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    Compositions and methods for thermosetting molecules in organic compositions
    2.
    发明授权
    Compositions and methods for thermosetting molecules in organic compositions 失效
    有机组合物中热固性分子的组成和方法

    公开(公告)号：US06803441B2

    公开(公告)日：2004-10-12

    申请号：US10267380

    申请日：2002-10-08

    申请人： Kreisler Lau ,  Feng Quan Liu ,  Boris Korolev ,  Emma Brouk ,  Ruslan Zherebin ,  David Nalewajek

    发明人： Kreisler Lau ,  Feng Quan Liu ,  Boris Korolev ,  Emma Brouk ,  Ruslan Zherebin ,  David Nalewajek

    IPC分类号： C08G6378

    CPC分类号： C08G61/12 ,  C08G61/02 ,  C08G2650/60

    摘要： In a method of producing a low dielectric constant polymer, a thermosetting monomer is provided, wherein the thermosetting monomer has a cage compound or aryl core structure, and a plurality of arms that are covalently bound to the cage compound or core structure. In a subsequent step, the thermosetting monomer is incorporated into a polymer to form the low dielectric constant polymer, wherein the incorporation into the polymer comprises a chemical reaction of a triple bond that is located in at least one of the arms. Contemplated cage compounds and core structures include adamantane, diamantane, silicon, a phenyl group and a sexiphenylene group, while preferred arms include an arylene, a branched arylene, and an arylene ether. The thermosetting monomers may advantageously be employed to produce low-k dielectric material in electronic devices, and the dielectric constant of the polymer can be controlled by varying the overall length of the arms.

    摘要翻译： 在制造低介电常数聚合物的方法中，提供了一种热固性单体，其中该热固性单体具有笼形化合物或芳基核心结构，以及共价结合笼形化合物或核心结构的多个臂。 在随后的步骤中，将热固性单体引入聚合物中以形成低介电常数聚合物，其中掺入聚合物中包含位于至少一个臂中的三键的化学反应。 考虑的笼状化合物和核心结构包括金刚烷，二金刚烷，硅，苯基和亚噻吩基，而优选的臂包括亚芳基，支链亚芳基和亚芳基醚。 热固性单体可以有利地用于在电子器件中产生低k介电材料，并且聚合物的介电常数可以通过改变臂的整个长度来控制。

    Compositions and methods for thermosetting molecules in organic compositions
    4.
    发明授权
    Compositions and methods for thermosetting molecules in organic compositions 失效
    有机组合物中热固性分子的组成和方法

    公开(公告)号：US07049386B2

    公开(公告)日：2006-05-23

    申请号：US10176335

    申请日：2002-06-19

    申请人： Kreisler S. Lau ,  Feng Quan Liu ,  Boris A. Korolev ,  Emma Brouk ,  Ruslan Zherebin ,  David Nalewajek

    发明人： Kreisler S. Lau ,  Feng Quan Liu ,  Boris A. Korolev ,  Emma Brouk ,  Ruslan Zherebin ,  David Nalewajek

    IPC分类号： C08G63/78

    CPC分类号： C08G61/02 ,  C08G61/12 ,  C08G65/40 ,  C08G2650/60

    摘要： In a method of producing a low dielectric constant polymer, a thermosetting monomer is provided, wherein the thermosetting monomer has a cage compound or aryl core structure, and a plurality of arms that are covalently bound to the cage compound or core structure. In a subsequent step, the thermosetting monomer is incorporated into a polymer to form the low dielectric constant polymer, wherein the incorporation into the polymer comprises a chemical reaction of a triple bond that is located in at least one of the arms. Contemplated cage compounds and core structures include adamantane, diamantane, silicon, a phenyl group and a sexiphenylene group, while preferred arms include an arlyene, a branched arylene, and an arylene ether. The thermosetting monomers may advantageously be employed to produce low-k dielectric material in electronic devices, and the dielectric constant of the polymer can be controlled by varying the overall length of the arms.

    摘要翻译： 在制造低介电常数聚合物的方法中，提供了一种热固性单体，其中该热固性单体具有笼形化合物或芳基核心结构，以及共价结合笼形化合物或核心结构的多个臂。 在随后的步骤中，将热固性单体引入聚合物中以形成低介电常数聚合物，其中掺入聚合物中包含位于至少一个臂中的三键的化学反应。 沉积的笼状化合物和核心结构包括金刚烷，金刚烷，硅，苯基和亚噻吩基，而优选的臂包括芳烯，支链亚芳基和亚芳基醚。 热固性单体可以有利地用于在电子器件中产生低k介电材料，并且聚合物的介电常数可以通过改变臂的整个长度来控制。

