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    LED CHIP TESTING DEVICE
    3.
    发明申请
    LED CHIP TESTING DEVICE 有权
    LED芯片测试设备

    公开(公告)号：US20110316579A1

    公开(公告)日：2011-12-29

    申请号：US13148980

    申请日：2009-12-24

    申请人： Beng So Ryu

    发明人： Beng So Ryu

    IPC分类号： G01R31/26

    CPC分类号： G01R31/2635 ,  G01R31/2887 ,  G01R31/2893

    摘要： The present invention provides an LED chip testing device that measures characteristics of an LED chip.The LED chip testing device includes: a rotation member that supports the LED chip and rotates the LED chip to a testing position where the characteristics of the LED chip are tested; and a tester installed next to the rotation member and serving to measure the characteristics of the LED chip at the testing position.

    摘要翻译： 本发明提供一种测量LED芯片特性的LED芯片测试装置。 LED芯片测试装置包括：支撑LED芯片并将LED芯片旋转到测试LED芯片的特性的测试位置的旋转部件; 以及安装在旋转构件旁边的测试仪，用于测量在测试位置的LED芯片的特性。

    APPARATUS AND METHOD FOR MANUFACTURING LIGHT-EMITTING DIODE
    4.
    发明申请
    APPARATUS AND METHOD FOR MANUFACTURING LIGHT-EMITTING DIODE 有权
    用于制造发光二极管的装置和方法

    公开(公告)号：US20110183449A1

    公开(公告)日：2011-07-28

    申请号：US13049490

    申请日：2011-03-16

    申请人： Beng So RYU

    发明人： Beng So RYU

    IPC分类号： H01L21/428 ,  B23K26/06

    CPC分类号： H01L33/0079 ,  B23K26/066 ,  H01L21/268 ,  Y10T156/1917

    摘要： An apparatus and method for manufacturing a light emitting devices by separating a semiconductor layer from a substrate includes a laser beam source for emitting a laser beam, a mesh-typed mask having a plurality of apertures through which the laser beam passes to provide a plurality of unit beams; and an imaging lens for forming a plurality of beam spots by focusing the plurality of unit beams at an interface between a substrate and a semiconductor layer to separate the substrate from the semiconductor layer.

    摘要翻译： 用于通过从衬底分离半导体层来制造发光器件的装置和方法包括用于发射激光束的激光束源，具有多个孔的网状掩模，激光束穿过该孔，以提供多个 单位梁; 以及成像透镜，用于通过在衬底和半导体层之间的界面处聚焦多个单位光束来形成多个光束点，以将衬底与半导体层分离。

    LED chip testing device
    5.
    发明授权
    LED chip testing device 有权
    LED芯片测试装置

    公开(公告)号：US08952717B2

    公开(公告)日：2015-02-10

    申请号：US13148980

    申请日：2009-12-24

    申请人： Beng So Ryu

    发明人： Beng So Ryu

    IPC分类号： G01R31/26 ,  G01R31/308 ,  B23Q7/12 ,  B07C5/02 ,  G01R31/28

    CPC分类号： G01R31/2635 ,  G01R31/2887 ,  G01R31/2893

    摘要： The present invention provides an LED chip testing device that measures characteristics of an LED chip.The LED chip testing device includes: a rotation member that supports the LED chip and rotates the LED chip to a testing position where the characteristics of the LED chip are tested; and a tester installed next to the rotation member and serving to measure the characteristics of the LED chip at the testing position.

