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公开(公告)号:US06558512B2
公开(公告)日:2003-05-06
申请号:US09441135
申请日:1999-11-17
Applicant: Hiroyoshi Ueno , Yoshihisa Kato , Isao Ichioka , Takekazu Adachi , Mamoru Murata , Hirokazu Hiraoka , Manabu Ochida , Masayuki Noda
Inventor: Hiroyoshi Ueno , Yoshihisa Kato , Isao Ichioka , Takekazu Adachi , Mamoru Murata , Hirokazu Hiraoka , Manabu Ochida , Masayuki Noda
IPC: B32B3120
CPC classification number: B32B5/26 , B32B5/022 , B32B15/14 , B32B15/20 , B32B37/00 , B32B37/10 , B32B38/0036 , B32B38/16 , B32B38/164 , B32B2260/021 , B32B2260/046 , B32B2262/0269 , B32B2305/28 , B32B2309/02 , B32B2311/12 , B32B2398/10 , B32B2457/08 , D21H13/26 , D21H17/52 , D21H21/18 , D21H25/06 , D21H27/30 , H05K1/0366 , H05K2201/0278 , H05K2201/0293 , H05K2203/1105 , Y10T428/249925 , Y10T428/249998 , Y10T428/31725 , Y10T428/31728 , Y10T442/20 , Y10T442/2951 , Y10T442/60 , Y10T442/696 , Y10T442/697 , Y10T442/699
Abstract: The present invention is to provide a base material for a laminate having a high strength, reduced thickness, and light weight. In the present invention, a base material is prepared by incorporating a thermosetting resin binder into a non-woven fabric of para-aramid fibers prepared by a wet type paper making, and then heating a plurality of the resultant non-woven fabric sheets under pressure. The non-woven fabric sheet comprises 95 to 70 mass % of the para-aramid fibers and 5 to 30 mass % of the thermosetting resin binder.
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2.
公开(公告)号:US20050118910A1
公开(公告)日:2005-06-02
申请号:US11030985
申请日:2005-01-10
Applicant: Hiroyoshi Ueno , Yoshihisa Kato , Isao Ichioka , Takekazu Adachi , Mamoru Murata , Hirokazu Hiraoka , Manabu Ochida , Masayuki Noda
Inventor: Hiroyoshi Ueno , Yoshihisa Kato , Isao Ichioka , Takekazu Adachi , Mamoru Murata , Hirokazu Hiraoka , Manabu Ochida , Masayuki Noda
IPC: B32B5/02 , B32B5/26 , B32B37/10 , C08J5/24 , D21H13/26 , D21H17/52 , D21H21/18 , D21H25/06 , D21H27/00 , D21H27/30 , H05K1/03 , D04H3/08 , B32B31/26
CPC classification number: B32B5/26 , B32B5/022 , B32B15/14 , B32B15/20 , B32B37/00 , B32B37/10 , B32B38/0036 , B32B38/16 , B32B38/164 , B32B2260/021 , B32B2260/046 , B32B2262/0269 , B32B2305/28 , B32B2309/02 , B32B2311/12 , B32B2398/10 , B32B2457/08 , D21H13/26 , D21H17/52 , D21H21/18 , D21H25/06 , D21H27/30 , H05K1/0366 , H05K2201/0278 , H05K2201/0293 , H05K2203/1105 , Y10T428/249925 , Y10T428/249998 , Y10T428/31725 , Y10T428/31728 , Y10T442/20 , Y10T442/2951 , Y10T442/60 , Y10T442/696 , Y10T442/697 , Y10T442/699
Abstract: The present invention is to provide a base material for a laminate having a high strength, reduced thickness, and light weight. In the present invention, a base material is prepared by incorporating a thermosetting resin binder into a non-woven fabric of para-aramid fibers prepared by a wet type paper making, and then heating a plurality of the resultant non-woven fabric sheets under pressure. The non-woven fabric sheet comprises 95 to 70 mass % of the para-aramid fibers and 5 to 30 mass % of the thermosetting resin binder.
Abstract translation: 本发明提供一种具有高强度,低厚度和轻质量的层压体的基材。 在本发明中,通过将热固性树脂粘合剂结合到通过湿式造纸制备的对位芳族聚酰胺纤维的无纺织物中,然后在压力下加热多个所得的无纺布片材来制备基材 。 无纺布片包含95〜70质量%的对位芳族聚酰胺纤维和5〜30质量%的热固性树脂粘合剂。
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