公开(公告)号：US20060113654A1

公开(公告)日：2006-06-01

申请号：US11328316

申请日：2006-01-10

Applicant: Joseph Sun ,  Kuang-Chih Cheng ,  Ming-Chieh Chen

Inventor： Joseph Sun ,  Kuang-Chih Cheng ,  Ming-Chieh Chen

IPC: H01L23/02

CPC classification number: H01L27/14618 ,  H01L23/49816 ,  H01L23/4985 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48472 ,  H05K3/323 ,  H05K3/361 ,  H05K2201/0367 ,  H01L2924/00014 ,  H01L2924/00

Abstract: A package of a semiconductor device with a flexible wiring substrate and a method thereof are provided. The package of the semiconductor device includes a semiconductor substrate with at least one pad on a surface thereof, a bump bonded to the pad, an adhesive layer on the bump, and a flexible wiring substrate having at least one contact section being electrically connected with the bump by the adhesive layer. The present invention makes the flexible wiring substrate directly conductively attached onto the semiconductor substrate. The package size is shrunk and the cost down can be obtained.

Abstract translation: 提供具有柔性布线基板的半导体器件的封装及其方法。 该半导体器件的封装包括：半导体衬底，其表面上具有至少一个衬垫，与焊盘接合的凸块，凸块上的粘合剂层;以及柔性布线衬底，具有至少一个接触部分与 由粘合剂层撞击。 本发明使柔性布线基板直接导电地附着在半导体基板上。 包装尺寸缩小，可以降低成本。

公开(公告)号：US07303400B2

公开(公告)日：2007-12-04

申请号：US11050814

申请日：2005-01-27

Applicant: Joseph Sun ,  Kuang-Chih Cheng ,  Ming-Chieh Chen ,  Kevin Lee ,  Jui-Hsiang Pan

Inventor： Joseph Sun ,  Kuang-Chih Cheng ,  Ming-Chieh Chen ,  Kevin Lee ,  Jui-Hsiang Pan

IPC: H01R12/00

CPC classification number: H01L27/14618 ,  H01L23/49816 ,  H01L23/4985 ,  H01L27/14621 ,  H01L27/14627 ,  H01L27/14634 ,  H01L27/14683 ,  H01L2224/05571 ,  H01L2224/05573 ,  H01L2224/05624 ,  H01L2224/05647 ,  H01L2224/13 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2924/16235 ,  H05K3/323 ,  H05K3/361 ,  H05K2201/0367 ,  Y10T29/49144 ,  H01L2924/00014 ,  H01L2924/00

Abstract: A package of a semiconductor device with a flexible wiring substrate and a method thereof are provided. The package of the semiconductor device includes a semiconductor substrate with at least one pad on a surface thereof, a bump bonded to the pad, an adhesive layer on the bump, and a flexible wiring substrate having at least one contact section being electrically connected with the bump by the adhesive layer. The present invention makes the flexible wiring substrate directly conductively attached onto the semiconductor substrate. The package size is shrunk and the cost down can be obtained.

Abstract translation: 提供具有柔性布线基板的半导体器件的封装及其方法。 该半导体器件的封装包括：半导体衬底，其表面上具有至少一个衬垫，与焊盘接合的凸块，凸块上的粘合剂层;以及柔性布线衬底，具有至少一个接触部分与 由粘合剂层撞击。 本发明使柔性布线基板直接导电地附着在半导体基板上。 包装尺寸缩小，可以降低成本。

公开(公告)号：US20050161815A1

公开(公告)日：2005-07-28

申请号：US10764469

申请日：2004-01-27

Applicant: Joseph Sun ,  Kuang-Chih Cheng ,  Ming-Chieh Chen

Inventor： Joseph Sun ,  Kuang-Chih Cheng ,  Ming-Chieh Chen

IPC: H01L21/00 ,  H01L21/48 ,  H01L23/48 ,  H01L23/498 ,  H01L27/146 ,  H01L31/0203 ,  H05K3/32 ,  H05K3/36

CPC classification number: H01L27/14618 ,  H01L23/49816 ,  H01L23/4985 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48472 ,  H05K3/323 ,  H05K3/361 ,  H05K2201/0367 ,  H01L2924/00014 ,  H01L2924/00

Abstract: A package of a semiconductor device with a flexible wiring substrate and a method thereof are provided. The package of the semiconductor device includes a semiconductor substrate with at least one pad on a surface thereof, a bump bonded to the pad, an adhesive layer on the bump, and a flexible wiring substrate having at least one contact section being electrically connected with the bump by the adhesive layer. The present invention makes the flexible wiring substrate directly conductively attached onto the semiconductor substrate. The package size is shrunk and the cost down can be obtained.