    摘要翻译： 本发明提供一种测量LED芯片特性的LED芯片测试装置。 LED芯片测试装置包括：支撑LED芯片并将LED芯片旋转到测试LED芯片的特性的测试位置的旋转部件; 以及安装在旋转构件旁边的测试仪，用于测量在测试位置的LED芯片的特性。

    Laser processing method and laser processing apparatus
    7.
    发明授权
    Laser processing method and laser processing apparatus 有权
    激光加工方法和激光加工设备

    公开(公告)号：US08951889B2

    公开(公告)日：2015-02-10

    申请号：US13088024

    申请日：2011-04-15

    申请人： Beng So Ryu ,  Byong Shik Lee ,  Hyeon Sam Jang ,  Bum Joong Kim

    发明人： Beng So Ryu ,  Byong Shik Lee ,  Hyeon Sam Jang ,  Bum Joong Kim

    IPC分类号： H01L21/00 ,  B23K26/06 ,  B23K26/00 ,  B23K26/03 ,  B23K26/08

    CPC分类号： B23K26/064 ,  B23K26/0006 ,  B23K26/032 ,  B23K26/0624 ,  B23K26/0853 ,  B23K26/53 ,  B23K2101/40 ,  B23K2103/50

    摘要： There is provided a laser processing method of a sapphire substrate including preparing a sapphire substrate on which plural stacked portions spaced from each other are formed, irradiating a short pulse laser beam from a laser light source, making the laser beam irradiated from the laser light source pass through a beam shaping module, adjusting a position of a light concentrating unit or the sapphire substrate such that the laser beam is concentrated to the inside of the sapphire substrate through the light concentrating unit, and forming a phase transformation area within the sapphire substrate by irradiating the laser beam into the sapphire substrate. The laser beam is introduced into the sapphire substrate while avoiding an area where the stacked portions are formed on the sapphire substrate, so that the phase transformation area is formed within the sapphire substrate.

    摘要翻译： 提供了一种蓝宝石衬底的激光加工方法，包括制备蓝宝石衬底，其上形成有彼此间隔开的多个层叠部分，照射来自激光源的短脉冲激光束，使得从激光光源照射的激光束 通过光束成形模块，调整聚光单元或蓝宝石衬底的位置，使得激光束通过聚光单元集中到蓝宝石衬底的内部，并通过蓝宝石衬底内的相变区域形成蓝宝石衬底内的相变区域 将激光束照射到蓝宝石衬底中。 激光束被引入到蓝宝石衬底中，同时避免在蓝宝石衬底上形成层叠部分的区域，使得在蓝宝石衬底内形成相变区域。

    Apparatus and method for manufacturing light-emitting diode
    8.
    发明授权
    Apparatus and method for manufacturing light-emitting diode 有权
    用于制造发光二极管的装置和方法

    公开(公告)号：US08313961B2

    公开(公告)日：2012-11-20

    申请号：US13049490

    申请日：2011-03-16

    申请人： Beng So Ryu

    发明人： Beng So Ryu

    IPC分类号： H01L33/00

    CPC分类号： H01L33/0079 ,  B23K26/066 ,  H01L21/268 ,  Y10T156/1917

    摘要： An apparatus and method for manufacturing a light emitting devices by separating a semiconductor layer from a substrate includes a laser beam source for emitting a laser beam, a mesh-typed mask having a plurality of apertures through which the laser beam passes to provide a plurality of unit beams; and an imaging lens for forming a plurality of beam spots by focusing the plurality of unit beams at an interface between a substrate and a semiconductor layer to separate the substrate from the semiconductor layer.

    摘要翻译： 用于通过从衬底分离半导体层来制造发光器件的装置和方法包括用于发射激光束的激光束源，具有多个孔的网状掩模，激光束穿过该孔，以提供多个 单位梁; 以及成像透镜，用于通过在衬底和半导体层之间的界面处聚焦多个单位光束来形成多个光束点，以将衬底与半导体层分离。

    LASER PROCESSING METHOD AND LASER PROCESSING APPARATUS
    9.
    发明申请
    LASER PROCESSING METHOD AND LASER PROCESSING APPARATUS 有权
    激光加工方法和激光加工设备

