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公开(公告)号：US08462331B2
公开(公告)日：2013-06-11
申请号：US12914406
申请日：2010-10-28
申请人： Beng So Ryu , Hong-Jin Jung , Byong-Shik Lee , Bum-Joong Kim , Hyeon-Sam Jang , Hark-Yong Kim , Jong-Ho Kwak , Young-Yong Kim , Sun-Young Hong
发明人： Beng So Ryu , Hong-Jin Jung , Byong-Shik Lee , Bum-Joong Kim , Hyeon-Sam Jang , Hark-Yong Kim , Jong-Ho Kwak , Young-Yong Kim , Sun-Young Hong
CPC分类号： H01L21/68 , B23K26/048 , B23K26/0861 , B23K26/705 , H01L21/67092 , H01L22/12
摘要： The present disclosure relates to laser processing and a laser processing apparatus for processing materials using laser. Processing performed after loading a wafer on a work stage and a laser processing apparatus for implementing such processing, among others, are disclosed. The laser processing includes loading a wafer on a work stage; determining the number of chips formed on the wafer loaded on the work stage, performing chip defect inspection and aligning the wafer while moving the work stage; measuring a height of a surface of the wafer loaded on the work stage using a displacement sensor; monitoring output power of a processing laser using a power meter; and shifting the work stage while irradiating a laser beam on the wafer to process the wafer.
摘要翻译： 本公开涉及激光加工和用于使用激光加工材料的激光加工装置。 公开了在工作台上加载晶片之后进行的处理以及用于实现这种处理的激光加工装置等。 激光加工包括将晶片装载在工作台上; 确定在载置在工作台上的晶片上形成的芯片的数量，执行芯片缺陷检查和对准晶片同时移动工作台; 使用位移传感器测量装载在工作台上的晶片的表面的高度; 使用功率计监测加工激光的输出功率; 并且在对晶片照射激光束的同时移动工作台以处理晶片。
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公开(公告)号：US08951889B2
公开(公告)日：2015-02-10
申请号：US13088024
申请日：2011-04-15
申请人： Beng So Ryu , Byong Shik Lee , Hyeon Sam Jang , Bum Joong Kim
发明人： Beng So Ryu , Byong Shik Lee , Hyeon Sam Jang , Bum Joong Kim
CPC分类号： B23K26/064 , B23K26/0006 , B23K26/032 , B23K26/0624 , B23K26/0853 , B23K26/53 , B23K2101/40 , B23K2103/50
摘要： There is provided a laser processing method of a sapphire substrate including preparing a sapphire substrate on which plural stacked portions spaced from each other are formed, irradiating a short pulse laser beam from a laser light source, making the laser beam irradiated from the laser light source pass through a beam shaping module, adjusting a position of a light concentrating unit or the sapphire substrate such that the laser beam is concentrated to the inside of the sapphire substrate through the light concentrating unit, and forming a phase transformation area within the sapphire substrate by irradiating the laser beam into the sapphire substrate. The laser beam is introduced into the sapphire substrate while avoiding an area where the stacked portions are formed on the sapphire substrate, so that the phase transformation area is formed within the sapphire substrate.
摘要翻译： 提供了一种蓝宝石衬底的激光加工方法，包括制备蓝宝石衬底，其上形成有彼此间隔开的多个层叠部分，照射来自激光源的短脉冲激光束，使得从激光光源照射的激光束 通过光束成形模块，调整聚光单元或蓝宝石衬底的位置，使得激光束通过聚光单元集中到蓝宝石衬底的内部，并通过蓝宝石衬底内的相变区域形成蓝宝石衬底内的相变区域 将激光束照射到蓝宝石衬底中。 激光束被引入到蓝宝石衬底中，同时避免在蓝宝石衬底上形成层叠部分的区域，使得在蓝宝石衬底内形成相变区域。
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公开(公告)号：US08993924B2
公开(公告)日：2015-03-31
申请号：US13097909
申请日：2011-04-29
申请人： Beng So Ryu , Byong Shik Lee , Hyeon Sam Jang , Bum Joong Kim
发明人： Beng So Ryu , Byong Shik Lee , Hyeon Sam Jang , Bum Joong Kim
CPC分类号： C03B33/091 , B23K26/0006 , B23K26/0624 , B23K26/0648 , B23K26/0736 , B23K26/0853 , B23K26/0869 , B23K26/53 , B23K2101/40 , B23K2103/56 , C03B33/0222
摘要： There is provided a target object processing method capable of self-breaking a target object with a laser beam. The target object processing method includes: generating a laser beam from a laser beam source; correcting a divergence angle of the generated laser beam; and forming a spot by condensing the corrected laser beam to the inside of the target object. A shape or a size of the spot is adjusted by correcting the divergence angle of the laser beam, a phase transformation area is formed within the target object by the spot, and the target object is subject to self-breaking with the phase transformation area as the starting point.
