公开(公告)号：US08278767B2

公开(公告)日：2012-10-02

申请号：US13000390

申请日：2009-08-04

申请人： Ewald K. M. Günther ,  Siegfried Herrmann ,  Ulrich Zehnder ,  Herbert Brunner

发明人： Ewald K. M. Günther ,  Siegfried Herrmann ,  Ulrich Zehnder ,  Herbert Brunner

IPC分类号： H01L23/52 ,  H01L23/48 ,  H01L29/40

CPC分类号： H01L33/62 ,  H01L25/0753 ,  H01L25/167 ,  H01L33/486 ,  H01L33/645 ,  H01L2924/0002 ,  H05B33/0803 ,  H01L2924/00

摘要： An optoelectronic component includes a carrier with a mounting side and having at least one functional element, at least one substrateless optoelectronic semiconductor chip with a top and an opposed bottom and is electrically conductive by way of the top and the bottom, wherein the bottom faces the mounting side and the semiconductor chip is mounted on the mounting side, and at least one structured electrical contact film located on the top.

摘要翻译： 光电子部件包括具有安装侧并具有至少一个功能元件的载体，至少一个具有顶部和相对底部的无基底光电半导体芯片，并且通过顶部和底部导电，其中底部面向 安装侧，半导体芯片安装在安装侧，并且至少一个结构化电接触膜位于顶部。

公开(公告)号：US20110140284A1

公开(公告)日：2011-06-16

申请号：US13000390

申请日：2009-08-04

申请人： Ewald K.M. Günther ,  Siegfried Herrmann ,  Ulrich Zehnder ,  Herbert Brunner

发明人： Ewald K.M. Günther ,  Siegfried Herrmann ,  Ulrich Zehnder ,  Herbert Brunner

IPC分类号： H01L23/52

CPC分类号： H01L33/62 ,  H01L25/0753 ,  H01L25/167 ,  H01L33/486 ,  H01L33/645 ,  H01L2924/0002 ,  H05B33/0803 ,  H01L2924/00

摘要： An optoelectronic component includes a carrier with a mounting side and having at least one functional element, at least one substrateless optoelectronic semiconductor chip with a top and an opposed bottom and is electrically conductive by way of the top and the bottom, wherein the bottom faces the mounting side and the semiconductor chip is mounted on the mounting side, and at least one structured electrical contact film located on the top.

摘要翻译： 光电子部件包括具有安装侧并具有至少一个功能元件的载体，至少一个具有顶部和相对底部的无基底光电半导体芯片，并且通过顶部和底部导电，其中底部面向 安装侧，半导体芯片安装在安装侧，并且至少一个结构化电接触膜位于顶部。

公开(公告)号：US20120248492A1

公开(公告)日：2012-10-04

申请号：US13499622

申请日：2010-08-31

申请人： Klaus Müller ,  Günter Spath ,  Siegfried Herrmann ,  Ewald Karl Michael Günther ,  Herbert Brunner

发明人： Klaus Müller ,  Günter Spath ,  Siegfried Herrmann ,  Ewald Karl Michael Günther ,  Herbert Brunner

IPC分类号： H01L33/62 ,  H01L33/52 ,  H01L31/18 ,  H01L31/0203

CPC分类号： H01L31/0224 ,  H01L25/0753 ,  H01L25/167 ,  H01L33/0079 ,  H01L33/486 ,  H01L33/54 ,  H01L33/62 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48471 ,  H01L2924/00014 ,  H01L2924/181 ,  H01L2924/00012 ,  H01L2224/4554

摘要： The invention relates to an optoelectronic component, having —a carrier (1) comprising a first main surface (Ia), —at least one optoelectronic semiconductor chip (2) having no substrate, and —a contact metallization (3a, 3b), wherein —the carrier (1) is electrically insulating, —the at least one optoelectronic semiconductor chip (2) is fastened to the first main surface (Ia) of the carrier (1) by means of a bonding material (4), particularly a solder material, —the contact metallization (3a, 3b) covers at least one area of the first main surface (Ia) free of the optoelectronic semiconductor chip (2), and —the contact metallization (3a, 3b) is electrically conductively connected to the optoelectronic semiconductor chip (2).

