公开(公告)号：US5280087A

公开(公告)日：1994-01-18

申请号：US7822

申请日：1993-01-22

Applicant: Lie-Zen Chung ,  De-Lun Kou ,  Wen-Bin Shiu ,  Fu-Le Lin

Inventor： Lie-Zen Chung ,  De-Lun Kou ,  Wen-Bin Shiu ,  Fu-Le Lin

IPC: C08G65/333 ,  C08G69/44 ,  C08G63/04 ,  C08G65/32

CPC classification number: C08G69/44 ,  C08G65/33317

Abstract: Disclosed is a novel two-step reaction method for preparing block copolyether-ester-amides. In the first step, caprolactam or other lactam is reacted with a polyether polyol in the presence of a catalyst to form an amino-terminated prepolymer with both a polyamide hard segment and a polyether soft segment. In the second step, the prepolymer is reacted with a dicarboxylic acid as a chain extender to form high molecular weight block copolyether-ester-amides.The block copolyether-ester-amides prepared by this method are transparent, easily moldable by conventional processing methods such as extrusion and injection molding, and exhibit excellent mechanical properties.

Abstract translation: 公开了一种制备嵌段共聚醚 - 酯 - 酰胺的新型两步反应方法。 在第一步中，己内酰胺或其它内酰胺与聚醚多元醇在催化剂存在下反应，形成具有聚酰胺硬链段和聚醚软链段的氨基封端的预聚物。 在第二步中，预聚物与作为扩链剂的二羧酸反应形成高分子量嵌段共聚醚 - 酯 - 酰胺。 通过该方法制备的嵌段共醚 - 酯 - 酰胺是透明的，通过常规加工方法如挤出和注射成型容易模塑，并且显示出优异的机械性能。

公开(公告)号：US06709741B1

公开(公告)日：2004-03-23

申请号：US09949217

申请日：2001-09-07

Applicant: Fu-Le Lin ,  Ching-Ping Chen ,  Tzu-Ching Hung ,  Sung-Chen Huang ,  Kuo-Hua Yu ,  Kuo-Hsiung Hsia ,  Yen-Chi Liu

Inventor： Fu-Le Lin ,  Ching-Ping Chen ,  Tzu-Ching Hung ,  Sung-Chen Huang ,  Kuo-Hua Yu ,  Kuo-Hsiung Hsia ,  Yen-Chi Liu

IPC: B32B2516

CPC classification number: H05K3/386 ,  C08G59/18 ,  C08G59/68 ,  C08L9/02 ,  C08L2666/08 ,  C09J163/00 ,  H01L23/49894 ,  H01L2924/0002 ,  H05K1/0393 ,  H05K2201/012 ,  H05K2201/0133 ,  H05K2201/0209 ,  Y10S428/901 ,  Y10T428/287 ,  Y10T428/31515 ,  H01L2924/00

Abstract: The present invention discloses an adhesive composition for flexible printed circuit board comprising the following component: (a) an epoxy resin; (b) an accelerator having a structure of one of the following general formulas: wherein, E represents sulfur, nitrogen or phosphorus; Ar represents an aromatic ring; R1 is the same or different and represents a substituted or unsubatituted monovalent hydrocarbon group, a hydroxyl group, an alkoxy group, a nitro group, a cyano group or a halogen atom; R2 and R3 each represents a hydrogen atom and a methyl group; R4 is the same or different and represents a substituted or unsubstituted monovalent hydrocarbon group; R5 represents a substituted or unsubstituted pyridinium group; a represents an integer of 0 to 2; and b represents 2 to 3; (c) a nitrile rubber having carboxyl groups, and a carboxyl terminated butadiene acrylonitrile is preferred; and (d) an inorganic filler, an aluminum hydroxide is preferred.

Abstract translation: 本发明公开了一种用于柔性印刷电路板的粘合剂组合物，其包含以下组分：（a）环氧树脂; （b）具有以下通式之一的结构的促进剂：其中E表示硫，氮或磷; Ar表示芳香环; R 1相同或不同，表示取代或未取代的一价烃基，羟基，烷氧基，硝基，氰基或卤素原子; R 2和R 3各自表示氢原子和甲基; R 4相同或不同，表示取代或未取代的一价烃基; R 5表示取代或未取代的吡啶鎓基; a表示0〜2的整数， b表示2〜3; （c）具有羧基的丁腈橡胶和羧基封端的丁二烯丙烯腈是优选的; 和（d）无机填料，优选氢氧化铝。