摘要翻译： 提供了能够用激光束自我破坏目标物体的目标物体处理方法。 目标对象处理方法包括：从激光束源产生激光束; 校正所产生的激光束的发散角; 并且通过将校正的激光束聚焦到目标对象的内部来形成点。 通过校正激光束的发散角度来调整斑点的形状或尺寸，通过斑点在目标物体内形成相变区域，并且将目标物体以相变区域自破为止 起点。
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公开(公告)号：US20120043474A1
公开(公告)日：2012-02-23
申请号：US12914406
申请日：2010-10-28
申请人： Beng So RYU , Hong-Jin JUNG , Byong-Shik LEE , Bum-Joong KIM , Hyeon-Sam JANG , Hark-Yong KIM , Jong-Ho KWAK , Young-Yong KIM , Sun-Young HONG
发明人： Beng So RYU , Hong-Jin JUNG , Byong-Shik LEE , Bum-Joong KIM , Hyeon-Sam JANG , Hark-Yong KIM , Jong-Ho KWAK , Young-Yong KIM , Sun-Young HONG
CPC分类号： H01L21/68 , B23K26/048 , B23K26/0861 , B23K26/705 , H01L21/67092 , H01L22/12
摘要： The present disclosure relates to laser processing and a laser processing apparatus for processing materials using laser. Processing performed after loading a wafer on a work stage and a laser processing apparatus for implementing such processing, among others, are disclosed. The laser processing includes loading a wafer on a work stage; determining the number of chips formed on the wafer loaded on the work stage, performing chip defect inspection and aligning the wafer while moving the work stage; measuring a height of a surface of the wafer loaded on the work stage using a displacement sensor; monitoring output power of a processing laser using a power meter; and shifting the work stage while irradiating a laser beam on the wafer to process the wafer.
摘要翻译： 本公开涉及激光加工和用于使用激光加工材料的激光加工装置。 公开了在工作台上加载晶片之后进行的处理以及用于实现这种处理的激光加工装置等。 激光加工包括将晶片装载在工作台上; 确定在载置在工作台上的晶片上形成的芯片的数量，执行芯片缺陷检查和对准晶片同时移动工作台; 使用位移传感器测量装载在工作台上的晶片的表面的高度; 使用功率计监测加工激光的输出功率; 并且在对晶片照射激光束的同时移动工作台以处理晶片。
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公开(公告)号：US20120190174A1
公开(公告)日：2012-07-26
申请号：US13088024
申请日：2011-04-15
申请人： Beng So RYU , Byong Shik LEE , Hyeon Sam JANG , Bum Joong KIM
发明人： Beng So RYU , Byong Shik LEE , Hyeon Sam JANG , Bum Joong KIM
CPC分类号： B23K26/064 , B23K26/0006 , B23K26/032 , B23K26/0624 , B23K26/0853 , B23K26/53 , B23K2101/40 , B23K2103/50
摘要： There is provided a laser processing method of a sapphire substrate including preparing a sapphire substrate on which plural stacked portions spaced from each other are formed, irradiating a short pulse laser beam from a laser light source, making the laser beam irradiated from the laser light source pass through a beam shaping module, adjusting a position of a light concentrating unit or the sapphire substrate such that the laser beam is concentrated to the inside of the sapphire substrate through the light concentrating unit, and forming a phase transformation area within the sapphire substrate by irradiating the laser beam into the sapphire substrate. The laser beam is introduced into the sapphire substrate while avoiding an area where the stacked portions are formed on the sapphire substrate, so that the phase transformation area is formed within the sapphire substrate.
摘要翻译： 提供了一种蓝宝石衬底的激光加工方法，包括制备蓝宝石衬底，其上形成有彼此间隔开的多个层叠部分，照射来自激光源的短脉冲激光束，使得从激光光源照射的激光束 通过光束成形模块，调整聚光单元或蓝宝石衬底的位置，使得激光束通过聚光单元集中到蓝宝石衬底的内部，并通过蓝宝石衬底内的相变区域形成蓝宝石衬底内的相变区域 将激光束照射到蓝宝石衬底中。 激光束被引入到蓝宝石衬底中，同时避免在蓝宝石衬底上形成层叠部分的区域，使得在蓝宝石衬底内形成相变区域。
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公开(公告)号：US20120111310A1
公开(公告)日：2012-05-10
申请号：US13097909
申请日：2011-04-29
申请人： Beng So RYU , Byong Shik LEE , Hyeon Sam JANG , Bum Joong KIM
发明人： Beng So RYU , Byong Shik LEE , Hyeon Sam JANG , Bum Joong KIM
IPC分类号： B28D1/00
CPC分类号： C03B33/091 , B23K26/0006 , B23K26/0624 , B23K26/0648 , B23K26/0736 , B23K26/0853 , B23K26/0869 , B23K26/53 , B23K2101/40 , B23K2103/56 , C03B33/0222
摘要： There is provided a target object processing method capable of self-breaking a target object with a laser beam. The target object processing method includes: generating a laser beam from a laser beam source; correcting a divergence angle of the generated laser beam; and forming a spot by condensing the corrected laser beam to the inside of the target object. A shape or a size of the spot is adjusted by correcting the divergence angle of the laser beam, a phase transformation area is formed within the target object by the spot, and the target object is subject to self-breaking with the phase transformation area as the starting point.
摘要翻译： 提供了能够用激光束自我破坏目标物体的目标物体处理方法。 目标对象处理方法包括：从激光束源产生激光束; 校正所产生的激光束的发散角; 并且通过将校正的激光束聚焦到目标对象的内部来形成点。 通过校正激光束的发散角度来调整斑点的形状或尺寸，通过斑点在目标物体内形成相变区域，并且将目标物体以相变区域自破为止 起点。
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