公开(公告)号：US20150017407A1

公开(公告)日：2015-01-15

申请号：US14502377

申请日：2014-09-30

申请人： Propex Operating Company LLC

发明人： Ian MacMillan Ward ,  Peter John Hine ,  Keith Norris

IPC分类号： B32B5/26 ,  B32B27/32 ,  B32B27/08

CPC分类号： B32B27/08 ,  B29C43/003 ,  B29C43/006 ,  B29C43/203 ,  B29C43/52 ,  B29K2105/0079 ,  B29K2105/06 ,  B29K2105/0854 ,  B29K2105/256 ,  B29L2009/00 ,  B32B5/024 ,  B32B5/26 ,  B32B27/32 ,  B32B27/36 ,  B32B2250/03 ,  B32B2250/20 ,  B32B2250/24 ,  B32B2250/242 ,  B32B2250/40 ,  B32B2262/0253 ,  B32B2262/0284 ,  B32B2307/536 ,  B32B2323/04 ,  B32B2323/10 ,  D04H1/559 ,  D04H13/00 ,  Y10S428/91 ,  Y10T428/24628 ,  Y10T428/24942 ,  Y10T428/2495 ,  Y10T428/24992 ,  Y10T428/249998 ,  Y10T428/31504

摘要： A process for the production of a polymeric article comprises: (a) forming a ply having successive layers, namely, (i) a first layer made up of strands of an oriented polymer material; (ii) a second layer of a polymeric material; (iii) a third layer made up of strands of an oriented polymeric material, wherein the second layer has a lower peak melting temperature that of the first and third layers; (b) subjecting the ply to conditions of time, temperature, and pressure sufficient to melt a proportion of the fits layer, to melt the second layer entirely, and to melt a proportion of the third layer, and to compact the ply; and (c) cooling the compacted ply. The resultant articles have good mechanical properties yet may be made at a lower compaction temperature than articles not employing the second layer, leading to a more controllable manufacturing process.

摘要翻译： 制备聚合物制品的方法包括：（a）形成具有连续层的层，即（i）由取向聚合物材料的线构成的第一层; （ii）第二层聚合材料; （iii）由取向聚合物材料的线构成的第三层，其中第二层具有较低的第一和第三层的峰值熔融温度; （b）对所述层进行足以熔化所述配合层的一部分的时间，温度和压力的条件，使所述第二层完全熔化并熔化所述第三层的一部分，并压制所述层; 和（c）冷却压实的层。 所得制品具有良好的机械性能，但可以在比不使用第二层的制品更低的压制温度下制成，导致更可控的制造工艺。

公开(公告)号：US20100089637A1

公开(公告)日：2010-04-15

申请号：US12421656

申请日：2009-04-10

申请人： JUIN-HONG LIN ,  PO-WEN CHAN ,  YU-LUN HO

发明人： JUIN-HONG LIN ,  PO-WEN CHAN ,  YU-LUN HO

IPC分类号： H05K5/00

CPC分类号： H05K9/0086 ,  H05K9/0088 ,  Y10T428/12389 ,  Y10T428/24851 ,  Y10T428/24893 ,  Y10T428/24909 ,  Y10T428/249998

摘要： An electronic device housing includes a substrate, a film structure, and a protective film. The film structure includes an adhesive film, a film stack, and a protective film. The adhesive film is deposited onto the substrate. The film stack is deposited onto the adhesive film alternating dielectric films and metal films. The metal films are non-continuous with a total thickness of the metal films at a predetermined value. The protective film is deposited onto an upper film of the film stack.

摘要翻译： 电子设备壳体包括基板，膜结构和保护膜。 膜结构包括粘合膜，膜叠层和保护膜。 粘合剂膜沉积在基底上。 将薄膜叠层沉积在粘合膜上交替介电薄膜和金属薄膜。 金属膜不连续，金属膜的总厚度为预定值。 保护膜沉积在膜堆叠的上膜上。

公开(公告)号：US20080075938A1

公开(公告)日：2008-03-27

申请号：US11923819

申请日：2007-10-25

申请人： Ching-Tang Wang ,  Wu-Tsang Tsai ,  Lung-Chuan Wang ,  Chung-Chih Feng ,  Chun-Wei Wu

发明人： Ching-Tang Wang ,  Wu-Tsang Tsai ,  Lung-Chuan Wang ,  Chung-Chih Feng ,  Chun-Wei Wu

IPC分类号： B32B7/02 ,  B32B27/40 ,  C08G69/00 ,  C08G73/00

CPC分类号： C08J5/18 ,  C08J7/047 ,  C08J2375/04 ,  C08J2475/00 ,  Y10T428/2495 ,  Y10T428/249998 ,  Y10T428/31551

摘要： A macromolecular laminate includes a main layer made of a first type of polyurethane resin compound that is liquid at room temperature. The first type of polyurethane resin compound is made through mixing polyurethane resin with solid content higher than 50% by weight with additives. An auxiliary layer may be formed on the main layer and made of a second type of polyurethane resin compound different from the first type of polyurethane resin compound.