摘要翻译： 本发明涉及一种具有载体（1）的光电子部件，载体（1）包括第一主表面（Ia）， - 至少一个不具有基板的光电子半导体芯片（2）和 - 接触金属化（3a，3b），其中 - 载体（1）是电绝缘的， - 至少一个光电子半导体芯片（2）通过接合材料（4）紧固到载体（1）的第一主表面（1a），特别是焊料 材料， - 接触金属化（3a，3b）覆盖不含光电子半导体芯片（2）的第一主表面（1a）的至少一个区域，并且接触金属化层（3a，3b）导电地连接到 光电半导体芯片（2）。

公开(公告)号：US08853732B2

公开(公告)日：2014-10-07

申请号：US13499622

申请日：2010-08-31

申请人： Klaus Müller ,  Günter Spath ,  Siegfried Herrmann ,  Ewald Karl Michael Günther ,  Herbert Brunner

发明人： Klaus Müller ,  Günter Spath ,  Siegfried Herrmann ,  Ewald Karl Michael Günther ,  Herbert Brunner

IPC分类号： H01L33/62 ,  H01L31/0224

CPC分类号： H01L31/0224 ,  H01L25/0753 ,  H01L25/167 ,  H01L33/0079 ,  H01L33/486 ,  H01L33/54 ,  H01L33/62 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48471 ,  H01L2924/00014 ,  H01L2924/181 ,  H01L2924/00012 ,  H01L2224/4554

摘要： The invention relates to an optoelectronic component, having —a carrier (1) comprising a first main surface (Ia), —at least one optoelectronic semiconductor chip (2) having no substrate, and —a contact metallization (3a, 3b), wherein —the carrier (1) is electrically insulating, —the at least one optoelectronic semiconductor chip (2) is fastened to the first main surface (Ia) of the carrier (1) by means of a bonding material (4), particularly a solder material, —the contact metallization (3a, 3b) covers at least one area of the first main surface (Ia) free of the optoelectronic semiconductor chip (2), and —the contact metallization (3a, 3b) is electrically conductively connected to the optoelectronic semiconductor chip (2).

摘要翻译： 本发明涉及一种具有载体（1）的光电子部件，载体（1）包括第一主表面（Ia）， - 至少一个不具有基板的光电子半导体芯片（2）和 - 接触金属化（3a，3b），其中 - 载体（1）是电绝缘的， - 至少一个光电子半导体芯片（2）通过接合材料（4）紧固到载体（1）的第一主表面（1a），特别是焊料 材料， - 接触金属化（3a，3b）覆盖不含光电子半导体芯片（2）的第一主表面（1a）的至少一个区域，并且接触金属化层（3a，3b）导电地连接到 光电半导体芯片（2）。

公开(公告)号：US20140034983A1

公开(公告)日：2014-02-06

申请号：US13982225

申请日：2011-12-21

申请人： Tobias Gebuhr ,  Hans-Christoph Gallmeier ,  Herbert Brunner ,  Kirstin Petersen

发明人： Tobias Gebuhr ,  Hans-Christoph Gallmeier ,  Herbert Brunner ,  Kirstin Petersen

IPC分类号： H01L33/60 ,  H01L33/50

CPC分类号： H01L33/60 ,  H01L33/50 ,  H01L33/54 ,  H01L33/56 ,  H01L33/62 ,  H01L2224/24 ,  H01L2933/005 ,  H01L2933/0066

摘要： A method for manufacturing at least one optoelectronic semiconductor device includes providing a substrate and applying a number of optoelectronic semiconductor chips, which are arranged spaced apart from one another in a lateral direction, on an upper face of the substrate. At least one reflective coating is applied to the exposed areas of the substrate and the lateral surfaces of the optoelectronic semiconductor chips. Openings are introduced into the reflective coating, which completely penetrate the reflective coating. Electrically conductive material is arranged on the reflective coating and at least on some parts of the openings. Radiation penetration surfaces of the optoelectronic semiconductor chips are free of the reflective coating and the reflective coating does not laterally extend beyond the optoelectronic semiconductor chips.

