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    Low dielectric constant materials and methods of preparation thereof
    3.
    发明授权
    Low dielectric constant materials and methods of preparation thereof 有权
    低介电常数材料及其制备方法

    公开(公告)号：US07307137B2

    公开(公告)日：2007-12-11

    申请号：US10466651

    申请日：2001-10-18

    申请人： Kreisler Lau ,  Feng Quan Liu ,  Paul Apen ,  Boris Korolev ,  Emma Brouk ,  Ruslan Zherebin ,  David Nalewajek ,  Roger Leung

    发明人： Kreisler Lau ,  Feng Quan Liu ,  Paul Apen ,  Boris Korolev ,  Emma Brouk ,  Ruslan Zherebin ,  David Nalewajek ,  Roger Leung

    IPC分类号： C08G63/78

    CPC分类号： C08G61/12 ,  C07C13/615 ,  C07C13/64 ,  C07C15/54 ,  C07C17/10 ,  C07C17/269 ,  C07C2603/74 ,  C07C2603/90 ,  C07F7/0805 ,  C08F238/00 ,  C08G61/02 ,  H01L2924/0002 ,  C07C23/46 ,  C07C25/22 ,  H01L2924/00

    摘要： The present invention is directed to low dielectric polymers and to methods of producing these low dielectric constant polymers, dielectric materials and layers, and electronic components. In one aspect of the present invention, an isomeric mixture of thermosetting monomers, wherein the monomers have a core structure and a plurality of arms, is provided, and the isomeric mixture of thermosetting monomers is polymerized, wherein polymerization comprises a reaction of an ethynyl group that is located in at least one arm of a monomer. In yet another aspect of the inventive subject matter, spin-on low dielectric constant materials are formed having a first backbone with an aromatic moiety and a first reactive group, and a second backbone with an aromatic moiety and a second reactive group, wherein the first and second backbone are crosslinked via the first and second reactive groups in a crosslinking reaction preferably without an additional crosslinker, and wherein a cage structure having at least eight (8) atoms is covalently bound to at least one of the first and second backbone.

    摘要翻译： 本发明涉及低介电聚合物以及生产这些低介电常数聚合物，介电材料和层以及电子元件的方法。 在本发明的一个方面，提供其中单体具有核心结构和多个臂的热固性单体的异构体混合物，并且热固性单体的异构体混合物聚合，其中聚合包括乙炔基 其位于单体的至少一个臂中。 在本发明主题的另一方面，形成旋涂低介电常数材料，其具有具有芳族部分和第一反应性基团的第一主链和具有芳族部分和第二反应性基团的第二主链，其中第一 并且第二主链在交联反应中通过第一和第二反应性基团交联，优选不含另外的交联剂，并且其中具有至少八个（8）原子的笼结构共价结合至第一和第二主链中的至少一个。

    Compositions and methods for thermosetting molecules in organic compositions
    5.
    发明授权
    Compositions and methods for thermosetting molecules in organic compositions 失效
    有机组合物中热固性分子的组成和方法

    公开(公告)号：US06803441B2

    公开(公告)日：2004-10-12

    申请号：US10267380

    申请日：2002-10-08

    申请人： Kreisler Lau ,  Feng Quan Liu ,  Boris Korolev ,  Emma Brouk ,  Ruslan Zherebin ,  David Nalewajek

    发明人： Kreisler Lau ,  Feng Quan Liu ,  Boris Korolev ,  Emma Brouk ,  Ruslan Zherebin ,  David Nalewajek

    IPC分类号： C08G6378

    CPC分类号： C08G61/12 ,  C08G61/02 ,  C08G2650/60

    摘要： In a method of producing a low dielectric constant polymer, a thermosetting monomer is provided, wherein the thermosetting monomer has a cage compound or aryl core structure, and a plurality of arms that are covalently bound to the cage compound or core structure. In a subsequent step, the thermosetting monomer is incorporated into a polymer to form the low dielectric constant polymer, wherein the incorporation into the polymer comprises a chemical reaction of a triple bond that is located in at least one of the arms. Contemplated cage compounds and core structures include adamantane, diamantane, silicon, a phenyl group and a sexiphenylene group, while preferred arms include an arylene, a branched arylene, and an arylene ether. The thermosetting monomers may advantageously be employed to produce low-k dielectric material in electronic devices, and the dielectric constant of the polymer can be controlled by varying the overall length of the arms.

