Integrated 3-dimensional electromagnetic element arrays
    1.
    发明授权
    Integrated 3-dimensional electromagnetic element arrays 有权
    集成三维电磁元件阵列

    公开(公告)号:US08742989B2

    公开(公告)日:2014-06-03

    申请号:US13118188

    申请日:2011-05-27

    IPC分类号: H01Q1/38

    摘要: Systems and methods for constructing integrated three dimensional electromagnetic element arrays using a bulk resonator are illustrated. In several embodiments, the integrated three dimensional electromagnetic element arrays include electromagnetic elements buried within the bulk resonator. In many embodiments, inclusion of a third dimension in the electromagnetic element array can alleviate or eliminate the trade-offs that are experienced in conventional integrated antennas by using the third physical dimension to provide an additional degree of freedom to manipulate electromagnetic boundary conditions in the near-field of the substrate, affecting both the resulting electromagnetic near- and far-fields. In several embodiments, three dimensional electromagnetic element arrays are formed by mechanically stacking substrates on which integrated planar circuits are formed (i.e. chips) using conventional die stacking techniques.

    摘要翻译: 示出了使用体谐振器构造集成的三维电磁元件阵列的系统和方法。 在几个实施例中,集成的三维电磁元件阵列包括埋入本体谐振器内的电磁元件。 在许多实施例中,在电磁元件阵列中包括第三维度可以通过使用第三物理尺寸来提供额外的自由度来操纵在近端的电磁边界条件,来减轻或消除常规集成天线中经历的权衡 - 基底的场,影响所得到的电磁近场和远场。 在几个实施例中,通过使用常规的芯片堆叠技术机械堆叠形成集成平面电路的基板(即,芯片)来形成三维电磁元件阵列。

    Switchless multi-resonant, multi-band power amplifier

    公开(公告)号:US07092691B2

    公开(公告)日:2006-08-15

    申请号:US10094055

    申请日:2002-03-08

    IPC分类号: H04B1/18

    摘要: The present invention discloses a generic approach to the design of single-path, switchless multi-resonant, multi-band power amplifiers. In the preferred embodiments, the amplifier includes one or more amplification stages, a switchless, multi-resonant, input impedance network, a switchless, multi-resonant, output impedance network, and if multi-stage, a switchless, multi-resonant, interstage impedance network between each amplification stage. Multi-band amplification is accomplished without the need for externally-applied, frequency-indicating control signals. Moreover, the amplifier may be designed to provide concurrent multi-band amplification or non-concurrent amplification.