摘要翻译： 大分子层叠体包括在室温下为液体的第一种聚氨酯树脂化合物制成的主层。 第一种类型的聚氨酯树脂化合物是通过混合具有高于50重量％的固体含量的聚氨酯树脂与添加剂制成的。 可以在主层上形成辅助层，并且由与第一种类型的聚氨酯树脂化合物不同的第二类型的聚氨酯树脂化合物制成。

公开(公告)号：US20070287004A1

公开(公告)日：2007-12-13

申请号：US11753603

申请日：2007-05-25

申请人： Andreas Gottzmann ,  Michel Ross ,  Aaron Shaw ,  Suzann Milheron

发明人： Andreas Gottzmann ,  Michel Ross ,  Aaron Shaw ,  Suzann Milheron

IPC分类号： B32B3/26 ,  C09J5/02

CPC分类号： B44C5/0476 ,  B44C5/0453 ,  Y10T428/249998

摘要： A method for the production of a decorative laminate having an abrasion-resistant, scuff- and mar-resistant overlay, wherein the method comprises forming an overlay, wherein the method of forming the overlay comprises: impregnating a first side of a substrate with a first thermosetting resin; coating the first side of the substrate with a layer of slurry comprising a second thermosetting resin and a mix of abrasion resistant particles, wherein the mix of abrasion resistant particles comprises at least about 5 percent of elliptical, platelet shaped abrasion resistant particles to form a composite; and curing the composite to form a cured composite.

摘要翻译： 一种用于生产具有耐磨损，抗磨损和耐磨损的覆盖层的装饰层压板的方法，其中所述方法包括形成覆盖层，其中形成覆盖层的方法包括：用第一衬底浸渍衬底的第一侧 热固性树脂; 用包括第二热固性树脂和耐磨颗粒混合物的浆料层涂覆基材的第一面，其中耐磨颗粒的混合物包含至少约5％的椭圆形，片状耐磨颗粒以形成复合材料 ; 并固化复合物以形成固化的复合材料。

公开(公告)号：US20050118910A1

公开(公告)日：2005-06-02

申请号：US11030985

申请日：2005-01-10

申请人： Hiroyoshi Ueno ,  Yoshihisa Kato ,  Isao Ichioka ,  Takekazu Adachi ,  Mamoru Murata ,  Hirokazu Hiraoka ,  Manabu Ochida ,  Masayuki Noda

发明人： Hiroyoshi Ueno ,  Yoshihisa Kato ,  Isao Ichioka ,  Takekazu Adachi ,  Mamoru Murata ,  Hirokazu Hiraoka ,  Manabu Ochida ,  Masayuki Noda

IPC分类号： B32B5/02 ,  B32B5/26 ,  B32B37/10 ,  C08J5/24 ,  D21H13/26 ,  D21H17/52 ,  D21H21/18 ,  D21H25/06 ,  D21H27/00 ,  D21H27/30 ,  H05K1/03 ,  D04H3/08 ,  B32B31/26

CPC分类号： B32B5/26 ,  B32B5/022 ,  B32B15/14 ,  B32B15/20 ,  B32B37/00 ,  B32B37/10 ,  B32B38/0036 ,  B32B38/16 ,  B32B38/164 ,  B32B2260/021 ,  B32B2260/046 ,  B32B2262/0269 ,  B32B2305/28 ,  B32B2309/02 ,  B32B2311/12 ,  B32B2398/10 ,  B32B2457/08 ,  D21H13/26 ,  D21H17/52 ,  D21H21/18 ,  D21H25/06 ,  D21H27/30 ,  H05K1/0366 ,  H05K2201/0278 ,  H05K2201/0293 ,  H05K2203/1105 ,  Y10T428/249925 ,  Y10T428/249998 ,  Y10T428/31725 ,  Y10T428/31728 ,  Y10T442/20 ,  Y10T442/2951 ,  Y10T442/60 ,  Y10T442/696 ,  Y10T442/697 ,  Y10T442/699

摘要： The present invention is to provide a base material for a laminate having a high strength, reduced thickness, and light weight. In the present invention, a base material is prepared by incorporating a thermosetting resin binder into a non-woven fabric of para-aramid fibers prepared by a wet type paper making, and then heating a plurality of the resultant non-woven fabric sheets under pressure. The non-woven fabric sheet comprises 95 to 70 mass % of the para-aramid fibers and 5 to 30 mass % of the thermosetting resin binder.

