Abstract:
A semiconductor memory device is provided with an MPU, a secondary cache and a TAG memory mounted on a chip. Registers are provided for a plurality of test data buses connected parallel to a plurality of data buses from the MPU to the secondary cache or the TAG memory. The registers and the plurality of data buses of the MPU are changed with switches so as to be connected with a bonding pad which is a part of an external terminal for the MPU. With this arrangement, the semiconductor memory device can connect with a tester for a DRAM part test via the bonding pad.
Abstract:
A semiconductor dynamic random access memory device serially reads out data bits from and serially writes data bits into memory cells through a long burst cycle, and the data bits are transferred between a read/write data bus to data latch circuits, between the data latch circuits and the main/sub sense amplifiers and the main/sub sense amplifiers and the sub-bit line pairs; while the data bits are being stepwise transferred between the memory cells and the read/write data bus, an internal timing controller not only provides activation timings and deactivation timings to the main-sub sense amplifiers and transfer gate arrays but also the starting point and the end point of the long burst cycle so that the semiconductor dynamic random access memory device is fabricated on a relatively small semiconductor chip.
Abstract:
A dynamic random access memory device selects a row of memory cells from a plurality of memory cell sub-arrays with main word lines and sub-word lines for a data access, and data bits read out from the row of memory cells are amplified by a sense amplifier circuit array, wherein a row block address decoder and a column block address decoder supply a first enable signal and a second enable signal to a row of memory cell sub-arrays and a column of memory cell sub-arrays so that only one of the sense amplifier circuit arrays is powered for the amplification, thereby decreasing peak current consumed by the sense amplifier circuit arrays.
Abstract:
Provided is a semiconductor integrated circuit including: an anti-fuse element that electrically connects a first node and a first power supply terminal when data is written and electrically disconnect the first node and the first power supply terminal when data is not written; a first switch circuit that is connected between the first node and a first data line applied with a predetermine first voltage, and enters an off state from an on state according to a first control signal; and a detection part that detects write data of the anti-fuse element according to whether a voltage of the first node is substantially the same as the first voltage or substantially the same as a supply voltage of the first power supply terminal when the first switch circuit enters the off state.
Abstract:
A semiconductor integrated circuit device includes: a first bias generating circuit, a second bias generating circuit and a control circuit. The first bias generating circuit generates a first substrate bias voltage of a P-channel transistor. The second bias generating circuit generates a second substrate bias voltage of N-channel transistor. The control circuit controls the first bias generating circuit and the second bias generating circuit independently on the basis of operating states of circuits to which the first substrate bias voltage and the second substrate bias voltage are applied.
Abstract:
A semiconductor integrated circuit, includes a first macro and a second macro. The first macro outputs a data signal. The second macro inputs the data signal. The first macro fixes the data signal at a non-high level state that is not a high level in response to a control signal.
Abstract:
There is provided a dynamic type semiconductor memory device including (a) a first hierarchized complementary bit line, (b) a second hierarchized complementary bit line, (c) a first sense-amplifier electrically connected to the first bit line, (d) at least one second sense-amplifier electrically connected to both the first bit line and the second bit line, (e) a capacitor located between the first and second bit lines for each of second sense-amplifiers, and (f) a transfer gate arranged in series with the capacity between the first and second bit lines. The above-mentioned dynamic type semiconductor memory device makes it possible to store two-bit data in a single memory cell by employing a memory cell comprised of one transistor and one capacitor, without the use of a conventional memory cell having two transistors and one capacitor. Hence, the dynamic type semiconductor memory device ensures a significant reduction in a chip area.
Abstract:
A data refresh is indispensable for a semiconductor dynamic random access memory device, and electric charges are recycled from bit line pairs for a row of memory cell arrays to power supply lines for bit line drivers associated with the next row of memory cell arrays and from bit line pairs for the next row of memory cell arrays to power supply lines for the row of memory cell arrays, thereby reducing power consumption in the data refresh.
Abstract:
A semiconductor memory device such as a DRAM device in which, in each write or read cycle, a plurality bits of data are written to or read from memory cells as a burst. The semiconductor memory device includes: a plurality of write/read circuits for reading data from selected memory cells to data lines and writing data from the data lines to selected memory cells; a column selector for distributing data from an input/output line to the data lines, and outputting data from the data lines to the input/output line; and a plurality of data latches inserted into data line circuit portions between the column selector and the write/read circuits, for temporarily storing data to be written to or read from the memory cells as a burst. In a write cycle, after data stored in the latches is written into memory cells and after elapsing a predetermined time period required for a precharge operation of the bit lines, the next write cycle is started. In a read cycle, after data is read out from memory cells into the data latches and after performing a precharge operation of the bit lines, the next read cycle is started.
Abstract:
In a dynamic type semiconductor memory device having a classified bit line structure, a feedback capacitor is provided between sub-bit lines and main bit lines of a sub-sense amplifier. A voltage difference read out on the sub-bit lines is transferred to the main bit lines, the read out voltage difference is amplified by a main sense amplifier, and data of superordinate bits is read out. At the same time, the data on said main bit lines is feed-backed to the sub-bit lines through the capacitor. Thereafter, a reading operation from the sub-bit lines to the main bit lines is performed again, thereby enabling a reading operation for data of subordinate bits. Thus, in a dynamic type semiconductor memory device having a conventional memory cell structure, data for two bits can be stored in one memory cell.