    摘要翻译： 在制造低介电常数聚合物的方法中，提供了一种热固性单体，其中该热固性单体具有笼形化合物或芳基核心结构，以及共价结合笼形化合物或核心结构的多个臂。 在随后的步骤中，将热固性单体引入聚合物中以形成低介电常数聚合物，其中掺入聚合物中包含位于至少一个臂中的三键的化学反应。 考虑的笼状化合物和核心结构包括金刚烷，二金刚烷，硅，苯基和亚噻吩基，而优选的臂包括亚芳基，支链亚芳基和亚芳基醚。 热固性单体可以有利地用于在电子器件中产生低k介电材料，并且聚合物的介电常数可以通过改变臂的整个长度来控制。

    Low dielectric constant materials with improved thermo-mechanical strength and processability
    7.
    发明授权
    Low dielectric constant materials with improved thermo-mechanical strength and processability 失效
    低介电常数材料，具有改善的热机械强度和加工性能

    公开(公告)号：US06987147B2

    公开(公告)日：2006-01-17

    申请号：US10263204

    申请日：2002-10-01

    申请人： Kreisler Lau ,  Bo Li ,  Boris Korolev ,  Edward Sullivan ,  Ruslan Zherebin

    发明人： Kreisler Lau ,  Bo Li ,  Boris Korolev ,  Edward Sullivan ,  Ruslan Zherebin

    IPC分类号： C08G65/30 ,  C08G65/38 ,  C08F8/00

    CPC分类号： H01L21/02118 ,  B32B27/06 ,  C08G61/02 ,  H01L21/02203 ,  H01L21/02282 ,  H01L21/312 ,  Y10T428/24851

    摘要： A polymeric network comprises a plurality of monomers that include a cage compound with at least three arms, wherein at least one of the arms has two or more branches, and wherein each of the branches further comprises a reactive group. Monomers in contemplated polymeric networks are covalently coupled to each other via the reactive groups. Particularly contemplated cage compounds include adamantane and diamantane, and especially contemplated branched arms comprise ortho-bis(phenylethynyl)phenyl. Especially contemplated polymeric networks have a dielectric constant of no more than 3.0, and are formed on the surface of a substrate.

    摘要翻译： 聚合物网络包括多个单体，其包括具有至少三个臂的笼形化合物，其中至少一个臂具有两个或更多个分支，并且其中每个分支还包含反应性基团。 预期聚合物网络中的单体通过反应性基团共价偶联。 特别预期的笼形化合物包括金刚烷和金刚烷，特别是预期的支链包括邻 - 双（苯基乙炔基）苯基。 特别考虑的聚合物网络具有不超过3.0的介电常数，并且形成在基底的表面上。

    Nanoporous material fabricated using polymeric template strands
    8.
    发明授权
    Nanoporous material fabricated using polymeric template strands 失效
    使用聚合物模板链制造的纳米多孔材料

    公开(公告)号：US6156812A

    公开(公告)日：2000-12-05

    申请号：US544723

    申请日：2000-04-06

    申请人： Kreisler Lau ,  Tian-An Chen ,  Boris Korolev

    发明人： Kreisler Lau ,  Tian-An Chen ,  Boris Korolev

    IPC分类号： C08J9/26 ,  C08J9/02

    CPC分类号： C08J9/26 ,  C08J2201/046

    摘要： Compositions and methods are provided in which nanoporous polymeric materials are produced via stable, polymeric template strands having reactive groups that can be used for forming crosslinking functionalities and/or adding thermolabile groups, wherein at least some of the thermolabile groups are thermolyzed to produce voids. The template strands preferably comprise aromatic systems and vicinal keto groups, such as a polybenzil formed from fluorene bisphenol or 3,3'-dihydroxytolane with 4,4'-difluorobenzil. At least some of the reactive groups preferably react using an addition-elimination reaction. Especially preferred thermolabile groups comprise poly(propylene oxide), and especially preferred crosslinkers comprise ethynyl-moiety and tetracyclone moieties.

