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1.发明申请公开(公告)号：US20070200375A1
公开(公告)日：2007-08-30
申请号：US11669270
申请日：2007-01-31
申请人： Kaoru Ito , Hiroyasu Miyamoto , Sohta Norikane
发明人： Kaoru Ito , Hiroyasu Miyamoto , Sohta Norikane
IPC分类号： B60R19/18
CPC分类号： B60R19/18 , B60R2019/186 , B60R2019/1893
摘要： It is an object of the present invention to provide a shock absorbing structure for a vehicle that enables a simple and appropriate tuning of a load displacement characteristic, so that a desired amount of collision energy can be absorbed. In the present invention, each of two side walls which is integrally provided with top wall, to which a shock is applied, has a rectangular wave shape corrugated at a plurality of corrugated sections positioned to be opposed to each other in a direction perpendicular to a direction in which the shock is applied. In addition, outer flanges are integrally formed on an end section of each of the side walls, and a slit extending in the direction in which the shock is applied is formed on each of the corrugated sections.
摘要翻译： 本发明的目的是提供一种用于车辆的减震结构，其能够简单且适当地调整负载位移特性，从而可以吸收所需量的碰撞能量。 在本发明中，一体地设置有施加有冲击的顶壁的两个侧壁中的每一个具有波纹状波纹状的矩形波形，多个波纹部分被定位成在垂直于 施加冲击的方向。 此外，外凸缘一体地形成在每个侧壁的端部上，并且在每个波纹部分上形成有沿施加冲击的方向延伸的狭缝。
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公开(公告)号：US20100102461A1
公开(公告)日：2010-04-29
申请号：US12588643
申请日：2009-10-22
CPC分类号： H01L23/3135 , H01L23/3121 , H01L23/562 , H01L25/0655 , H01L2224/48091 , H01L2224/48227 , H01L2224/49171 , H01L2924/00014 , H01L2924/00
摘要： A semiconductor device including a substrate, a semiconductor chip mounted on the substrate, and an encapsulation resin encapsulating the semiconductor chip, wherein the encapsulation resin contains a first resin region composed of a first resin composition, a second resin region composed of a second resin composition, and a mixed layer formed between the first resin region and the second resin region so as to have the first resin composition and the second resin composition mixed therein is provided.
摘要翻译： 一种半导体器件，包括衬底，安装在衬底上的半导体芯片和封装半导体芯片的封装树脂，其中封装树脂包含由第一树脂组合物构成的第一树脂区域，由第二树脂组合物构成的第二树脂区域 并且设置在第一树脂区域和第二树脂区域之间形成的混合层以使第一树脂组合物和第二树脂组合物混合在一起。
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公开(公告)号：US07677616B2
公开(公告)日：2010-03-16
申请号：US12038244
申请日：2008-02-27
IPC分类号： B60R19/34
CPC分类号： B60R19/18 , B60R2019/1873
摘要： A bumper absorber includes an upper leg and a lower leg, each of which extends in a longitudinal direction of an automobile, and a spanning portion. The spanning portion connects the upper leg and the lower leg, and faces an outer surface side of the bumper absorber in a longitudinal direction of the automobile. Each of the upper leg and the lower leg includes a buckling inductive portion that serves as a starting point of the buckling that is caused when the spanning portion receives an impact load. The buckling inductive portion is formed as an angular transition portion in which the angle of inclination between inner side surfaces changes. The inner side surfaces mutually face between the upper leg and the lower leg that include the buckling inductive portion.
摘要翻译： 保险杠吸收器包括大腿和小腿，每个腿在汽车的纵向方向上延伸，并且跨越部分。 跨越部分连接上腿和小腿，并且在汽车的纵向方向上面对保险杠吸收体的外表面侧。 上腿和下腿中的每一个包括作为在跨越部分接收冲击载荷时引起的屈曲起始点的屈曲感应部分。 屈曲感应部形成为内侧面的倾斜角度变化的角度过渡部。 内侧表面相互面对在包括屈曲感应部分的上腿和下腿之间。
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公开(公告)号：US20100176517A1
公开(公告)日：2010-07-15
申请号：US12654834
申请日：2010-01-06
IPC分类号： H01L23/28
CPC分类号： H01L23/3121 , B29C45/02 , B29C45/1671 , H01L21/565 , H01L23/3185 , H01L24/48 , H01L24/49 , H01L25/0655 , H01L25/0657 , H01L2224/48091 , H01L2224/48227 , H01L2224/49171 , H01L2225/0651 , H01L2924/00014 , H01L2924/181 , H01L2924/1815 , H05K3/284 , H05K2201/0187 , H05K2201/09972 , H05K2203/1316 , H01L2924/00 , H01L2924/00012 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： Differences in contraction forces of a sealing resin can be alleviated and strain on a package can be reduced even when electronic components are unevenly positioned on a substrate. An electronic device (100) includes a substrate 102, electronic components (104, 108) mounted on one face of the substrate 102, and a sealing resin 118 formed on the one face of the substrate 102 and which seals the electronic components. The sealing resin 118 includes a first resin region 120 made up of a first resin composition and a second resin region 122 made up of a second resin composition, and is formed so as to have, as seen in planar view, a region in which only the first resin region 120 exists and a region in which only the second resin region 122 exists.
