摘要:
It is an object of the present invention to provide a parts recognition data preparing method and a preparing device and an electronic parts mounting device and a recording medium, which are capable of preparing parts recognition data, which are set to respective electronic parts and are referred to when the electronic parts are to be recognized, precisely and quickly not to know particularly the characteristic of the recognition algorithm.In the present invention, there are provided an inputting means for inputting information of a body and electrodes of the electronic parts, a recognition algorithm selecting means for identifying a type of the electronic parts based on input information of the body and the electrodes and then selecting a recognition algorithm that is adaptive to the identified type, and a parts shape data extracting means for extracting automatically parts shape data, which are required for a recognizing process executed by the selected recognition algorithm, from the input information of the body and the electrodes, whereby parts recognition data in which recognition conditions of the electronic parts are recorded are prepared.
摘要:
In an electronic component installation device for manufacturing an electronic circuit substrate, wherein components are picked up from a parts supply device and placed on a circuit substrate, the height of the installing surface s of an electronic component 10 from a reference surface is detected with the use of a three-dimensional imaging device 2, and the distance the suction nozzle 9 of the mounting head 1 is lowered is accurately determined with respect to each of electronic components that vary in thickness.
摘要:
A method for profiling the shape of a component using a line sensor (110) which is provided in a component mounter (100) and which profiles the shape of the component (200) three-dimensionally by (a) projecting a sweeping light onto the component (200) in a relative movement between the line sensor (110) and the component (200) held by a mounting head (103) so that the sweeping light traverses the direction of the movement and (b) detecting the reflected light from the component using a detector (119). The method includes getting the component (200) from the component supply unit 101 using the mounting head (103), rotating the component (200) by a predetermined angle within a predetermined surface, and profiling the shape of the rotated component using the line sensor (110).
摘要:
A method for profiling the shape of a component using a line sensor (110) which is provided in a component mounter (100) and which profiles the shape of the component (200) 5 three-dimensionally by (a) projecting a sweeping light onto the component (200) in a relative movement between the line sensor (110) and the component (200) held by a mounting head (103) so that the sweeping light traverses the direction of the movement and (b) detecting the reflected light from the component using a detector (119). The method includes getting the component (200) from the component supply unit 101 using the mounting head (103), rotating the component (200) by a predetermined angle within a predetermined surface, and profiling the shape of the rotated component using the line sensor (110).
摘要:
The front end position of the leads of a leaded part can be accurately detected even from image data having a noise signal mixed therein. A method including a step for defining, with respect to an electronic part having a plurality of leads to be packaged on a board by an electronic parts packaging plant, a two-dimensional test window having a rectangular coordinate system with the X-axis extending parallel with the direction in which the leads are juxtaposed and the Y-axis perpendicular to the X-axis; a lead emphasizing step for emphasizing the light intensity of the lead regions of image data obtained by photographing the electronic part in the test window; a data producing step for producing one-dimensional histogram data which indicates the distribution of light intensity along the Y-axis on the basis of the image data after having the light intensity of its lead regions emphasized; and a positioning step for calculating the Y-coordinate of the lead position in the test window on the basis of the histogram data thereon.
摘要:
It is intended to accurately detect the centerline or center of electronic component by relieving effects of brightness or darkness or the like caused by the shape or color of the component, irregularity on the surface or how illuminance is projected on the component through statistical processing. To this end, the present invention comprises a first step for determining edge points of opposing sides of said component, a second step for determining two-dimensional coordinate axes which are established to make a deflection angle of said component zero, a third step for projecting the center position of two edge points in total each of which is arbitrarily selected from each side to a coordinate axis of said two-dimensional coordinate axes orthogonal to said opposing sides, and creating a histogram on said coordinate axis by projecting and adding the positions of center repeatedly obtained onto said coordinate axis, and a fourth step for detecting the peak position of the histogram obtained from the result of processing of said third step, and determining a line passing through the peak position and parallel to said opposing sides as the centerline of component.
摘要:
An apparatus has a holder that receives a component from a component supply and then places the component on a substrate. In operation, it is determined whether the holder would make an interference with another component already mounted on the substrate. If this judgement is affirmative, mounting of the component held by the holder is prohibited. If, on the other hand, this judgement is negative, the component held by the holder is mounted onto the substrate.
摘要:
It is intended to accurately detect the centerline or center of electronic component by relieving effects of brightness or darkness or the like caused by the shape or color of the component, irregularity on the surface or how illuminance is projected on the component through statistical processing. To this end, the present invention comprises a first step for determining edge points of opposing sides of said component, a second step for determining two-dimensional coordinate axes which are established to make a deflection angle of said component zero, a third step for projecting the center position of two edge points in total each of which is arbitrarily selected from each side to a coordinate axis of said two-dimensional coordinate axes orthogonal to said opposing sides, and creating a histogram on said coordinate axis by projecting and adding the positions of center repeatedly obtained onto said coordinate axis, and a fourth step for detecting the peak position of the histogram obtained from the result of processing of said third step, and determining a line passing through the peak position and parallel to said opposing sides as the centerline of component.
摘要:
An illumination apparatus includes a through-hole for detection formed at a center portion, and irradiates diffused light and directional light to an object to be detected. The apparatus includes an annular diffusion plate which diffuses light, a light source disposed annularly, and an annular reflection plate which reflects light from the light source to the side of said object to be detected. The diffusion plate, light source, and reflection plate are disposed in the order from the side of said object to be detected. The diffused light is generated by irradiating light from said light source to the object to be detected through said diffusion plate. Light from said light source is reflected by said reflection plate and then irradiated to the object to be detected.
摘要:
An apparatus has a holder that receives a component from a component supply and then places the component on a substrate. In operation, it is determined whether the holder would make an interference with another component already mounted on the substrate. If this judgement is affirmative, mounting of the component held by the holder is prohibited. If, on the other hand, this judgement is negative, the component held by the holder is mounted onto the substrate.