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    LARGE COHESIVE ENERGY ADSORBENT FOR FLUORIDE REMOVAL, PREPARATION AND APPLICATION THEREOF
    1.
    发明申请
    LARGE COHESIVE ENERGY ADSORBENT FOR FLUORIDE REMOVAL, PREPARATION AND APPLICATION THEREOF 有权

    公开(公告)号：US20230134129A1

    公开(公告)日：2023-05-04

    申请号：US17783647

    申请日：2021-09-03

    申请人： XIANG RU LI ,  JI Ming Li ,  SHI HUA CHEN ,  JIA LEI LI ,  Xiang Yu Que

    发明人： XIANG RU LI ,  JI Ming Li ,  SHI HUA CHEN ,  JIA LEI LI ,  Xiang Yu Que

    IPC分类号： B01J20/32 ,  B01J20/04 ,  B01J20/28 ,  B01J20/30

    摘要： The present disclosure provides a method for preparing a high cohesive energy adsorbent for fluoride removal, which includes the following steps: S1. adding NaHF2—NiF·6H2O additive to SiCO ceramic powder, and sintering at a temperature of 310-330° C. for 18-22h to obtain a sintered substance; S2. grinding the sintered substance to obtain particles with a size of 2-3 mm, and mixing the particles with polyacrylonitrile to form a composite polymer; and S3. molding the composite polymer by a vacuum baking process at a temperature of 75-85° C., then performing ball milling and sieving to obtain the high cohesive energy adsorbent for fluoride removal. The high cohesive energy adsorbent for fluoride removal may be used in the adsorption and separation of the C2F6—CHF3—CClF3 mixture system, and the contents of CHF3 and CClF3 are lowered to less than 10ppmv.

    Electronic device cooling arrangement
    3.
    发明授权
    Electronic device cooling arrangement 失效
    电子设备冷却布置

    公开(公告)号：US5982621A

    公开(公告)日：1999-11-09

    申请号：US197436

    申请日：1998-11-23

    申请人： ji-Ming Li

    发明人： ji-Ming Li

    IPC分类号： H01L23/367 ,  H01L23/433 ,  H05K7/20

    CPC分类号： H01L23/367 ,  H01L23/4334 ,  H01L2224/48091 ,  H01L24/48 ,  H01L2924/00014

    摘要： An electronic device cooling arrangement includes a heat sink bonded to a substrate above a chip on the substrate, the heat sink having a mounting section bonded to the substrate, a face panel section suspended above the chip and defining a tapered center through hole, and a supporting frame section connected between the face panel section and the mounting section, and a tapered heat conductive block mounted in the tapered center through hole and bonded to the chip for quick dissipation of heat from the chip.

    摘要翻译： 一种电子设备冷却装置，包括：结合到基板上的芯片上方的基板的散热器，散热器具有结合到基板的安装部分，悬挂在芯片上方并限定锥形中心通孔的面板部分， 连接在面板部分和安装部分之间的支撑框架部分，以及安装在锥形中心通孔中并结合到芯片上的锥形导热块，用于从芯片快速散热。

    Heat sink
    4.
    发明授权
    Heat sink 有权
    散热器

    公开(公告)号：US6067228A

    公开(公告)日：2000-05-23

    申请号：US276651

    申请日：1999-03-26

    申请人： Ji-Ming Li

    发明人： Ji-Ming Li

    IPC分类号： H01L23/31 ,  H01L23/367 ,  H01L23/467 ,  H05K7/20

    CPC分类号： H01L23/467 ,  H01L23/3128 ,  H01L23/3677 ,  H01L2224/05599 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/85399 ,  H01L24/48 ,  H01L2924/00014 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/16152

    摘要： The present invention discloses a heat sink for enhancing heat dissipation efficiency of an electronic device. The heat sink includes a base for accommodating at least an electronic device, a dissipation plate overlaid on the base for absorbing and dissipating heat generated by the electronic device, and a fan for generating airflow. A side wall of the base is formed with at least an air duct for guiding the airflow generated by the fan through a bottom of the electronic device, thereby enhancing heat dissipation efficiency of the electronic device.

    摘要翻译： 本发明公开了一种用于提高电子设备散热效率的散热器。 散热器包括用于容纳至少一个电子设备的基座，覆盖在基座上的用于吸收和散发由电子设备产生的热量的散热板和用于产生气流的风扇。 基座的侧壁形成有至少一个用于引导由风扇产生的气流通过电子设备底部的风道，从而提高了电子设备的散热效率。