公开(公告)号：US07074665B2

公开(公告)日：2006-07-11

申请号：US10701423

申请日：2003-11-06

申请人： Shinichi Fukada ,  Naotaka Hashimoto ,  Masanori Kojima ,  Hiroshi Momiji ,  Hiromi Abe ,  Masayuki Suzuki

发明人： Shinichi Fukada ,  Naotaka Hashimoto ,  Masanori Kojima ,  Hiroshi Momiji ,  Hiromi Abe ,  Masayuki Suzuki

IPC分类号： H01L21/8238

CPC分类号： H01L29/6659 ,  H01L21/2652 ,  H01L21/28518 ,  H01L21/823814 ,  H01L21/823835 ,  H01L21/823842 ,  H01L29/665 ,  H01L29/66545 ,  H01L29/7833

摘要： An implantation step of a dopant ion for forming source and drain regions (S and D) is divided into one implantation of a dopant ion for forming a p/n junction with a well region (3), and one implantation of a dopant ion that does not influence a position of the p/n junction between the source and drain regions (S and D) and the well region with a shallow implantation depth and a large implantation amount. After conducting an activation heat treatment of the dopant, a surface of the source/drain region is made into cobalt silicide 12, so that the source/drain region (S and D) can have a low resistance, and a p/n junction leakage can be reduced.

公开(公告)号：US20090263943A1

公开(公告)日：2009-10-22

申请号：US12492276

申请日：2009-06-26

申请人： Shinji Nishihara ,  Shuji Ikeda ,  Naotaka Hashimoto ,  Hiroshi Momiji ,  Hiromi Abe ,  Shinichi Fukada ,  Masayuki Suzuki

发明人： Shinji Nishihara ,  Shuji Ikeda ,  Naotaka Hashimoto ,  Hiroshi Momiji ,  Hiromi Abe ,  Shinichi Fukada ,  Masayuki Suzuki

IPC分类号： H01L21/336 ,  H01L21/28 ,  H01L21/44

CPC分类号： H01L21/823814 ,  C23C14/16 ,  C23C14/3414 ,  H01L21/28518 ,  H01L21/2855 ,  H01L21/31608 ,  H01L21/76229 ,  H01L21/76828 ,  H01L21/823835 ,  H01L21/823842 ,  H01L21/823871 ,  H01L23/53223 ,  H01L29/456 ,  H01L29/4933 ,  H01L29/665 ,  H01L29/6656 ,  H01L29/6659 ,  H01L29/7833 ,  H01L2924/0002 ,  H01L2924/00

摘要： A Co silicide layer having a low resistance and a small junction leakage current is formed on the surface of the gate electrode, source and drain of MOSFETS by silicidizing a Co film deposited on a main plane of a wafer by sputtering using a high purity Co target having a Co purity of at least 99.99% and Fe and Ni contents of not greater than 10 ppm, preferably having a Co purity of 99.999%.

摘要翻译： 在MOSFET的栅电极，源极和漏极的表面上形成具有低电阻和小的漏电流的Co硅化物层，通过使用高纯度Co靶溅射沉积在晶片的主平面上的Co膜， Co纯度至少为99.99％，Fe和Ni含量不大于10ppm，Co的纯度优选为99.999％。

公开(公告)号：US07094655B2

公开(公告)日：2006-08-22

申请号：US11169585

申请日：2005-06-30

申请人： Shinichi Fukada ,  Naotaka Hashimoto ,  Masanori Kojima ,  Hiroshi Momiji ,  Hiromi Abe ,  Masayuki Suzuki

发明人： Shinichi Fukada ,  Naotaka Hashimoto ,  Masanori Kojima ,  Hiroshi Momiji ,  Hiromi Abe ,  Masayuki Suzuki

IPC分类号： H01L21/336

CPC分类号： H01L29/6659 ,  H01L21/2652 ,  H01L21/28518 ,  H01L21/823814 ,  H01L21/823835 ,  H01L21/823842 ,  H01L29/665 ,  H01L29/66545 ,  H01L29/7833

