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公开(公告)号：US20190113117A1
公开(公告)日：2019-04-18
申请号：US15784219
申请日：2017-10-16
Applicant: Tzu-Ching Hung
Inventor： Tzu-Ching Hung
Abstract: A roller screw structure includes a screw rod, a nut set and planetary rollers. The screw rod includes an outer thread portion having first and second side-recession portions. The nut set includes an inner thread portion having third and fourth side-recession portions. The planetary roller includes a roller-thread portion having first and second side-protrusion portions. In assembling, the first and second side-protrusion portions are tightly engaged with the first and second side-recession portions, with the first and second side-protrusion portions tightly engaging with the third and fourth side-recession portions synchronously.
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2.发明申请公开(公告)号：US20110111191A1
公开(公告)日：2011-05-12
申请号：US12617595
申请日：2009-11-12
Applicant: Yu-Hsien Lee , Chen-Hsin Huang , Feng-Jung Tien , Tzu-Ching Hung
Inventor： Yu-Hsien Lee , Chen-Hsin Huang , Feng-Jung Tien , Tzu-Ching Hung
CPC classification number: C23C26/00 , C23C28/00 , Y10T29/49366 , Y10T428/2495 , Y10T428/264 , Y10T428/265
Abstract: A method for manufacturing a low thermal-impedance insulated metal substrate has steps of providing an electrical-conductive metal layer; forming a first thermal-conductive polymeric composite layer on the electrical-conductive metal layer; forming a second thermal-conductive polymeric composite layer on the first thermal-conductive polymeric composite layer; and adhere a thermal-conductive metal layer on the second thermal-conductive polymeric composite layer by hot-pressing process. Therefore, the low thermal-impedance insulated metal substrate of the present invention has lower thermal-impedance, lower coefficient of thermal expansion and higher electrical reliability.
Abstract translation: 制造低热阻绝缘金属基板的方法具有提供导电金属层的步骤; 在所述导电金属层上形成第一导热聚合物复合层; 在第一导热聚合物复合层上形成第二导热聚合物复合层; 并通过热压法在第二导热聚合物复合层上粘附导热金属层。 因此，本发明的低热阻抗绝缘金属基板具有较低的热阻抗，较低的热膨胀系数和较高的电可靠性。
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3.发明授权FPC adhesive of epoxy resin, onium hexafluoroantimonate, nitrile rubber and filler 有权环氧树脂的FPC粘合剂，六氟锑鎓鎓鎓，丁腈橡胶和填料公开(公告)号：US06709741B1
公开(公告)日：2004-03-23
申请号：US09949217
申请日：2001-09-07
Applicant: Fu-Le Lin , Ching-Ping Chen , Tzu-Ching Hung , Sung-Chen Huang , Kuo-Hua Yu , Kuo-Hsiung Hsia , Yen-Chi Liu
Inventor： Fu-Le Lin , Ching-Ping Chen , Tzu-Ching Hung , Sung-Chen Huang , Kuo-Hua Yu , Kuo-Hsiung Hsia , Yen-Chi Liu
IPC: B32B2516
CPC classification number: H05K3/386 , C08G59/18 , C08G59/68 , C08L9/02 , C08L2666/08 , C09J163/00 , H01L23/49894 , H01L2924/0002 , H05K1/0393 , H05K2201/012 , H05K2201/0133 , H05K2201/0209 , Y10S428/901 , Y10T428/287 , Y10T428/31515 , H01L2924/00
Abstract: The present invention discloses an adhesive composition for flexible printed circuit board comprising the following component: (a) an epoxy resin; (b) an accelerator having a structure of one of the following general formulas: wherein, E represents sulfur, nitrogen or phosphorus; Ar represents an aromatic ring; R1 is the same or different and represents a substituted or unsubatituted monovalent hydrocarbon group, a hydroxyl group, an alkoxy group, a nitro group, a cyano group or a halogen atom; R2 and R3 each represents a hydrogen atom and a methyl group; R4 is the same or different and represents a substituted or unsubstituted monovalent hydrocarbon group; R5 represents a substituted or unsubstituted pyridinium group; a represents an integer of 0 to 2; and b represents 2 to 3; (c) a nitrile rubber having carboxyl groups, and a carboxyl terminated butadiene acrylonitrile is preferred; and (d) an inorganic filler, an aluminum hydroxide is preferred.
Abstract translation: 本发明公开了一种用于柔性印刷电路板的粘合剂组合物，其包含以下组分：（a）环氧树脂; （b）具有以下通式之一的结构的促进剂：其中E表示硫，氮或磷; Ar表示芳香环; R 1相同或不同，表示取代或未取代的一价烃基，羟基，烷氧基，硝基，氰基或卤素原子; R 2和R 3各自表示氢原子和甲基; R 4相同或不同，表示取代或未取代的一价烃基; R 5表示取代或未取代的吡啶鎓基; a表示0〜2的整数， b表示2〜3; （c）具有羧基的丁腈橡胶和羧基封端的丁二烯丙烯腈是优选的; 和（d）无机填料，优选氢氧化铝。
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4.发明授权公开(公告)号：US08415004B2
公开(公告)日：2013-04-09
申请号：US12617595
申请日：2009-11-12
Applicant: Yu-Hsien Lee , Chen-Hsin Huang , Feng-Jung Tien , Tzu-Ching Hung
Inventor： Yu-Hsien Lee , Chen-Hsin Huang , Feng-Jung Tien , Tzu-Ching Hung
CPC classification number: C23C26/00 , C23C28/00 , Y10T29/49366 , Y10T428/2495 , Y10T428/264 , Y10T428/265
Abstract: A method for manufacturing a low thermal-impedance insulated metal substrate has steps of providing an electrical-conductive metal layer; forming a first thermal-conductive polymeric composite layer on the electrical-conductive metal layer; forming a second thermal-conductive polymeric composite layer on the first thermal-conductive polymeric composite layer; and adhere a thermal-conductive metal layer on the second thermal-conductive polymeric composite layer by hot-pressing process. Therefore, the low thermal-impedance insulated metal substrate of the present invention has lower thermal-impedance, lower coefficient of thermal expansion and higher electrical reliability.
Abstract translation: 制造低热阻绝缘金属基板的方法具有提供导电金属层的步骤; 在所述导电金属层上形成第一导热聚合复合层; 在第一导热聚合物复合层上形成第二导热聚合物复合层; 并通过热压法在第二导热聚合物复合层上粘附导热金属层。 因此，本发明的低热阻抗绝缘金属基板具有较低的热阻抗，较低的热膨胀系数和较高的电可靠性。
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