摘要翻译： 本发明提供一种具有高强度，低厚度和轻质量的层压体的基材。 在本发明中，通过将热固性树脂粘合剂结合到通过湿式造纸制备的对位芳族聚酰胺纤维的无纺织物中，然后在压力下加热多个所得的无纺布片材来制备基材 。 无纺布片包含95〜70质量％的对位芳族聚酰胺纤维和5〜30质量％的热固性树脂粘合剂。

公开(公告)号：US20050037201A1

公开(公告)日：2005-02-17

申请号：US10898894

申请日：2004-07-26

申请人： Toshiharu Hirai ,  Hiroyasu Nishida ,  Michio Komatsu

发明人： Toshiharu Hirai ,  Hiroyasu Nishida ,  Michio Komatsu

IPC分类号： C03C17/00 ,  C03C17/34 ,  C03C17/36 ,  C01B15/14 ,  B32B5/16

CPC分类号： C03C17/3655 ,  C03C17/007 ,  C03C17/34 ,  C03C17/36 ,  C03C17/3676 ,  C03C2217/425 ,  C03C2217/445 ,  C03C2217/475 ,  C03C2217/76 ,  C03C2217/78 ,  Y10T428/249953 ,  Y10T428/249962 ,  Y10T428/249998 ,  Y10T428/25 ,  Y10T428/2982 ,  Y10T428/2984 ,  Y10T428/2991 ,  Y10T428/2993 ,  Y10T428/2995 ,  Y10T428/2996 ,  Y10T428/2998

摘要： Inorganic compound particles constituted of a shell, a porous matter or a cavity enclosed therein, and the porous matter or the cavity being kept unchanged in a subsequently formed transparent coating film.

摘要翻译： 由外壳，多孔物质或其中包围的空腔构成的无机化合物颗粒，并且多孔物质或空腔在随后形成的透明涂膜中保持不变。

公开(公告)号：US06846528B2

公开(公告)日：2005-01-25

申请号：US09979466

申请日：2001-03-26

申请人： Shiro Osumi ,  Shigeru Sugiyama ,  Takahiro Uno ,  Kazuo Yoneyama

发明人： Shiro Osumi ,  Shigeru Sugiyama ,  Takahiro Uno ,  Kazuo Yoneyama

IPC分类号： B32B17/06 ,  B32B27/06 ,  B32B27/08 ,  B44C5/04 ,  B44F1/06 ,  B32B3/00 ,  B32B29/02 ,  E06B3/24

CPC分类号： B32B17/06 ,  B32B27/06 ,  B32B27/08 ,  B44C5/04 ,  B44C5/0446 ,  B44C5/0469 ,  B44F1/066 ,  Y10T428/24612 ,  Y10T428/249926 ,  Y10T428/249998 ,  Y10T428/2915 ,  Y10T442/20 ,  Y10T442/2861 ,  Y10T442/30

摘要： A translucent decorative board for use, e.g., as a window pane, light shade, partition or door pane is disclosed. The decorative board is comprised of a translucent substrate board and translucent cover sheets bonded to the surfaces of the substrate board. The substrate board is generally thermoplastic and the decorative cover sheets are thermosetting. The thermosetting sheet may comprise a substrate paper sheet and a thermosetting resin impregnated in the sheet.

公开(公告)号：US06632561B1

公开(公告)日：2003-10-14

申请号：US09830265

申请日：2001-04-25

申请人： Stephan Bauer ,  Bernd Bronstert ,  Helmut Möhwald ,  Rainer Blum ,  Gerhard Dötter

发明人： Stephan Bauer ,  Bernd Bronstert ,  Helmut Möhwald ,  Rainer Blum ,  Gerhard Dötter

IPC分类号： H01M216

CPC分类号： H01M4/621 ,  H01M2/1673 ,  H01M10/052 ,  H01M10/0525 ,  Y10T428/249953 ,  Y10T428/249994 ,  Y10T428/249998 ,  Y10T428/254 ,  Y10T428/31504 ,  Y10T428/31565 ,  Y10T428/3158 ,  Y10T428/31583 ,  Y10T428/31587 ,  Y10T428/31721 ,  Y10T428/31725

摘要： A composite comprises at least one layer which includes a composite comprising (a) from 1 to 99% by weight of a solid (I) with a primary particle size of from 5 nm to 100 &mgr;m or a mixture made from at least two solids, (b) from 99 to 1% by weight of a polymeric binder (II) which includes: (IIa) from 1 to 100% by weight of a polymer or copolymer (IIa) which has, along the chain, terminally and/or laterally, reactive groups (RG) which are capable of crosslinking reactions when exposed to heat and/or UV radiation, and (IIb) from 0 to 99% by weight of at least one polymer or copolymer (IIb) which is free from reactive groups RG, where the at least one layer has been applied to at least one second layer comprising at least one conventional separator.

