公开(公告)号：US08278767B2

公开(公告)日：2012-10-02

申请号：US13000390

申请日：2009-08-04

申请人： Ewald K. M. Günther ,  Siegfried Herrmann ,  Ulrich Zehnder ,  Herbert Brunner

发明人： Ewald K. M. Günther ,  Siegfried Herrmann ,  Ulrich Zehnder ,  Herbert Brunner

IPC分类号： H01L23/52 ,  H01L23/48 ,  H01L29/40

CPC分类号： H01L33/62 ,  H01L25/0753 ,  H01L25/167 ,  H01L33/486 ,  H01L33/645 ,  H01L2924/0002 ,  H05B33/0803 ,  H01L2924/00

摘要： An optoelectronic component includes a carrier with a mounting side and having at least one functional element, at least one substrateless optoelectronic semiconductor chip with a top and an opposed bottom and is electrically conductive by way of the top and the bottom, wherein the bottom faces the mounting side and the semiconductor chip is mounted on the mounting side, and at least one structured electrical contact film located on the top.

摘要翻译： 光电子部件包括具有安装侧并具有至少一个功能元件的载体，至少一个具有顶部和相对底部的无基底光电半导体芯片，并且通过顶部和底部导电，其中底部面向 安装侧，半导体芯片安装在安装侧，并且至少一个结构化电接触膜位于顶部。

公开(公告)号：US08916403B2

公开(公告)日：2014-12-23

申请号：US13580491

申请日：2011-02-03

申请人： Ewald K. M. Günther ,  Mathias Kämpf ,  Jens Dennemarck ,  Nikolaus Gmeinwieser

发明人： Ewald K. M. Günther ,  Mathias Kämpf ,  Jens Dennemarck ,  Nikolaus Gmeinwieser

IPC分类号： H01L21/00 ,  H01L33/08 ,  H01L27/15 ,  H01L21/78 ,  B28D5/00

CPC分类号： H01L27/153 ,  B28D5/0011 ,  H01L21/78

摘要： A method for producing a plurality of optoelectronic semiconductor chips includes providing a carrier wafer having a first surface and a second surface opposite the first surface, wherein a plurality of individual component layer sequences spaced apart from one another in a lateral direction are applied on the first surface, the component layer sequences being separated from one another by separation trenches; introducing at least one crystal imperfection in at least one region of the carrier wafer which at least partly overlaps a separation trench in a vertical direction; singulating the carrier wafer along the at least one crystal imperfection into individual semiconductor chips.

摘要翻译： 一种制造多个光电子半导体芯片的方法包括提供具有第一表面和与第一表面相对的第二表面的载体晶片，其中在横向上彼此间隔开的多个单独的部件层序列被施加在第一 表面，组分层序列通过分离沟槽彼此分离; 在载体晶片的至少一个区域中引入至少一个在垂直方向上至少部分地与分离沟槽重叠的晶体缺陷; 将载体晶片沿着至少一个晶体缺陷分离成单独的半导体芯片。

公开(公告)号：US20130069086A1

公开(公告)日：2013-03-21

申请号：US13580491

申请日：2011-02-03

申请人： Ewald K. M. Günther ,  Mathias Kämpf ,  Jens Dennemarck ,  Nikolaus Gmeinwieser

发明人： Ewald K. M. Günther ,  Mathias Kämpf ,  Jens Dennemarck ,  Nikolaus Gmeinwieser

IPC分类号： H01L33/08

CPC分类号： H01L27/153 ,  B28D5/0011 ,  H01L21/78

摘要： A method for producing a plurality of optoelectronic semiconductor chips includes providing a carrier wafer having a first surface and a second surface opposite the first surface. wherein a plurality of individual component layer sequences spaced apart from one another in a lateral direction are applied on the first surface, the component layer sequences being separated from one another by separation trenches; introducing at least one crystal imperfection in at least one region of the carrier wafer which at least partly overlaps a separation trench in a vertical direction; singulating the carrier wafer along the at least one crystal imperfection into individual semiconductor.

摘要翻译： 一种制造多个光电子半导体芯片的方法包括提供具有第一表面和与第一表面相对的第二表面的载体晶片。 其中在横向上彼此间隔开的多个单独组分层序列施加在第一表面上，组分层序列通过分离沟槽彼此分离; 在载体晶片的至少一个区域中引入至少一个在垂直方向上至少部分地与分离沟槽重叠的晶体缺陷; 将载体晶片沿着至少一个晶体缺陷分离成单个半导体。