摘要翻译： 一种用于制造至少一个光电子半导体器件的方法包括：在衬底的上表面上提供衬底和施加多个在横向彼此间隔开的光电子半导体芯片。 至少一个反射涂层施加到基板的暴露区域和光电子半导体芯片的侧表面。 开口被引入到完全穿透反射涂层的反射涂层中。 导电材料布置在反射涂层上并且至少在开口的某些部分上。 光电子半导体芯片的辐射穿透表面没有反射涂层，反射涂层不横向延伸超过光电子半导体芯片。

公开(公告)号：US08435806B2

公开(公告)日：2013-05-07

申请号：US12595887

申请日：2008-04-14

申请人： Harald Jaeger ,  Herbert Brunner ,  Albert Schneider ,  Thomas Zeiler

发明人： Harald Jaeger ,  Herbert Brunner ,  Albert Schneider ,  Thomas Zeiler

IPC分类号： H01L21/00

CPC分类号： B29C45/14655 ,  B29C33/0038 ,  B29C33/10 ,  B29C43/18 ,  B29C2045/14098 ,  B29C2045/14663 ,  B29C2045/14934 ,  B29K2083/00 ,  H01L21/565 ,  H01L24/97 ,  H01L33/52 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/97 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/0102 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01058 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/09701 ,  H01L2924/12041 ,  H01L2924/15747 ,  H01L2924/15787 ,  H01L2924/181 ,  H01L2224/85 ,  H01L2924/00014 ,  H01L2924/00

摘要： A method is disclosed for the manufacture of an optoelectronic component. A substrate has a first primary face and a second primary face that lies opposite the first primary face. A semiconductor body that is capable of emitting electromagnetic radiation from a front side is attached to the first primary face of the substrate. A covering that is transparent to the radiation from the optoelectronic semiconductor body is applied to at least the front side of the semiconductor body. The covering is given the form of an optical element by using a closed cavity that is shaped with the contour of the optical element.

摘要翻译： 公开了用于制造光电子部件的方法。 基板具有与第一主面相对的第一主面和第二主面。 能够从前侧发射电磁辐射的半导体本体被安装在基板的第一主面上。 至少对半导体本体的前侧施加对来自光电半导体本体的辐射透明的覆盖物。 通过使用与光学元件的轮廓成形的封闭空腔，将覆盖物赋予光学元件的形式。

公开(公告)号：US20110266571A1

公开(公告)日：2011-11-03

申请号：US12995181

申请日：2009-04-20

申请人： Thomas Zeiler ,  Reiner Windisch ,  Stefan Gruber ,  Markus Kirsch ,  Julius Muschaweck ,  Torsten Baade ,  Herbert Brunner ,  Steffen Köhler

发明人： Thomas Zeiler ,  Reiner Windisch ,  Stefan Gruber ,  Markus Kirsch ,  Julius Muschaweck ,  Torsten Baade ,  Herbert Brunner ,  Steffen Köhler

IPC分类号： H01L33/58 ,  H01L31/0232

CPC分类号： H01L33/54 ,  H01L25/042 ,  H01L25/0753 ,  H01L33/38 ,  H01L33/58 ,  H01L33/60 ,  H01L33/62 ,  H01L2224/48091 ,  H01L2924/00

摘要： According to at least one embodiment of the semiconductor arrangement, the latter comprises a mounting side, at least one optoelectronic semiconductor chip with mutually opposing chip top and bottom, and at least one at least partially radiation-transmissive body with a body bottom, on which the semiconductor chip is mounted such that the chip top faces the body bottom. Moreover, the semiconductor arrangement comprises at least two electrical connection points for electrical contacting of the optoelectronic semiconductor chip, wherein the connection points do not project laterally beyond the body and with their side remote from the semiconductor chip delimit the semiconductor arrangement on the mounting side thereof.

摘要翻译： 根据半导体布置的至少一个实施例，后者包括安装侧，至少一个具有相对的芯片顶部和底部的光电子半导体芯片以及至少一个具有主体底部的至少部分辐射透射主体， 安装半导体芯片使得芯片顶部面向主体底部。 此外，半导体装置包括用于光电子半导体芯片的电接触的至少两个电连接点，其中连接点不侧向突出超过本体并且其远离半导体芯片的一侧限定其安装侧上的半导体布置 。

公开(公告)号：US20110143627A1

公开(公告)日：2011-06-16

申请号：US13033370

申请日：2011-02-23

申请人： Daniel BECKER ,  Herbert Brunner ,  Tim Fiedler ,  Jörg Strauß ,  Martin Zachau

发明人： Daniel BECKER ,  Herbert Brunner ,  Tim Fiedler ,  Jörg Strauß ,  Martin Zachau

IPC分类号： H01J9/22

CPC分类号： H01L33/505 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2924/00014

摘要： A luminescence conversion LED having a radiation emitting chip that is connected to electrical connections and is surrounded by a housing that comprises at least a basic body and a cap, the chip being seated on the basic body, in particular in a cutout of the basic body, and the primary radiation of the chip being converted at least partially into longer wave radiation by a conversion element, wherein the cap is formed by a vitreous body, the conversion means being contained in the vitreous body, the refractive index of the vitreous body being higher than 1.6, preferably at least n=1.7.

