公开(公告)号：US5804882A

公开(公告)日：1998-09-08

申请号：US651954

申请日：1996-05-21

申请人： Isao Tsukagoshi ,  Hiroshi Matsuoka ,  Yukihisa Hirosawa ,  Yoshikatsu Mikami ,  Hisashi Dokochi

发明人： Isao Tsukagoshi ,  Hiroshi Matsuoka ,  Yukihisa Hirosawa ,  Yoshikatsu Mikami ,  Hisashi Dokochi

IPC分类号： H01L21/60 ,  H01L23/498 ,  H05K3/32 ,  H01L13/12 ,  H01L23/48

CPC分类号： H01L24/83 ,  H01L23/49838 ,  H01L24/29 ,  H01L24/81 ,  H01L2224/0401 ,  H01L2224/05551 ,  H01L2224/05552 ,  H01L2224/13011 ,  H01L2224/13144 ,  H01L2224/16 ,  H01L2224/2919 ,  H01L2224/2929 ,  H01L2224/293 ,  H01L2224/81801 ,  H01L2224/83101 ,  H01L2224/8319 ,  H01L2224/838 ,  H01L2224/83851 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/0102 ,  H01L2924/01023 ,  H01L2924/01024 ,  H01L2924/01025 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01042 ,  H01L2924/01045 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/01057 ,  H01L2924/01058 ,  H01L2924/01061 ,  H01L2924/01073 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/07802 ,  H01L2924/0781 ,  H01L2924/09701 ,  H01L2924/10329 ,  H01L2924/14 ,  H05K3/321

摘要： A semiconductor device comprising a semiconductor chip, a wiring substrate, and an adhesive preferably containing electroconductive particles interposed therebetween, a plurality of spacer elements being present on or below the adhesive layer, said spacer elements having almost the same height as surrounding projecting electrodes and at least one shape selected from circles and polygons when viewed from the top, within an area surrounded by the connected electrodes, has a high flexural strength and high reliability and can be used for information cards, and the like.

摘要翻译： 一种半导体器件，包括半导体芯片，布线基板和优选地包含导电颗粒的粘合剂，在粘合剂层上或下方存在多个间隔元件，所述间隔元件具有与周围的突出电极几乎相同的高度，并且在 在从连接的电极包围的区域内从顶部观察时，从圆形和多边形中选择的至少一种形状具有高抗弯强度和高可靠性，并且可以用于信息卡等。

公开(公告)号：US5951918A

公开(公告)日：1999-09-14

申请号：US875779

申请日：1997-08-05

申请人： Hideji Kuwajima ,  Shozo Yamana ,  Junichi Kikuchi ,  Hisashi Dokochi ,  Toshikazu Ono ,  Yoshikatsu Mikami ,  Hiroshi Wada

发明人： Hideji Kuwajima ,  Shozo Yamana ,  Junichi Kikuchi ,  Hisashi Dokochi ,  Toshikazu Ono ,  Yoshikatsu Mikami ,  Hiroshi Wada

IPC分类号： H01B1/02 ,  H01B1/22 ,  H05K1/09 ,  B05D5/12 ,  B22F1/02

CPC分类号： H01B1/22 ,  H01B1/02 ,  H05K1/095

摘要： An electroconductive paste for forming an electric circuit which is low in resistivity, high in electroconductivity and minimized in change of resistivity even after a thermal shock test and/or a humidity and DC applied test, can be obtained by using a composite electroconductive powder comprising a flake-like electroconductive powder made of a material such as silver, a silver alloy, a silver-coated copper powder or a silver-coated copper alloy powder and an unsteady-shaped electroconductive powder such as a reduced silver powder. Also, by using a composite electroconductive powder comprising an electroconductive powder having an aspect ratio of 6 or greater and an electroconductive powder having an aspect ratio of 5 or less, there can be obtained an electroconductive paste which is low in resistivity, high in electroconductivity, minimized in change of resistivity even after a thermal shock test and/or a humidity and DC applied test, and capable of improving probability of contact between the electroconductive powder particles, elevating electroconductivity of the electric circuit, and also raising electroconductivity especially when a circuit is printed on a sheet-like substrate and the printed circuit is pressed. The electric circuit formed on the surface of a substrate by using such an electroconductive paste is low in resistivity, high in electroconductivity and also excellent in migration resistance.

摘要翻译： PCT No.PCT / JP96 / 00271 Sec。 371日期：1997年8月5日 102（e）日期1997年8月5日PCT提交1996年2月8日PCT公布。 公开号WO96 / 24938 日期1996年8月15日，即使在热冲击试验和/或湿度和直流施加试验之后，形成电阻率低，导电性高，电阻率变化最小的电路用导电糊也可以通过使用 包含由诸如银，银合金，银涂层铜粉或银涂覆铜合金粉末的材料制成的片状导电粉末和诸如还原银粉末的非稳态导电粉末的复合导电粉末。 此外，通过使用包含纵横比为6以上的导电性粉末和长径比为5以下的导电性粉末的复合导电性粉末，可以得到电导率低，导电性高的导电性糊剂， 即使在热冲击试验和/或湿度和DC施加试验之后电阻率的变化也最小化，并且能够提高导电粉末颗粒之间的接触概率，提高电路的导电性，并且还提高导电性，特别是当电路为 印刷在片状基板上，印刷电路被按压。 通过使用这种导电膏在基板的表面上形成的电路电阻率低，导电性高，耐迁移性优异。