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    METHOD OF FABRICATING IMAGE SENSOR AND REWORKING METHOD THEREOF
    1.
    发明申请
    METHOD OF FABRICATING IMAGE SENSOR AND REWORKING METHOD THEREOF 有权
    制作图像传感器的方法及其制作方法

    公开(公告)号：US20110212567A1

    公开(公告)日：2011-09-01

    申请号：US12714093

    申请日：2010-02-26

    Applicant: Hsin-Ting TSAI ,  Cheng-Hung Yu ,  Chin-Kuang Liu ,  Kun-Yen Hsu

    Inventor： Hsin-Ting TSAI ,  Cheng-Hung Yu ,  Chin-Kuang Liu ,  Kun-Yen Hsu

    IPC: H01L31/0232 ,  H01L31/18 ,  H01L27/14

    CPC classification number: H01L27/14687 ,  H01L27/14636 ,  H01L27/14685

    Abstract: A method of fabricating an image sensor device is provided. First, a substrate comprising a pixel array region and a pad region is provided. A patterned metal layer and a first planarization layer having an opening exposing the patterned metal layer in the pad region are sequentially formed on the substrate. A color filter array is formed on the first planarization layer in the pixel array region. A second planarization layer is formed to cover the color filter array and filled into the opening. A plurality of microlens is formed above the color filter array on the second planarization layer. A capping layer is conformally formed on the microlens and the second planarization layer. An etching step is performed to remove the capping layer and the second planarization layer in the opening so as to expose the patterned metal layer in the pad region.

    Abstract translation: 提供一种制造图像传感器装置的方法。 首先，提供包括像素阵列区域和衬垫区域的衬底。 图案化金属层和具有露出焊盘区域中的图案化金属层的开口的第一平坦化层依次形成在基板上。 在像素阵列区域中的第一平坦化层上形成滤色器阵列。 形成第二平坦化层以覆盖滤色器阵列并填充到开口中。 在第二平坦化层上的滤色器阵列上方形成多个微透镜。 覆盖层保形地形成在微透镜和第二平坦化层上。 执行蚀刻步骤以去除开口中的覆盖层和第二平坦化层，以暴露焊盘区域中的图案化金属层。

    METHOD FOR FABRICATING AN IMAGE SENSOR
    2.
    发明申请
    METHOD FOR FABRICATING AN IMAGE SENSOR 有权
    制作图像传感器的方法

    公开(公告)号：US20090294888A1

    公开(公告)日：2009-12-03

    申请号：US12128600

    申请日：2008-05-28

    Applicant: Hsin-Ting Tsai ,  Cheng-Hung Yu

    Inventor： Hsin-Ting Tsai ,  Cheng-Hung Yu

    IPC: H01L31/0216 ,  G03F7/20

    CPC classification number: H01L27/14685 ,  G03F7/2022 ,  H01L27/14627 ,  H01L27/14643

    Abstract: A method for fabricating an image sensor is disclosed. First, a semiconductor substrate is provided, in which a photosensitive region is defined on the semiconductor substrate. At least one photosensitive material is then formed on the semiconductor substrate, and a first exposure process is performed to form a tapered pattern in the photosensitive material. A second exposure process is performed to form a straight foot pattern in the photosensitive material, and a developing process is performed to remove the tapered pattern and straight foot pattern to form the photosensitive material into a plurality of photosensitive blocks. A reflow process is conducted thereafter to form the photosensitive blocks into a plurality of microlenses.

    Abstract translation: 公开了一种用于制造图像传感器的方法。 首先，提供半导体衬底，其中光敏区被限定在半导体衬底上。 然后在半导体衬底上形成至少一种感光材料，并进行第一曝光处理以在感光材料中形成锥形图案。 执行第二曝光处理以在感光材料中形成直脚图案，并且进行显影处理以去除锥形图案和直脚图案以将感光材料形成为多个感光块。 此后进行回流处理以将感光块形成多个微透镜。

    Method for fabricating an image sensor
    3.
    发明授权
    Method for fabricating an image sensor 有权
    图像传感器的制造方法

    公开(公告)号：US08137901B2

    公开(公告)日：2012-03-20

    申请号：US12128600

    申请日：2008-05-28

    Applicant: Hsin-Ting Tsai ,  Cheng-Hung Yu

    Inventor： Hsin-Ting Tsai ,  Cheng-Hung Yu

    IPC: G03F7/20

    CPC classification number: H01L27/14685 ,  G03F7/2022 ,  H01L27/14627 ,  H01L27/14643

    Abstract: A method for fabricating an image sensor is disclosed. First, a semiconductor substrate is provided, in which a photosensitive region is defined on the semiconductor substrate. At least one photosensitive material is then formed on the semiconductor substrate, and a first exposure process is performed to form a tapered pattern in the photosensitive material. A second exposure process is performed to form a straight foot pattern in the photosensitive material, and a developing process is performed to remove the tapered pattern and straight foot pattern to form the photosensitive material into a plurality of photosensitive blocks. A reflow process is conducted thereafter to form the photosensitive blocks into a plurality of microlenses.