    摘要翻译： 提供了组合物和方法，其中纳米多孔聚合物材料通过具有可用于形成交联官能团和/或添加不耐热基团的反应性基团的稳定的聚合物模板链产生，其中至少一些不耐热基团被热分解以产生空隙。 模板链优选包含芳族体系和连位酮基，例如由芴双酚或3,3'-二羟基乙内酯与4,4'-二氟苯甲醛形成的聚苯乙烯。 至少一些反应性基团优选使用加成 - 消除反应进行反应。 特别优选的热不稳定基团包括聚（环氧丙烷），并且特别优选的交联剂包括乙炔基部分和四环酮部分。

    Organic compositions
    10.
    发明授权
    Organic compositions 失效
    有机成分

    公开(公告)号：US07060204B2

    公开(公告)日：2006-06-13

    申请号：US10404047

    申请日：2003-04-02

    申请人： Bo Li ,  Nancy Iwamoto ,  Boris Korolev ,  Paul G. Apen ,  Kreisler Lau ,  John G. Sikonia ,  Ananth Naman ,  Amauel Gebrebrhan ,  Nassrin Sleiman ,  Ruslan Zherebin

    发明人： Bo Li ,  Nancy Iwamoto ,  Boris Korolev ,  Paul G. Apen ,  Kreisler Lau ,  John G. Sikonia ,  Ananth Naman ,  Amauel Gebrebrhan ,  Nassrin Sleiman ,  Ruslan Zherebin

    IPC分类号： H01B1/12 ,  C08J9/38 ,  C08J9/00

    CPC分类号： H01L21/02126 ,  C08G61/02 ,  C08L65/00 ,  H01L21/02203 ,  H01L21/02282 ,  H01L21/31695 ,  H05K1/0313

    摘要： The present invention provides a composition comprising: (a) dielectric material; and (b) porogen comprising at least two fused aromatic rings wherein each of the fused aromatic rings has at least one alkyl substituent thereon and a bond exists between at least two of the alkyl substituents on adjacent aromatic rings. Preferably, the dielectric material is a composition comprising (a) thermosetting component comprising (1) optionally monomer of Formula I as set forth below and (2) at least one oligomer or polymer of Formula II as set forth below where Q, G, h, I, I, and w are as set forth below and (b) porogen. Preferably, the porogen is selected from the group consisting of unfunctionalized polyacenaphthylene homopolymer, functionalized polyacenaphthylene homopolymer, polyacenaphthylene copolymer, polynorbornene, polycaprolactone, poly(2-vinylnaphthalene), vinyl anthracene, polystyrene, polystyrene derivatives, polysiloxane, polyester, polyether, polyacrylate, aliphatic polycarbonate, polysulfone, polylactide, and blends thereof. The present compositions are particularly useful as dielectric substrate material in microchips, multichip modules, laminated circuit boards, and printed wiring boards.

    摘要翻译： 本发明提供一种组合物，其包含：（a）电介质材料; 和（b）包含至少两个稠合芳环的致孔剂，其中每个稠合芳环在其上具有至少一个烷基取代基，并且在相邻芳环上的至少两个烷基取代基之间存在键。 优选地，电介质材料是包含（a）热固性组分的组合物，其包含（1）如下所述的任选的式I的单体和（2）至少一种如下所述的式II的低聚物或聚合物，其中Q，G，h ，I，I和w如下所述，（b）致孔剂。 优选地，致孔剂选自非官能化聚苊烯均聚物，官能化聚苊烯均聚物，聚苊烯共聚物，聚降冰片烯，聚己内酯，聚（2-乙烯基萘），乙烯基蒽，聚苯乙烯，聚苯乙烯衍生物，聚硅氧烷，聚酯，聚醚，聚丙烯酸酯，脂族 聚碳酸酯，聚砜，聚丙交酯及其共混物。 本发明的组合物特别可用作微芯片，多芯片模块，层叠电路板和印刷线路板中的介电基板材料。