摘要翻译： 一种发光转换LED，其具有连接到电连接的辐射发射芯片，并且被包括至少包括基体和盖的壳体包围，所述芯片位于基体上，特别是在基体的切口中 并且所述芯片的主要辐射通过转换元件至少部分地转换成更长的波长辐射，其中所述盖由玻璃体形成，所述转换装置包含在所述玻璃体中，所述玻璃体的折射率为 高于1.6，优选至少n = 1.7。

公开(公告)号：US20110141716A1

公开(公告)日：2011-06-16

申请号：US12865850

申请日：2009-01-16

申请人： Burkard Wiesmann ,  Markus Zeiler ,  Herbert Brunner ,  Hubert Ott ,  Ludwig Ploetz ,  Joerg Strauss

发明人： Burkard Wiesmann ,  Markus Zeiler ,  Herbert Brunner ,  Hubert Ott ,  Ludwig Ploetz ,  Joerg Strauss

IPC分类号： G09F13/04

CPC分类号： G02F1/133603 ,  G02F2001/133614 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/00

摘要： An illumination device (1) for backlighting a display is disclosed. The illumination device comprises: at least one semiconductor body (3), suitable for generating electromagnetic radiation of a first wavelength range, a first wavelength conversion substance (30), which is disposed downstream of the radiation-emitting front side (6) of the semiconductor body (3) in the emission direction (8) thereof and is suitable for converting radiation of the first wavelength range into radiation of a second wavelength range, which is different from the first wavelength range, and a second wavelength conversion substance (31), which is disposed downstream of the radiation-emitting front side (6) of the semiconductor body (3) in the emission direction (8) thereof and is suitable for converting radiation of the first wavelength range into radiation of a third wavelength range, which is different from the first and second wavelength ranges. A display comprising such an illumination device (1) is furthermore described.

摘要翻译： 公开了一种用于背光显示器的照明装置（1）。 所述照明装置包括：适于产生第一波长范围的电磁辐射的至少一个半导体本体（3），设置在所述第一波长范围的辐射发射正面（6）的下游的第一波长转换物质（30） 半导体体（3）的发射方向（8），适于将第一波长范围的辐射转换成与第一波长范围不同的第二波长范围的辐射，以及第二波长转换物质（31） ，其设置在半导体本体（3）的发射方向（8）的辐射发射正面（6）的下游，并且适于将第一波长范围的辐射转换成第三波长范围的辐射，其中 与第一和第二波长范围不同。 此外还描述包括这种照明装置（1）的显示器。

公开(公告)号：US07838357B2

公开(公告)日：2010-11-23

申请号：US10494160

申请日：2002-10-28

申请人： Georg Bogner ,  Herbert Brunner ,  Gertrud Kräuter ,  Gunter Waitl

发明人： Georg Bogner ,  Herbert Brunner ,  Gertrud Kräuter ,  Gunter Waitl

IPC分类号： H01L218/8238

CPC分类号： H01L33/486 ,  H01L33/483 ,  H01L33/60 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2924/00014

摘要： Optoelectronic component, having a housing body (2), an optoelectronic semiconductor chip (3) arranged in a recess (6) of the housing body, and having electrical terminals (1A, 1B), the semiconductor chip being electrically conductively connected to the electrical terminals of the leadframe. The housing body (2) is formed from an encapsulation material, with a filler which has a high degree of reflection in a wavelength range from the UV range.

摘要翻译： 具有壳体（2），布置在壳体主体的凹部（6）中的光电子半导体芯片（3），并具有电端子（1A，1B）的光电子部件，该半导体芯片导电地连接到电气 引线框的端子。 壳体（2）由封装材料形成，其具有在从UV范围的波长范围内具有高反射度的填料。