摘要： An implantation step of a dopant ion for forming source and drain regions (S and D) is divided into one implantation of a dopant ion for forming a p/n junction with a well region (3), and one implantation of a dopant ion that does not influence a position of the p/n junction between the source and drain regions (S and D) and the well region with a shallow implantation depth and a large implantation amount. After conducting an activation heat treatment of the dopant, a surface of the source/drain region is made into cobalt silicide 12, so that the source/drain region (S and D) can have a low resistance, and a p/n junction leakage can be reduced.

摘要翻译： 用于形成源区和漏区（S和D）的掺杂剂离子的注入步骤被划分为用于与阱区（3）形成ap / n结的掺杂剂离子的一次注入，并且一次注入掺杂剂离子 不影响源极和漏极区域（S和D）之间的p / n结的位置以及具有浅的注入深度和大的注入量的阱区域。 在对掺杂剂进行激活热处理之后，将源极/漏极区域的表面制成硅化钴12，使得源极/漏极区域（S和D）可以具有低电阻，并且ap / n结泄漏可以 减少

公开(公告)号：US06693001B2

公开(公告)日：2004-02-17

申请号：US09380735

申请日：2000-02-04

申请人： Shinji Nishihara ,  Shuji Ikeda ,  Naotaka Hashimoto ,  Hiroshi Momiji ,  Hiromi Abe ,  Shinichi Fukada ,  Masayuki Suzuki

发明人： Shinji Nishihara ,  Shuji Ikeda ,  Naotaka Hashimoto ,  Hiroshi Momiji ,  Hiromi Abe ,  Shinichi Fukada ,  Masayuki Suzuki

IPC分类号： H01L218238

CPC分类号： H01L21/28518 ,  H01L21/2855 ,  H01L23/53223 ,  H01L29/456 ,  H01L29/4933 ,  H01L2924/0002 ,  H01L2924/00

摘要： A Co silicide layer having a low resistance and a small junction leakage current is formed on the surface of the gate electrode, source and drain of MOSFETs by silicidizing a Co film deposited on a main plane of a wafer by sputtering using a high purity Co target having a Co purity of at least 99.99% and Fe and Ni contents of not greater than 10 ppm, preferably having a Co purity of 99.999%.

摘要翻译： 通过使用高纯度Co靶通过溅射将沉积在晶片的主平面上的Co膜进行硅化，在MOSFET的栅极，源极和漏极的表面上形成具有低电阻和小的结漏电流的Co硅化物层 Co纯度至少为99.99％，Fe和Ni含量不大于10ppm，Co的纯度优选为99.999％。

公开(公告)号：US06670251B2

公开(公告)日：2003-12-30

申请号：US10005619

申请日：2001-12-07

申请人： Shinichi Fukada ,  Naotaka Hashimoto ,  Masanori Kojima ,  Hiroshi Momiji ,  Hiromi Abe ,  Masayuki Suzuki

发明人： Shinichi Fukada ,  Naotaka Hashimoto ,  Masanori Kojima ,  Hiroshi Momiji ,  Hiromi Abe ,  Masayuki Suzuki

IPC分类号： H01L21336

CPC分类号： H01L29/6659 ,  H01L21/2652 ,  H01L21/28518 ,  H01L21/823814 ,  H01L21/823835 ,  H01L21/823842 ,  H01L29/665 ,  H01L29/66545 ,  H01L29/7833

摘要： An implantation step of a dopant ion for forming source and drain regions (S and D) is divided into one implantation of a dopant ion for forming a p/n junction with a well region (3), and one implantation of a dopant ion that does not influence a position of the p/n junction between the source and drain regions (S and D) and the well region with a shallow implantation depth and a large implantation amount. After conducting an activation heat treatment of the dopant, a surface of the source/drain region is made into cobalt silicide 12, so that the source/drain region (S and D) can have a low resistance, and a p/n junction leakage can be reduced.