    公开(公告)号：US20120190174A1

    公开(公告)日：2012-07-26

    申请号：US13088024

    申请日：2011-04-15

    申请人： Beng So RYU ,  Byong Shik LEE ,  Hyeon Sam JANG ,  Bum Joong KIM

    发明人： Beng So RYU ,  Byong Shik LEE ,  Hyeon Sam JANG ,  Bum Joong KIM

    IPC分类号： H01L21/78 ,  H05B7/18

    CPC分类号： B23K26/064 ,  B23K26/0006 ,  B23K26/032 ,  B23K26/0624 ,  B23K26/0853 ,  B23K26/53 ,  B23K2101/40 ,  B23K2103/50

    摘要： There is provided a laser processing method of a sapphire substrate including preparing a sapphire substrate on which plural stacked portions spaced from each other are formed, irradiating a short pulse laser beam from a laser light source, making the laser beam irradiated from the laser light source pass through a beam shaping module, adjusting a position of a light concentrating unit or the sapphire substrate such that the laser beam is concentrated to the inside of the sapphire substrate through the light concentrating unit, and forming a phase transformation area within the sapphire substrate by irradiating the laser beam into the sapphire substrate. The laser beam is introduced into the sapphire substrate while avoiding an area where the stacked portions are formed on the sapphire substrate, so that the phase transformation area is formed within the sapphire substrate.

    摘要翻译： 提供了一种蓝宝石衬底的激光加工方法，包括制备蓝宝石衬底，其上形成有彼此间隔开的多个层叠部分，照射来自激光源的短脉冲激光束，使得从激光光源照射的激光束 通过光束成形模块，调整聚光单元或蓝宝石衬底的位置，使得激光束通过聚光单元集中到蓝宝石衬底的内部，并通过蓝宝石衬底内的相变区域形成蓝宝石衬底内的相变区域 将激光束照射到蓝宝石衬底中。 激光束被引入到蓝宝石衬底中，同时避免在蓝宝石衬底上形成层叠部分的区域，使得在蓝宝石衬底内形成相变区域。

    TARGET OBJECT PROCESSING METHOD AND TARGET OBJECT PROCESSING APPARATUS
    10.
    发明申请
    TARGET OBJECT PROCESSING METHOD AND TARGET OBJECT PROCESSING APPARATUS 有权
    目标对象处理方法和目标对象处理装置

    公开(公告)号：US20120111310A1

    公开(公告)日：2012-05-10

    申请号：US13097909

    申请日：2011-04-29

    申请人： Beng So RYU ,  Byong Shik LEE ,  Hyeon Sam JANG ,  Bum Joong KIM

    发明人： Beng So RYU ,  Byong Shik LEE ,  Hyeon Sam JANG ,  Bum Joong KIM

    IPC分类号： B28D1/00

    CPC分类号： C03B33/091 ,  B23K26/0006 ,  B23K26/0624 ,  B23K26/0648 ,  B23K26/0736 ,  B23K26/0853 ,  B23K26/0869 ,  B23K26/53 ,  B23K2101/40 ,  B23K2103/56 ,  C03B33/0222

    摘要： There is provided a target object processing method capable of self-breaking a target object with a laser beam. The target object processing method includes: generating a laser beam from a laser beam source; correcting a divergence angle of the generated laser beam; and forming a spot by condensing the corrected laser beam to the inside of the target object. A shape or a size of the spot is adjusted by correcting the divergence angle of the laser beam, a phase transformation area is formed within the target object by the spot, and the target object is subject to self-breaking with the phase transformation area as the starting point.

    摘要翻译： 提供了能够用激光束自我破坏目标物体的目标物体处理方法。 目标对象处理方法包括：从激光束源产生激光束; 校正所产生的激光束的发散角; 并且通过将校正的激光束聚焦到目标对象的内部来形成点。 通过校正激光束的发散角度来调整斑点的形状或尺寸，通过斑点在目标物体内形成相变区域，并且将目标物体以相变区域自破为止 起点。