCB; providing the second flex PCB with electrical pads corresponding to the holes at the contact locations; applying a non-conductive material between the first PCB and the and second PCB with clearances for each of the electrical pads; aligning the first PCB with the second PCB so that the holes in the first PCB are in line with the corresponding electrical pads on the second PCB; bonding a portion of flat areas on the first and second PCBs together; dispensing a conductive adhesive into the holes to fill the space created by the holes, corresponding clearances of the non-conductive material, and the corresponding electrical pads; and curing the conductive adhesive.

    摘要翻译： 一种用于将第一柔性印刷电路板（PCB）与第二柔性PCB互连的方法。 该方法包括：在电耦合到第二柔性PCB的接触位置处提供第一柔性PCB; 向所述第二柔性PCB提供与所述接触位置处的所述孔相对应的电垫; 在第一PCB和第二PCB之间施加不导电材料，其中每个电焊盘具有间隙; 将第一PCB与第二PCB对准，使得第一PCB中的孔与第二PCB上的相应电焊盘对齐; 将第一和第二PCB上的一部分平坦区域结合在一起; 将导电粘合剂分配到孔中以填充由孔产生的空间，非导电材料的相应间隙和相应的电焊盘; 并固化导电粘合剂。

    ADHESIVE REINFORCED OPEN HOLE INTERCONNECT
    10.
    发明申请
    ADHESIVE REINFORCED OPEN HOLE INTERCONNECT 有权
    粘合加强开孔连接

    公开(公告)号：US20110261539A1

    公开(公告)日：2011-10-27

    申请号：US12764854

    申请日：2010-04-21

    申请人： Kevin C. Rolston ,  Alberto F. Viscarra ,  Derek Pruden ,  Cindy W. Ma

    发明人： Kevin C. Rolston ,  Alberto F. Viscarra ,  Derek Pruden ,  Cindy W. Ma

    IPC分类号： H05K1/00 ,  B29C65/52

    CPC分类号： H05K3/361 ,  H05K1/118 ,  H05K3/321 ,  H05K3/4635 ,  H05K2201/10666 ,  H05K2203/0455

    摘要： A method for interconnecting a first flex printed circuit board (PCB) with a second flex PCB. The method includes: providing the first flex PCB with holes at contact locations to be electrically coupled to the second flex PCB; providing the second flex PCB with electrical pads corresponding to the holes at the contact locations; applying a non-conductive material between the first PCB and the and second PCB with clearances for each of the electrical pads; aligning the first PCB with the second PCB so that the holes in the first PCB are in line with the corresponding electrical pads on the second PCB; bonding a portion of flat areas on the first and second PCBs together; dispensing a conductive adhesive into the holes to fill the space created by the holes, corresponding clearances of the non-conductive material, and the corresponding electrical pads; and curing the conductive adhesive.

    摘要翻译： 一种用于将第一柔性印刷电路板（PCB）与第二柔性PCB互连的方法。 该方法包括：在电耦合到第二柔性PCB的接触位置处提供第一柔性PCB; 向所述第二柔性PCB提供与所述接触位置处的所述孔相对应的电垫; 在第一PCB和第二PCB之间施加不导电材料，其中每个电焊盘具有间隙; 将第一PCB与第二PCB对准，使得第一PCB中的孔与第二PCB上的相应电焊盘对齐; 将第一和第二PCB上的一部分平坦区域结合在一起; 将导电粘合剂分配到孔中以填充由孔产生的空间，非导电材料的相应间隙和相应的电焊盘; 并固化导电粘合剂。