公开(公告)号：US06545326B2

公开(公告)日：2003-04-08

申请号：US09910796

申请日：2001-07-24

申请人： Shinichi Fukada ,  Naotaka Hashimoto ,  Masanori Kojima ,  Hiroshi Momiji ,  Hiromi Abe ,  Masayuki Suzuki

发明人： Shinichi Fukada ,  Naotaka Hashimoto ,  Masanori Kojima ,  Hiroshi Momiji ,  Hiromi Abe ,  Masayuki Suzuki

IPC分类号： H01L31119

CPC分类号： H01L29/6659 ,  H01L21/823814 ,  H01L21/823842 ,  H01L29/1083

摘要： An implantation step of a dopant ion for forming source and drain regions (S and D) is divided into one implantation of a dopant ion for forming a p/n junction with a well region (3), and one implantation of a dopant ion that does not influence a position of the p/n junction between the source and drain regions (S and D) and the well region with a shallow implantation depth and a large implantation amount. After conducting an activation heat treatment of the dopant, a surface of the source/drain region is made into cobalt silicide 12, so that the source/drain region (S and D) can have a low resistance, and a p/n junction leakage can be reduced.

公开(公告)号：US07553766B2

公开(公告)日：2009-06-30

申请号：US11950152

申请日：2007-12-04

申请人： Shinji Nishihara ,  Shuji Ikeda ,  Naotaka Hashimoto ,  Hiroshi Momiji ,  Hiromi Abe ,  Shinichi Fukada ,  Masayuki Suzuki

发明人： Shinji Nishihara ,  Shuji Ikeda ,  Naotaka Hashimoto ,  Hiroshi Momiji ,  Hiromi Abe ,  Shinichi Fukada ,  Masayuki Suzuki

IPC分类号： H01L21/44

CPC分类号： H01L21/823814 ,  C23C14/16 ,  C23C14/3414 ,  H01L21/28518 ,  H01L21/2855 ,  H01L21/31608 ,  H01L21/76229 ,  H01L21/76828 ,  H01L21/823835 ,  H01L21/823842 ,  H01L21/823871 ,  H01L23/53223 ,  H01L29/456 ,  H01L29/4933 ,  H01L29/665 ,  H01L29/6656 ,  H01L29/6659 ,  H01L29/7833 ,  H01L2924/0002 ,  H01L2924/00

摘要： A Co silicide layer having a low resistance and a small junction leakage current is formed on the surface of the gate electrode, source and drain of MOSFETS by silicidizing a Co film deposited on a main plane of a wafer by sputtering using a high purity Co target having a Co purity of at least 99.99% and Fe and Ni contents of not greater than 10 ppm, preferably having a Co purity of 99.999%.

摘要翻译： 在MOSFET的栅电极，源极和漏极的表面上形成具有低电阻和小的漏电流的Co硅化物层，通过使用高纯度Co靶溅射沉积在晶片的主平面上的Co膜， Co纯度至少为99.99％，Fe和Ni含量不大于10ppm，Co的纯度优选为99.999％。

公开(公告)号：US07314805B2

公开(公告)日：2008-01-01

申请号：US11519907

申请日：2006-09-13

申请人： Shinichi Fukada ,  Naotaka Hashimoto ,  Masanori Kojima ,  Hiroshi Momiji ,  Hiromi Abe ,  Masayuki Suzuki

发明人： Shinichi Fukada ,  Naotaka Hashimoto ,  Masanori Kojima ,  Hiroshi Momiji ,  Hiromi Abe ,  Masayuki Suzuki

IPC分类号： H01L21/331

CPC分类号： H01L29/6659 ,  H01L21/2652 ,  H01L21/28518 ,  H01L21/823814 ,  H01L21/823835 ,  H01L21/823842 ,  H01L29/665 ,  H01L29/66545 ,  H01L29/7833

