摘要:
A method for profiling the shape of a component using a line sensor (110) which is provided in a component mounter (100) and which profiles the shape of the component (200) three-dimensionally by (a) projecting a sweeping light onto the component (200) in a relative movement between the line sensor (110) and the component (200) held by a mounting head (103) so that the sweeping light traverses the direction of the movement and (b) detecting the reflected light from the component using a detector (119). The method includes getting the component (200) from the component supply unit 101 using the mounting head (103), rotating the component (200) by a predetermined angle within a predetermined surface, and profiling the shape of the rotated component using the line sensor (110).
摘要:
The present invention, which aims at providing a component mounting method and a mounter capable of correcting, with high accuracy, a mounting position of a component, includes: a mounting head (105); a recognition unit (108) including a shutter camera (111b) and instructing it to start taking an image of a component (103a) when the mounting head (105) arrives at a predetermined position; and a main control unit (160) (i) correcting a position of the component shown in the image taken by the shutter camera (111b), based on a first distance over which the mounting head (105) moves during a time period from when the instruction to start taking the image is given to when camera exposure by the shutter camera (111b) is performed, (ii) correcting the mounting position at which the mounting head (105) is to mount the component (103a), based on the corrected component position, and (iii) controlling the mounting head (105) so that it mounts the component (103a) at the corrected mounting position.
摘要:
An electronic component mounting device permits recognition of an electronic component for precise mounting. A recognizing device includes a line camera having a one-dimensional CCD array, a shutter camera having a shutter function, and a device for selecting either the line camera or the shutter camera depending on the size or shape of the electronic components. The electronic components are recognized by image data obtained by a selected one of the cameras while the electronic component is moving along a movement path of a mounting head towards a mounting location.
摘要:
It is an object of the present invention to provide a parts recognition data preparing method and a preparing device and an electronic parts mounting device and a recording medium, which are capable of preparing parts recognition data, which are set to respective electronic parts and are referred to when the electronic parts are to be recognized, precisely and quickly not to know particularly the characteristic of the recognition algorithm.In the present invention, there are provided an inputting means for inputting information of a body and electrodes of the electronic parts, a recognition algorithm selecting means for identifying a type of the electronic parts based on input information of the body and the electrodes and then selecting a recognition algorithm that is adaptive to the identified type, and a parts shape data extracting means for extracting automatically parts shape data, which are required for a recognizing process executed by the selected recognition algorithm, from the input information of the body and the electrodes, whereby parts recognition data in which recognition conditions of the electronic parts are recorded are prepared.
摘要:
A method for profiling the shape of a component using a line sensor (110) which is provided in a component mounter (100) and which profiles the shape of the component (200) 5 three-dimensionally by (a) projecting a sweeping light onto the component (200) in a relative movement between the line sensor (110) and the component (200) held by a mounting head (103) so that the sweeping light traverses the direction of the movement and (b) detecting the reflected light from the component using a detector (119). The method includes getting the component (200) from the component supply unit 101 using the mounting head (103), rotating the component (200) by a predetermined angle within a predetermined surface, and profiling the shape of the rotated component using the line sensor (110).
摘要:
In a component placement recognition mark recognizing device for recognizing recognition marks for component placement that are provided corresponding to component placement positions where components are to be placed in a plurality of partition areas on a board. The device has a recognition camera for recognizing the recognition marks straightly disposed in the plurality of areas and a moving device for running the recognition camera at a generally uniform velocity in a deposition direction in which the recognition marks are straightly disposed. The recognition marks are recognized with use of the recognition camera while the recognition camera is run by the moving device.
摘要:
The present invention, which aims at providing a component mounting method and a mounter capable of correcting, with high accuracy, a mounting position of a component, includes: a mounting head (105); a recognition unit (108) including a shutter camera (111b) and instructing it to start taking an image of a component (103a) when the mounting head (105) arrives at a predetermined position; and a main control unit (160) (i) correcting a position of the component shown in the image taken by the shutter camera (111b), based on a first distance over which the mounting head (105) moves during a time period from when the instruction to start taking the image is given to when camera exposure by the shutter camera (111b) is performed, (ii) correcting the mounting position at which the mounting head (105) is to mount the component (103a), based on the corrected component position, and (iii) controlling the mounting head (105) so that it mounts the component (103a) at the corrected mounting position.
摘要:
An image pickup camera is arranged, so that a plurality of components are adapted to be sequentially imaged by corresponding image pickup device with a timing whereby light for imaging is prevented from affecting the other image pickup operation while the components are let to pass above the image pickup camera. The hold posture of each of the plurality of components can be imaged separately without decreasing the cycle time.
摘要:
An image acquiring device for a component mounting apparatus includes a line sensor provided with photodetecting elements in one array or a plurality of arrays, and a CCD register for transmitting electric charges accumulated in the photodetecting elements to an output part. The device also includes an illumination unit having one or a plurality of light sources of a high directivity for feeding light to illuminate an electronic component. The one or plurality of light sources are arranged to condense the light to an image-acquiring line of the line sensor.
摘要:
Adjustment of image pickup conditions through alternative selection of two cameras different in resolution, adjustment of image lightness of a to-be-recognized component based on component information of the component, and performing control allows an image of the component to be picked up by either one of the cameras under the image pickup conditions.