摘要翻译： 复合材料包括至少一层，其包括复合材料，所述复合材料包含（a）1至99重量％的初级粒度为5nm至100μm的固体（I）或由 至少两个固体，（b）99至1重量％的聚合物粘合剂（II），其包含：1至100重量％的聚合物或共聚物（IIa）（IIa） 其具有沿链条的末端和/或侧向反应性基团（RG），其在暴露于热和/或UV辐射时能够交联反应，并且其中0至99重量％ 至少一种不含活性基团RG的聚合物或共聚物（IIb），其中至少一层已施加至至少一层包含至少一种常规分离剂的第二层。

公开(公告)号：US06599621B2

公开(公告)日：2003-07-29

申请号：US09812404

申请日：2001-03-20

申请人： William H. Porter

发明人： William H. Porter

IPC分类号： B32B326

CPC分类号： E04C2/296 ,  B32B5/18 ,  Y10T428/24074 ,  Y10T428/24091 ,  Y10T428/249925 ,  Y10T428/24994 ,  Y10T428/249976 ,  Y10T428/249982 ,  Y10T428/249987 ,  Y10T428/24999 ,  Y10T428/249998

摘要： Generally flat structural panel for building construction includes an inner insulating core such as of plastic foam and a pair of opposed outer facings, or sheets, bonded to the panel's insulating core. One of the outer facings is of gypsum composite, or gypsum fiberboard, while the other outer facing is of oriented strand board (OSB) impregnated with plastic, such as a polyisocyanurate or urethane resin. The gypsum fiberboard forms the panel's inner surface, while the plastic impregnated OSB forms the panel's outer surface. The panel's outer facings provide high tensile strength, with the gypsum fiberboard facing also affording high load bearing capacity as well as resistant to fire, the environment, and insects. The plastic impregnated OSB does not expand or contract with changes in humidity to maintain a planar configuration for the panel with a smooth, uniform surface for exterior finishing.

公开(公告)号：US20020197466A1

公开(公告)日：2002-12-26

申请号：US09441135

申请日：1999-11-17

发明人： HIROYOSHI UENO ,  YOSHIHISA KATO ,  ISAO ICHIOKA ,  TAKEKAZU ADACHI ,  MAMORU MURATA ,  HIROKAZU HIRAOKA ,  MANABU OCHIDA ,  MASAYUKI NODA

IPC分类号： D04H003/08 ,  B32B031/26

CPC分类号： B32B5/26 ,  B32B5/022 ,  B32B15/14 ,  B32B15/20 ,  B32B37/00 ,  B32B37/10 ,  B32B38/0036 ,  B32B38/16 ,  B32B38/164 ,  B32B2260/021 ,  B32B2260/046 ,  B32B2262/0269 ,  B32B2305/28 ,  B32B2309/02 ,  B32B2311/12 ,  B32B2398/10 ,  B32B2457/08 ,  D21H13/26 ,  D21H17/52 ,  D21H21/18 ,  D21H25/06 ,  D21H27/30 ,  H05K1/0366 ,  H05K2201/0278 ,  H05K2201/0293 ,  H05K2203/1105 ,  Y10T428/249925 ,  Y10T428/249998 ,  Y10T428/31725 ,  Y10T428/31728 ,  Y10T442/20 ,  Y10T442/2951 ,  Y10T442/60 ,  Y10T442/696 ,  Y10T442/697 ,  Y10T442/699

摘要： The present invention is to provide a base material for a laminate having a high strength, reduced thickness, and light weight. In the present invention, a base material is prepared by incorporating a thermosetting resin binder into a non-woven fabric of para-aramid fibers prepared by a wet type paper making, and then heating a plurality of the resultant non-woven fabric sheets under pressure. The non-woven fabric sheet comprises 95 to 70 mass % of the para-aramid fibers and 5 to 30 mass % of the thermosetting resin binder.

摘要翻译： 本发明提供一种具有高强度，低厚度和轻质量的层压体的基材。 在本发明中，通过将热固性树脂粘合剂结合到通过湿式造纸制备的对位芳族聚酰胺纤维的无纺织物中，然后在压力下加热多个所得的无纺布片材来制备基材 。 无纺布片包含95〜70质量％的对位芳族聚酰胺纤维和5〜30质量％的热固性树脂粘合剂。