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1.发明申请Biochemical Semiconductor Chip Laboratory Comprising A Coupled Address And Control Chip And Method For Producing The Same 审中-公开生物化学半导体芯片实验室，包括耦合地址和控制芯片及其生产方法公开(公告)号：US20080197430A1
公开(公告)日：2008-08-21
申请号：US11791963
申请日：2005-11-29
申请人： Robert Aigner , Ralf Brederlow , Lude Elbrecht , Heinrich Heiss , Stephan Marksteiner , Werner Simburger , Roland Thewes , Hans-Jorg Timme
发明人： Robert Aigner , Ralf Brederlow , Lude Elbrecht , Heinrich Heiss , Stephan Marksteiner , Werner Simburger , Roland Thewes , Hans-Jorg Timme
CPC分类号： G01N29/036 , B01L3/5085 , B01L2300/0645 , B01L2300/0663 , B01L2300/0819 , G01N33/02 , G01N33/15 , G01N33/48707 , G01N2291/0256 , H01L2224/81801 , H01L2924/01068 , H01L2924/13091 , H01L2924/00
摘要： A biochemical semiconductor chip laboratory is disclosed including a coupled address and control chip for biochemical analyses and a method for producing the same. In at least one embodiment the semiconductor chip laboratory has a semiconductor sensor chip, which provides numerous analytical positions for biochemical samples in a matrix. The sensor chip is located on the address and control chip and the analytical positions are in electric contact with a printed contact structure on the upper face of the address and control chip via low-resistance through-platings through the semiconductor substrate of the semiconductor chip.
摘要翻译： 公开了一种生物化学半导体芯片实验室，其包括用于生化分析的耦合地址和控制芯片及其制造方法。 在至少一个实施例中，半导体芯片实验室具有半导体传感器芯片，其为矩阵中的生物化学样品提供许多分析位置。 传感器芯片位于地址和控制芯片上，并且分析位置通过半导体芯片的半导体衬底的低电阻穿透与地址和控制芯片的上表面上的印刷接触结构电接触。
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公开(公告)号：US06542054B2
公开(公告)日：2003-04-01
申请号：US10113353
申请日：2002-04-01
IPC分类号： H03H954
摘要： An acoustic mirror is described which is formed of at least one first insulating layer, a first metal layer disposed thereon, a second insulating layer disposed thereon and a second metal layer disposed thereon. An auxiliary layer is produced on the first insulating layer whereby a recess extending as far as the first insulating layer is created therein. The first metal layer is substantially deposited and removed by chemical/mechanical polishing until the parts of the first metal layer disposed outside the recess are no longer present. The second metal layer is also produced in a recess with the aid of chemical/mechanical polishing. More than two insulating layers and two metal layers can be provided. The first metal layer and the second metal layer can be produced in the same recess.
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公开(公告)号：US06357299B1
公开(公告)日：2002-03-19
申请号：US09372306
申请日：1999-08-11
申请人： Robert Aigner , Thomas Bever , Hans-Jorg Timme
发明人： Robert Aigner , Thomas Bever , Hans-Jorg Timme
IPC分类号： G01L900
CPC分类号： B81C1/00182 , B06B1/0688 , B81B2201/0235 , B81B2201/0257 , B81B2201/0264 , G01L9/0073 , H04R19/00
摘要： A micromechanical sensor integrated on a chip, includes a semiconductor substrate, an electronic circuit, a void, a diaphragm, a counterelectrode and valve openings connecting a volume of the void to its surroundings. The valve openings are directed toward an upper surface of the wafer, and the counterelectrode is a component part of a coating plane that extends over the entire chip surface, so that the electronic semiconductor circuit can be applied to the coating plane by known semiconductor technology. A method for producing the micromechanical sensor as well as a microphone or a pressure sensor having the micromechanical sensor, are also provided.
摘要翻译： 集成在芯片上的微机械传感器包括半导体衬底，电子电路，空隙，隔膜，反电极和连接一定体积的空隙与其周围的阀门开口。 阀开口指向晶片的上表面，并且反电极是在整个芯片表面上延伸的涂层平面的组成部分，使得电子半导体电路可以通过已知的半导体技术施加到涂层平面。 还提供了一种用于制造微机械传感器的方法以及具有微机械传感器的麦克风或压力传感器。
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公开(公告)号：US20050212619A1
公开(公告)日：2005-09-29
申请号：US11045500
申请日：2005-01-28
CPC分类号： H03H9/0095 , H01F17/0006 , H01F2021/125 , H03H7/42
摘要： A filter circuit comprises a balanced port, an unbalanced port and a substrate. A series circuit of a filter stage and a balun is disposed between the balanced port and the unbalanced port. The balun and the filter stage are formed on the substrate.
摘要翻译： 滤波电路包括平衡端口，不平衡端口和基板。 滤波器级和平衡 - 不平衡变换器的串联电路设置在平衡端口和不平衡端口之间。 平衡不平衡转换器和滤波器级形成在基板上。
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