公开(公告)号：US20080182432A1

公开(公告)日：2008-07-31

申请号：US11756634

申请日：2007-06-01

Applicant: Kuan-Jui Huang ,  Chang-Ping Wang ,  Hsiu-Ming Li ,  Shih-Min Huang ,  Hui-Chen Kuo ,  Chia-Chun Chen

Inventor： Kuan-Jui Huang ,  Chang-Ping Wang ,  Hsiu-Ming Li ,  Shih-Min Huang ,  Hui-Chen Kuo ,  Chia-Chun Chen

IPC: H01R12/00

CPC classification number: H01L25/0657 ,  H01L21/4846 ,  H01L21/486 ,  H01L21/6835 ,  H01L23/15 ,  H01L2224/14 ,  H01L2224/16237 ,  H01L2224/48137 ,  H01L2224/4823 ,  H01L2224/49109 ,  H01L2225/06517 ,  H01L2225/06572 ,  H01L2924/01079 ,  H01L2924/14 ,  Y10T29/49117 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/49155 ,  Y10T29/49165

Abstract: The invention discloses an interposer used for connecting a plurality of chips. The interposer includes a connective substrate and at least a through via disposed in the connective substrate. The connective substrate has a first surface and a second surface. The through via acts as a connector, and is electrically connected to the first surface and the second surface. The first surface and the second surface are electrically connected to at least a first chip and a second chip respectively. In addition, the first chip and the second chip are electrically connected by the through via.

Abstract translation: 本发明公开了一种用于连接多个芯片的插入器。 插入器包括连接基板和设置在连接基板中的至少通孔。 连接基板具有第一表面和第二表面。 通孔作为连接器，并且电连接到第一表面和第二表面。 第一表面和第二表面分别电连接至至少第一芯片和第二芯片。 此外，第一芯片和第二芯片通过通孔电连接。

公开(公告)号：US07987588B2

公开(公告)日：2011-08-02

申请号：US12273550

申请日：2008-11-19

Applicant: Kuan-Jui Huang ,  Chang-Ping Wang ,  Hsiu-Ming Li ,  Shih-Min Huang ,  Hui-Chen Kuo ,  Chia-Chun Chen

Inventor： Kuan-Jui Huang ,  Chang-Ping Wang ,  Hsiu-Ming Li ,  Shih-Min Huang ,  Hui-Chen Kuo ,  Chia-Chun Chen

IPC: H05K3/02

CPC classification number: H01L25/0657 ,  H01L21/4846 ,  H01L21/486 ,  H01L21/6835 ,  H01L23/15 ,  H01L2224/14 ,  H01L2224/16237 ,  H01L2224/48137 ,  H01L2224/4823 ,  H01L2224/49109 ,  H01L2225/06517 ,  H01L2225/06572 ,  H01L2924/01079 ,  H01L2924/14 ,  Y10T29/49117 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/49155 ,  Y10T29/49165

Abstract: The invention discloses an interposer used for connecting a plurality of chips. The interposer includes a connective substrate and at least a through via disposed in the connective substrate. The connective substrate has a first surface and a second surface. The through via acts as a connector, and is electrically connected to the first surface and the second surface. The first surface and the second surface are electrically connected to at least a first chip and a second chip respectively. In addition, the first chip and the second chip are electrically connected by the through via.

Abstract translation: 本发明公开了一种用于连接多个芯片的插入器。 插入器包括连接基板和设置在连接基板中的至少通孔。 连接基板具有第一表面和第二表面。 通孔作为连接器，并且电连接到第一表面和第二表面。 第一表面和第二表面分别电连接至至少第一芯片和第二芯片。 此外，第一芯片和第二芯片通过通孔电连接。

公开(公告)号：US20090064496A1

公开(公告)日：2009-03-12

申请号：US12273550

申请日：2008-11-19

Applicant: Kuan-Jui Huang ,  Chang-Ping Wang ,  Hsiu-Ming Li ,  Shih-Min Huang ,  Hui-Chen Kuo ,  Chia-Chun Chen

Inventor： Kuan-Jui Huang ,  Chang-Ping Wang ,  Hsiu-Ming Li ,  Shih-Min Huang ,  Hui-Chen Kuo ,  Chia-Chun Chen

IPC: H05K3/10

CPC classification number: H01L25/0657 ,  H01L21/4846 ,  H01L21/486 ,  H01L21/6835 ,  H01L23/15 ,  H01L2224/14 ,  H01L2224/16237 ,  H01L2224/48137 ,  H01L2224/4823 ,  H01L2224/49109 ,  H01L2225/06517 ,  H01L2225/06572 ,  H01L2924/01079 ,  H01L2924/14 ,  Y10T29/49117 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/49155 ,  Y10T29/49165

Abstract: The invention discloses an interposer used for connecting a plurality of chips. The interposer includes a connective substrate and at least a through via disposed in the connective substrate. The connective substrate has a first surface and a second surface. The through via acts as a connector, and is electrically connected to the first surface and the second surface. The first surface and the second surface are electrically connected to at least a first chip and a second chip respectively. In addition, the first chip and the second chip are electrically connected by the through via.

Abstract translation: 本发明公开了一种用于连接多个芯片的插入器。 插入器包括连接基板和设置在连接基板中的至少通孔。 连接基板具有第一表面和第二表面。 通孔作为连接器，并且电连接到第一表面和第二表面。 第一表面和第二表面分别电连接至至少第一芯片和第二芯片。 此外，第一芯片和第二芯片通过通孔电连接。

公开(公告)号：US20080188024A1

公开(公告)日：2008-08-07

申请号：US11735498

申请日：2007-04-16

Applicant: Kuan-Jui Huang ,  Hsiu-Ming Li ,  Shih-Min Huang ,  Chia-Chun Chen ,  Hui-Chen Kuo

Inventor： Kuan-Jui Huang ,  Hsiu-Ming Li ,  Shih-Min Huang ,  Chia-Chun Chen ,  Hui-Chen Kuo

IPC: H01L21/00

CPC classification number: B81C1/00095

Abstract: A method of fabricating micro mechanical moving member and metal interconnects thereof. A first metal interconnect pattern and a second metal interconnect pattern disposed thereon are formed on a substrate by plating processes. Subsequently, an inter-metal dielectric layer is formed on the substrate, the first metal interconnect pattern and the second metal interconnect pattern. The inter-metal dielectric layer is then planarized and the second metal interconnect pattern is exposed. After that, at least one micro mechanical moving member electrically connected to the second metal interconnect pattern is formed on the inter-metal dielectric layer by plating techniques.

Abstract translation: 一种制造微机械移动构件及其金属互连的方法。 通过电镀工艺在衬底上形成设置在其上的第一金属互连图案和第二金属互连图案。 随后，在衬底，第一金属互连图案和第二金属互连图案上形成金属间介电层。 然后将金属间介电层平坦化，并暴露第二金属互连图案。 之后，通过电镀技术在金属间介电层上形成电连接到第二金属布线图形的至少一个微机械移动部件。