    Low dielectric constant materials with polymeric networks
    5.
    发明授权
    Low dielectric constant materials with polymeric networks 失效
    低介电常数材料与聚合网络

    公开(公告)号：US06713590B2

    公开(公告)日：2004-03-30

    申请号：US10004584

    申请日：2001-12-03

    申请人： Kreisler S. Lau ,  Feng Quan Liu ,  Boris Korolev ,  Emma Brouk ,  Ruslan Zherebin ,  David Nalewajek

    发明人： Kreisler S. Lau ,  Feng Quan Liu ,  Boris Korolev ,  Emma Brouk ,  Ruslan Zherebin ,  David Nalewajek

    IPC分类号： C08G802

    CPC分类号： C08G69/48 ,  C08G61/02 ,  C08G61/12 ,  C08G65/4012 ,  C08G2650/20 ,  C08G2650/60 ,  C08L2312/00

    摘要： A low dielectric constant material has a polymeric network that is fabricated from a first and a second component. The first component comprises a polymeric strand, and the second component comprises a molecule having a central portion with at least three arms extending from the central portion, wherein each of the arms includes a backbone with a reactive group. The first component and the second component form the polymeric network in a reaction that involves at least one of the reactive groups when the first and second components are thermally activated. Contemplated low dielectric constant materials are advantageously employed in the fabrication of electronic devices, and particularly contemplated devices include integrated circuits.

    摘要翻译： 低介电常数材料具有由第一和第二组分制成的聚合物网络。 第一组分包含聚合物链，并且第二组分包含具有至少三个从中心部分延伸的臂的中心部分的分子，其中每个臂包括具有反应性基团的主链。 当第一和第二组分被热活化时，第一组分和第二组分在涉及至少一个反应性基团的反应中形成聚合物网络。 考虑的低介电常数材料有利地用于制造电子器件，并且特别预期的器件包括集成电路。

    Low dielectric constant materials and methods of preparation thereof
    6.
    发明授权
    Low dielectric constant materials and methods of preparation thereof 有权
    低介电常数材料及其制备方法

    公开(公告)号：US07307137B2

    公开(公告)日：2007-12-11

    申请号：US10466651

    申请日：2001-10-18

    申请人： Kreisler Lau ,  Feng Quan Liu ,  Paul Apen ,  Boris Korolev ,  Emma Brouk ,  Ruslan Zherebin ,  David Nalewajek ,  Roger Leung

    发明人： Kreisler Lau ,  Feng Quan Liu ,  Paul Apen ,  Boris Korolev ,  Emma Brouk ,  Ruslan Zherebin ,  David Nalewajek ,  Roger Leung

    IPC分类号： C08G63/78

    CPC分类号： C08G61/12 ,  C07C13/615 ,  C07C13/64 ,  C07C15/54 ,  C07C17/10 ,  C07C17/269 ,  C07C2603/74 ,  C07C2603/90 ,  C07F7/0805 ,  C08F238/00 ,  C08G61/02 ,  H01L2924/0002 ,  C07C23/46 ,  C07C25/22 ,  H01L2924/00

    摘要： The present invention is directed to low dielectric polymers and to methods of producing these low dielectric constant polymers, dielectric materials and layers, and electronic components. In one aspect of the present invention, an isomeric mixture of thermosetting monomers, wherein the monomers have a core structure and a plurality of arms, is provided, and the isomeric mixture of thermosetting monomers is polymerized, wherein polymerization comprises a reaction of an ethynyl group that is located in at least one arm of a monomer. In yet another aspect of the inventive subject matter, spin-on low dielectric constant materials are formed having a first backbone with an aromatic moiety and a first reactive group, and a second backbone with an aromatic moiety and a second reactive group, wherein the first and second backbone are crosslinked via the first and second reactive groups in a crosslinking reaction preferably without an additional crosslinker, and wherein a cage structure having at least eight (8) atoms is covalently bound to at least one of the first and second backbone.

    摘要翻译： 本发明涉及低介电聚合物以及生产这些低介电常数聚合物，介电材料和层以及电子元件的方法。 在本发明的一个方面，提供其中单体具有核心结构和多个臂的热固性单体的异构体混合物，并且热固性单体的异构体混合物聚合，其中聚合包括乙炔基 其位于单体的至少一个臂中。 在本发明主题的另一方面，形成旋涂低介电常数材料，其具有具有芳族部分和第一反应性基团的第一主链和具有芳族部分和第二反应性基团的第二主链，其中第一 并且第二主链在交联反应中通过第一和第二反应性基团交联，优选不含另外的交联剂，并且其中具有至少八个（8）原子的笼结构共价结合至第一和第二主链中的至少一个。