    Abstract translation: 公开了一种用于制造图像传感器的方法。 首先，提供半导体衬底，其中光敏区被限定在半导体衬底上。 然后在半导体衬底上形成至少一种感光材料，并进行第一曝光处理以在感光材料中形成锥形图案。 执行第二曝光处理以在感光材料中形成直脚图案，并且进行显影处理以去除锥形图案和直脚图案以将感光材料形成为多个感光块。 此后进行回流处理以将感光块形成多个微透镜。

    Method of fabricating image sensor and reworking method thereof
    5.
    发明授权
    Method of fabricating image sensor and reworking method thereof 有权
    图像传感器的制作方法及其返工方法

    公开(公告)号：US08084289B2

    公开(公告)日：2011-12-27

    申请号：US12714093

    申请日：2010-02-26

    Applicant: Hsin-Ting Tsai ,  Cheng-Hung Yu ,  Chin-Kuang Liu ,  Kun-Yen Hsu

    Inventor： Hsin-Ting Tsai ,  Cheng-Hung Yu ,  Chin-Kuang Liu ,  Kun-Yen Hsu

    IPC: H01L21/00

    CPC classification number: H01L27/14687 ,  H01L27/14636 ,  H01L27/14685

    Abstract: A method of fabricating an image sensor device is provided. First, a substrate comprising a pixel array region and a pad region is provided. A patterned metal layer and a first planarization layer having an opening exposing the patterned metal layer in the pad region are sequentially formed on the substrate. A color filter array is formed on the first planarization layer in the pixel array region. A second planarization layer is formed to cover the color filter array and filled into the opening. A plurality of microlens is formed above the color filter array on the second planarization layer. A capping layer is conformally formed on the microlens and the second planarization layer. An etching step is performed to remove the capping layer and the second planarization layer in the opening so as to expose the patterned metal layer in the pad region.

    Abstract translation: 提供一种制造图像传感器装置的方法。 首先，提供包括像素阵列区域和衬垫区域的衬底。 图案化金属层和具有露出焊盘区域中的图案化金属层的开口的第一平坦化层依次形成在基板上。 在像素阵列区域中的第一平坦化层上形成滤色器阵列。 形成第二平坦化层以覆盖滤色器阵列并填充到开口中。 在第二平坦化层上的滤色器阵列上方形成多个微透镜。 覆盖层保形地形成在微透镜和第二平坦化层上。 执行蚀刻步骤以去除开口中的覆盖层和第二平坦化层，以暴露焊盘区域中的图案化金属层。

    Developer cup
    6.
    发明授权
    Developer cup 有权
    开发者杯

    公开(公告)号：US6132113A

    公开(公告)日：2000-10-17

    申请号：US306260

    申请日：1999-05-06

    Applicant: Cheng-Hung Yu ,  Hsin-Min Lee ,  Yung-Chi Wu ,  Hsin-Ting Tsai

    Inventor： Cheng-Hung Yu ,  Hsin-Min Lee ,  Yung-Chi Wu ,  Hsin-Ting Tsai

    IPC: G03F7/30 ,  H01L21/00 ,  H01L21/687 ,  G03D5/00

    CPC classification number: H01L21/68785 ,  G03F7/3021 ,  H01L21/6715 ,  H01L21/68792

    Abstract: A developer cup. The developer cup includes a bed. A central spindle is vertically and rotatably coupled to a center of the bed through an end of the central spindle. A chuck is vertically coupled to an end of the central spindle opposite to the bed end. An upper coupling is coupled to the central spindle between the chuck and the bed, wherein the chuck. A lower coupling is moveably coupled to the central spindle between the upper coupling and the bed. The annular cup has an upper wheel and a lower wheel, wherein the upper wheel is aligned with the lower wheel, the upper wheel is coupled to the lower wheel through a plurality of the brackets, and the lower wheel is smaller than the upper wheel.

    Abstract translation: 开瓶杯 显影杯包括一张床。 中心主轴通过中心主轴的一端垂直并可旋转地联接到床的中心。 卡盘垂直联接到与床端相对的中心轴的端部。 上连接件联接到卡盘和床之间的中心轴，其中卡盘。 下联接件可移动地联接到上联接器和床之间的中心主轴。 环形杯具有上轮和下轮，其中上轮与下轮对准，上轮通过多个托架联接到下轮，并且下轮小于上轮。

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