公开(公告)号：US5390844A

公开(公告)日：1995-02-21

申请号：US96700

申请日：1993-07-23

Applicant: Thomas H. Distefano ,  Igor Y. Khandros ,  Gaetan Mathiew ,  Jason Sweis ,  John Grange ,  Gary W. Grube

Inventor： Thomas H. Distefano ,  Igor Y. Khandros ,  Gaetan Mathiew ,  Jason Sweis ,  John Grange ,  Gary W. Grube

IPC: H01L21/60 ,  B23K20/02 ,  B23K20/10 ,  H01L21/00 ,  H01L21/603 ,  H05K3/32

CPC classification number: H01L21/67138 ,  B23K20/025 ,  B23K20/106 ,  H01L24/80 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01023 ,  H01L2924/01033 ,  H01L2924/01045 ,  H01L2924/01074 ,  H01L2924/01076 ,  H01L2924/01082

Abstract: A bonding tool for bonding inner leads to semiconductor chips is arranged to capture and align elongated lead sections extending in any one of plural directions, and preferably, in any one of two mutually orthogonal directions. Thus, the tool can be applied to align and bond all of the leads to a chip without turning the tool or the chip even where the leads extend in multiple directions.

Abstract translation: 用于将内部引线键合到半导体芯片的接合工具被布置成捕获和对准沿多个方向中的任一个延伸的细长引线部分，优选地在两个相互正交的方向中的任一个方向上对准。 因此，即使在多个方向上引线延伸的情况下，该工具也可以应用于将所有引线对齐并将其结合到芯片上而不转动工具或芯片。

公开(公告)号：US5536909A

公开(公告)日：1996-07-16

申请号：US320310

申请日：1994-10-13

Applicant: Thomas H. DiStefano ,  Gary W. Grube ,  Igor Y. Khandros ,  Gaetan Mathiew

Inventor： Thomas H. DiStefano ,  Gary W. Grube ,  Igor Y. Khandros ,  Gaetan Mathiew

IPC: H01L21/60 ,  H01L23/31 ,  H01L23/495 ,  H01L23/498 ,  H01L23/50 ,  H05K1/18 ,  H05K3/36 ,  H05K3/40 ,  H05K1/02

CPC classification number: H01L23/49572 ,  H01L23/3107 ,  H01L23/49838 ,  H01L23/4985 ,  H01L23/49861 ,  H01L24/01 ,  H01L2924/01082 ,  H01L2924/12042 ,  H05K3/361 ,  H05K3/4084 ,  Y10T29/49121 ,  Y10T29/4913 ,  Y10T29/49135 ,  Y10T29/49218 ,  Y10T29/49222

Abstract: A connection component for electrically connecting a semiconductor chip to a support substrate incorporates a preferably dielectric supporting structure defining gaps. Leads extend across these gaps so that the leads are supported on both sides of the gap. The leads therefore can be positioned approximately in registration to contacts on the chip by aligning the connection component with the chip. Each lead is arranged so that one end can be displaced relative to the supporting structure when a downward force is applied to the lead. This allows the leads to be connected to the contacts on the chip by engaging each lead with a tool and forcing the lead downwardly against the contact. Preferably, each lead incorporates a frangible section adjacent one side of the gap and the frangible section is broken when the lead is engaged with the contact. Final alignment of the leads with the contacts on the chip is provided by the bonding tool, which has features adapted to control the position of the lead.

Abstract translation: 用于将半导体芯片电连接到支撑衬底的连接部件包含限定间隙的优选介电支撑结构。 引线延伸穿过这些间隙，使得引线支撑在间隙的两侧。 因此，引线可以通过将连接部件与芯片对准而大致对准芯片上的触点。 每个引线被布置成使得当向引线施加向下的力时，一端可相对于支撑结构移位。 这允许引线通过使每个引线与工具接合并将引线向下抵靠接触件而连接到芯片上的触点。 优选地，每个引线包括与间隙的一侧相邻的易碎部分，并且当引线与触点接合时，易碎部分断裂。 引线与芯片上的触点的最终对准由焊接工具提供，其具有适于控制引线位置的特征。

公开(公告)号：US5977618A

公开(公告)日：1999-11-02

申请号：US56015

申请日：1998-04-07

Applicant: Thomas H. DiStefano ,  Gary W. Grube ,  Igor Y. Khandros ,  Gaetan Mathiew

Inventor： Thomas H. DiStefano ,  Gary W. Grube ,  Igor Y. Khandros ,  Gaetan Mathiew

IPC: H01L23/31 ,  H01L23/498 ,  H05K3/36 ,  H05K3/40 ,  B23K31/02 ,  H05K1/18

CPC classification number: H01L23/49838 ,  H01L23/3107 ,  H01L23/4985 ,  H01L23/49861 ,  H01L2924/0002 ,  H01L2924/01082 ,  H05K3/361 ,  H05K3/4084 ,  Y10T29/49121 ,  Y10T29/4913 ,  Y10T29/49144 ,  Y10T29/49151

Abstract: A connection component for electrically connecting a semiconductor chip to a support substrate incorporates a preferably dielectric supporting structure defining gaps. Leads extend across these gaps so that the leads are supported on both sides of the gap. The leads therefore can be positioned approximately in registration to contacts on the chip by aligning the connection component with the chip. Each lead is arranged so that one end can be displaced relative to the supporting structure when a downward force is applied to the lead. This allows the leads to be connected to the contacts on the chip by engaging each lead with a tool and forcing the lead downwardly against the contact. Preferably, each lead incorporates a frangible section adjacent one side of the gap and the frangible section is broken when the lead is engaged with the contact. Final alignment of the leads with the contacts on the chip is provided by the bonding tool, which has features adapted to control the position of the lead.