摘要： An implantation step of a dopant ion for forming source and drain regions (S and D) is divided into one implantation of a dopant ion for forming a p/n junction with a well region (3), and one implantation of a dopant ion that does not influence a position of the p/n junction between the source and drain regions (S and D) and the well region with a shallow implantation depth and a large implantation amount. After conducting an activation heat treatment of the dopant, a surface of the source/drain region is made into cobalt silicide 12, so that the source/drain region (S and D) can have a low resistance, and a p/n junction leakage can be reduced.

摘要翻译： 用于形成源区和漏区（S和D）的掺杂剂离子的注入步骤被划分为用于与阱区（3）形成ap / n结的掺杂剂离子的一次注入，并且一次注入掺杂剂离子 不影响源极和漏极区域（S和D）之间的p / n结的位置以及具有浅的注入深度和大的注入量的阱区域。 在对掺杂剂进行激活热处理之后，将源极/漏极区域的表面制成硅化钴12，使得源极/漏极区域（S和D）可以具有低电阻，并且ap / n结泄漏可以 减少

公开(公告)号：US07064040B2

公开(公告)日：2006-06-20

申请号：US11169574

申请日：2005-06-30

申请人： Shinichi Fukada ,  Naotaka Hashimoto ,  Masanori Kojima ,  Hiroshi Momiji ,  Hiromi Abe ,  Masayuki Suzuki

发明人： Shinichi Fukada ,  Naotaka Hashimoto ,  Masanori Kojima ,  Hiroshi Momiji ,  Hiromi Abe ,  Masayuki Suzuki

IPC分类号： H01L21/336

CPC分类号： H01L29/6659 ,  H01L21/2652 ,  H01L21/28518 ,  H01L21/823814 ,  H01L21/823835 ,  H01L21/823842 ,  H01L29/665 ,  H01L29/66545 ,  H01L29/7833

摘要： An implantation step of a dopant ion for forming source and drain regions (S and D) is divided into one implantation of a dopant ion for forming a p/n junction with a well region (3), and one implantation of a dopant ion that does not influence a position of the p/n junction between the source and drain regions (S and D) and the well region with a shallow implantation depth and’ a large implantation amount. After conducting an activation heat treatment of the dopant, a surface of the source/drain region is made into cobalt silicide 12, so that the source/drain region (S and D) can have a low resistance, and a p/n junction leakage can be reduced.

公开(公告)号：US20050250269A1

公开(公告)日：2005-11-10

申请号：US11169574

申请日：2005-06-30

申请人： Shinichi Fukada ,  Naotaka Hashimoto ,  Masanori Kojima ,  Hiroshi Momiji ,  Hiromi Abe ,  Masayuki Suzuki

发明人： Shinichi Fukada ,  Naotaka Hashimoto ,  Masanori Kojima ,  Hiroshi Momiji ,  Hiromi Abe ,  Masayuki Suzuki

IPC分类号： H01L21/336 ,  H01L21/8238 ,  H01L21/338 ,  H01L21/44 ,  H01L21/4763

CPC分类号： H01L29/6659 ,  H01L21/2652 ,  H01L21/28518 ,  H01L21/823814 ,  H01L21/823835 ,  H01L21/823842 ,  H01L29/665 ,  H01L29/66545 ,  H01L29/7833

摘要： An implantation step of a dopant ion for forming source and drain regions (S and D) is divided into one implantation of a dopant ion for forming a p/n junction with a well region (3), and one implantation of a dopant ion that does not influence a position of the p/n junction between the source and drain regions (S and D) and the well region with a shallow implantation depth and a large implantation amount. After conducting an activation heat treatment of the dopant, a surface of the source/drain region is made into cobalt silicide 12, so that the source/drain region (S and D) can have a low resistance, and a p/n junction leakage can be reduced.