摘要翻译： 密封树脂的收缩力的差异可以减轻，即使当电子部件不均匀地定位在基板上时，也可以减小包装上的应变。 电子设备（100）包括衬底102，安装在衬底102的一个面上的电子部件（104,108）以及形成在衬底102的一个面上并密封电子部件的密封树脂118。 密封树脂118包括由第一树脂组合物构成的第一树脂区域120和由第二树脂组合物构成的第二树脂区域122，并且形成为具有如平面图所示的区域，其中仅仅 存在第一树脂区域120和仅存在第二树脂区域122的区域。
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5.发明授权公开(公告)号：US07533927B2
公开(公告)日：2009-05-19
申请号：US11669270
申请日：2007-01-31
申请人： Kaoru Ito , Hiroyasu Miyamoto , Sohta Norikane
发明人： Kaoru Ito , Hiroyasu Miyamoto , Sohta Norikane
IPC分类号： B60R19/18
CPC分类号： B60R19/18 , B60R2019/186 , B60R2019/1893
摘要： It is an object of the present invention to provide a shock absorbing structure for a vehicle that enables a simple and appropriate tuning of a load displacement characteristic, so that a desired amount of collision energy can be absorbed. In the present invention, each of two side walls which is integrally provided with top wall, to which a shock is applied, has a rectangular wave shape corrugated at a plurality of corrugated sections positioned to be opposed to each other in a direction perpendicular to a direction in which the shock is applied. In addition, outer flanges are integrally formed on an end section of each of the side walls, and a slit extending in the direction in which the shock is applied is formed on each of the corrugated sections.
摘要翻译： 本发明的目的是提供一种用于车辆的减震结构，其能够简单且适当地调整负载位移特性，从而可以吸收所需量的碰撞能量。 在本发明中，一体地设置有施加有冲击的顶壁的两个侧壁中的每一个具有波纹状波纹状的矩形波形，多个波纹部分被定位成在垂直于 施加冲击的方向。 此外，外凸缘一体地形成在每个侧壁的端部上，并且在每个波纹部分上形成有沿施加冲击的方向延伸的狭缝。
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公开(公告)号：US20080217936A1
公开(公告)日：2008-09-11
申请号：US12038244
申请日：2008-02-27
IPC分类号： B60R19/30
CPC分类号： B60R19/18 , B60R2019/1873
摘要： A bumper absorber (2) includes an upper leg (2b) and a lower leg (2c), each of which extends in a longitudinal direction of an automobile, and a spanning portion (2d). The spanning portion (2d) connects the upper leg (2b) and the lower leg (2c), and faces an outer surface side of the bumper absorber (2) in a longitudinal direction of the automobile. Each of the upper leg (2b) and the lower leg (2c) includes a buckling inductive portion (2f that serves as a starting point of the buckling that is caused when the spanning portion (2d) receives an impact load. The buckling inductive portion (2f) is formed as an angular transition portion in which the angle of inclination between inner side surfaces changes. The inner side surfaces mutually face between the upper leg (2b) and the lower leg (2c) that include the buckling inductive portion (2f).
摘要翻译： 保险杠吸收器（2）包括上部腿部（2b）和一个小腿部（2c），每个腿部沿着汽车的纵向方向延伸，并且跨越部分（2d）。 跨越部分（2d）连接上腿部（2b）和下腿部（2c），并且在汽车的纵向方向上面对保险杠吸收器（2）的外表面侧。 上腿部（2b）和下腿部（2c）中的每一个都包括一个屈曲感应部分（2f），用于当跨越部分（2d）接收冲击载荷时引起的屈曲起始点。 弯曲感应部（2f）形成为内侧面的倾斜角度变化的角度过渡部，内侧面相互面对上腿（2b）与小腿（2c）之间， 包括屈曲感应部分（2f）。
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公开(公告)号：US07888809B2
公开(公告)日：2011-02-15
申请号：US12588643
申请日：2009-10-22
IPC分类号： H01L23/29
CPC分类号： H01L23/3135 , H01L23/3121 , H01L23/562 , H01L25/0655 , H01L2224/48091 , H01L2224/48227 , H01L2224/49171 , H01L2924/00014 , H01L2924/00
摘要： A semiconductor device including a substrate, a semiconductor chip mounted on the substrate, and an encapsulation resin encapsulating the semiconductor chip, wherein the encapsulation resin contains a first resin region composed of a first resin composition, a second resin region composed of a second resin composition, and a mixed layer formed between the first resin region and the second resin region so as to have the first resin composition and the second resin composition mixed therein is provided.
摘要翻译： 一种半导体器件，包括衬底，安装在衬底上的半导体芯片和封装半导体芯片的封装树脂，其中所述封装树脂包含由第一树脂组合物构成的第一树脂区域，由第二树脂组合物构成的第二树脂区域 并且设置在第一树脂区域和第二树脂区域之间形成的混合层以使第一树脂组合物和第二树脂组合物混合在一起。
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