Abstract translation: 用于将半导体芯片电连接到支撑衬底的连接部件包含限定间隙的优选介电支撑结构。 引线延伸穿过这些间隙，使得引线支撑在间隙的两侧。 因此，引线可以通过将连接部件与芯片对准而大致对准芯片上的触点。 每个引线被布置成使得当向引线施加向下的力时，一端可相对于支撑结构移位。 这允许引线通过使每个引线与工具接合并将引线向下抵靠接触件而连接到芯片上的触点。 优选地，每个引线包括与间隙的一侧相邻的易碎部分，并且当引线与触点接合时，易碎部分断裂。 引线与芯片上的触点的最终对准由焊接工具提供，其具有适于控制引线位置的特征。

公开(公告)号：US5787581A

公开(公告)日：1998-08-04

申请号：US516290

申请日：1995-08-17

Applicant: Thomas H. DiStefano ,  Gary W. Grube ,  Igor Y. Khandros ,  Gaetan Mathiew

Inventor： Thomas H. DiStefano ,  Gary W. Grube ,  Igor Y. Khandros ,  Gaetan Mathiew

IPC: H01L21/60 ,  H01L23/31 ,  H01L23/495 ,  H01L23/498 ,  H01L23/50 ,  H05K1/18 ,  H05K3/36 ,  H05K3/40 ,  H01R43/00 ,  H01R43/16 ,  H05K3/38

CPC classification number: H01L23/49572 ,  H01L23/3107 ,  H01L23/49838 ,  H01L23/4985 ,  H01L23/49861 ,  H01L24/01 ,  H01L2924/01082 ,  H01L2924/12042 ,  H05K3/361 ,  H05K3/4084 ,  Y10T29/49121 ,  Y10T29/4913 ,  Y10T29/49135 ,  Y10T29/49218 ,  Y10T29/49222

Abstract: A connection component for electrically connecting a semiconductor chip to a support substrate incorporates a preferably dielectric supporting structure defining gaps. Leads extend across these gaps so that the leads are supported on both sides of the gap. The leads therefore can be positioned approximately in registration to contacts on the chip by aligning the connection component with the chip. Each lead is arranged so that one end can be displaced relative to the supporting structure when a downward force is applied to the lead. This allows the leads to be connected to the contacts on the chip by engaging each lead with a tool and forcing the lead downwardly against the contact. Preferably, each lead incorporates a frangible section adjacent one side of the gap and the frangible section is broken when the lead is engaged with the contact. Final alignment of the leads with the contacts on the chip is provided by the bonding tool, which has features adapted to control the position of the lead.

Abstract translation: 用于将半导体芯片电连接到支撑衬底的连接部件包含限定间隙的优选介电支撑结构。 引线延伸穿过这些间隙，使得引线支撑在间隙的两侧。 因此，引线可以通过将连接部件与芯片对准而大致对准芯片上的触点。 每个引线被布置成使得当向引线施加向下的力时，一端可相对于支撑结构移位。 这允许引线通过使每个引线与工具接合并将引线向下抵靠接触件而连接到芯片上的触点。 优选地，每个引线包括与间隙的一侧相邻的易碎部分，并且当引线与触点接合时，易碎部分断裂。 引线与芯片上的触点的最终对准由焊接工具提供，其具有适于控制引线位置的特征。

公开(公告)号：US5489749A

公开(公告)日：1996-02-06

申请号：US268040

申请日：1994-06-29

Applicant: Thomas H. DiStefano ,  Gary W. Grube ,  Igor Y. Khandros ,  Gaetan Mathiew

Inventor： Thomas H. DiStefano ,  Gary W. Grube ,  Igor Y. Khandros ,  Gaetan Mathiew

IPC: H01L21/60 ,  H01L23/31 ,  H01L23/495 ,  H01L23/498 ,  H01L23/50 ,  H05K1/18 ,  H05K3/36 ,  H05K3/40

CPC classification number: H01L23/49572 ,  H01L23/3107 ,  H01L23/49838 ,  H01L23/4985 ,  H01L23/49861 ,  H01L24/01 ,  H01L2924/01082 ,  H01L2924/12042 ,  H05K3/361 ,  H05K3/4084 ,  Y10T29/49121 ,  Y10T29/4913 ,  Y10T29/49135 ,  Y10T29/49218 ,  Y10T29/49222

Abstract: A connection component for electrically connecting a semiconductor chip to a support substrate incorporates a preferably dielectric supporting structure defining gaps. Leads extend across these gaps so that the leads are supported on both sides of the gap. The leads therefore can be positioned approximately in registration to contacts on the chip by aligning the connection component with the chip. Each lead is arranged so that one end can be displaced relative to the supporting structure when a downward force is applied to the lead. This allows the leads to be connected to the contacts on the chip by engaging each lead with a tool and forcing the lead downwardly against the contact. Preferably, each lead incorporates a frangible section adjacent one side of the gap and the frangible section is broken when the lead is engaged with the contact. Final alignment of the leads with the contacts on the chip is provided by the bonding tool, which has features adapted to control the position of the lead.

Abstract translation: 用于将半导体芯片电连接到支撑衬底的连接部件包含限定间隙的优选介电支撑结构。 引线延伸穿过这些间隙，使得引线支撑在间隙的两侧。 因此，引线可以通过将连接部件与芯片对准而大致对准芯片上的触点。 每个引线被布置成使得当向引线施加向下的力时，一端可相对于支撑结构移位。 这允许引线通过使每个引线与工具接合并将引线向下抵靠接触件而连接到芯片上的触点。 优选地，每个引线包括与间隙的一侧相邻的易碎部分，并且当引线与触点接合时，易碎部分断裂。 引线与芯片上的触点的最终对准由焊接工具提供，其具有适于控制引线位置的特征。