公开(公告)号：US20050161756A1

公开(公告)日：2005-07-28

申请号：US11050814

申请日：2005-01-27

Applicant: Joseph Sun ,  Kuang-Chih Cheng ,  Ming-Chieh Chen ,  Kevin Lee ,  Jui-Hsiang Pan

Inventor： Joseph Sun ,  Kuang-Chih Cheng ,  Ming-Chieh Chen ,  Kevin Lee ,  Jui-Hsiang Pan

IPC: H01L21/00 ,  H01L21/48 ,  H01L23/48 ,  H01L23/498 ,  H01L27/146 ,  H01L31/0203 ,  H05K3/32 ,  H05K3/36

CPC classification number: H01L27/14618 ,  H01L23/49816 ,  H01L23/4985 ,  H01L27/14621 ,  H01L27/14627 ,  H01L27/14634 ,  H01L27/14683 ,  H01L2224/05571 ,  H01L2224/05573 ,  H01L2224/05624 ,  H01L2224/05647 ,  H01L2224/13 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2924/16235 ,  H05K3/323 ,  H05K3/361 ,  H05K2201/0367 ,  Y10T29/49144 ,  H01L2924/00014 ,  H01L2924/00

Abstract: A package of a semiconductor device with a flexible wiring substrate and a method thereof are provided. The package of the semiconductor device includes a semiconductor substrate with at least one pad on a surface thereof, a bump bonded to the pad, an adhesive layer on the bump, and a flexible wiring substrate having at least one contact section being electrically connected with the bump by the adhesive layer. The present invention makes the flexible wiring substrate directly conductively attached onto the semiconductor substrate. The package size is shrunk and the cost down can be obtained.

Abstract translation: 提供具有柔性布线基板的半导体器件的封装及其方法。 该半导体器件的封装包括：半导体衬底，其表面上具有至少一个衬垫，与焊盘接合的凸块，凸块上的粘合剂层;以及柔性布线衬底，具有至少一个接触部分与 由粘合剂层撞击。 本发明使柔性布线基板直接导电地附着在半导体基板上。 包装尺寸缩小，可以降低成本。

公开(公告)号：US07663234B2

公开(公告)日：2010-02-16

申请号：US11420453

申请日：2006-05-25

Applicant: Joseph Sun ,  Kuang-Chih Cheng ,  Ming-Chieh Chen ,  Kevin Lee ,  Jui-Hsiang Pan

Inventor： Joseph Sun ,  Kuang-Chih Cheng ,  Ming-Chieh Chen ,  Kevin Lee ,  Jui-Hsiang Pan

IPC: H01L21/00 ,  H01L23/48

CPC classification number: H01L27/14618 ,  H01L23/49816 ,  H01L23/4985 ,  H01L27/14621 ,  H01L27/14627 ,  H01L27/14634 ,  H01L27/14683 ,  H01L2224/05571 ,  H01L2224/05573 ,  H01L2224/05624 ,  H01L2224/05647 ,  H01L2224/13 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2924/16235 ,  H05K3/323 ,  H05K3/361 ,  H05K2201/0367 ,  Y10T29/49144 ,  H01L2924/00014 ,  H01L2924/00

Abstract: A package of a semiconductor device with a flexible wiring substrate and a method thereof are provided. The package of the semiconductor device includes a semiconductor substrate with at least one pad on a surface thereof, a bump bonded to the pad, an adhesive layer on the bump, and a flexible wiring substrate having at least one contact section being electrically connected with the bump by the adhesive layer. The present invention makes the flexible wiring substrate directly conductively attached onto the semiconductor substrate. The package size is shrunk and the cost down can be obtained.

Abstract translation: 提供具有柔性布线基板的半导体器件的封装及其方法。 该半导体器件的封装包括：半导体衬底，其表面上具有至少一个衬垫，与焊盘接合的凸块，凸块上的粘合剂层;以及柔性布线衬底，具有至少一个接触部分与 由粘合剂层撞击。 本发明使柔性布线基板直接导电地附着在半导体基板上。 包装尺寸缩小，可以降低成本。

公开(公告)号：US20070091820A1

公开(公告)日：2007-04-26

申请号：US11537795

申请日：2006-10-02

Applicant: JOSEPH SUN ,  CATHLEEN CARROLL ,  RENU CHAUDHARY ,  LELAND DOON ,  CYNTHIA JUNG ,  JOHN MALEK

Inventor： JOSEPH SUN ,  CATHLEEN CARROLL ,  RENU CHAUDHARY ,  LELAND DOON ,  CYNTHIA JUNG ,  JOHN MALEK

IPC: H04L12/28 ,  H04L12/56

CPC classification number: H04L61/1535 ,  H04L29/12103 ,  H04L61/2015 ,  H04L67/14 ,  H04W8/26 ,  H04W28/18 ,  H04W74/00 ,  H04W76/12 ,  H04W80/00 ,  H04W84/04

Abstract: A GGSN receives a request associated with a session creation for a mobile entity. The GGSN begins a process (a four-way handshake) for obtaining network access configuration parameters for the mobile entity and responds to the request prior to the completion of the four-way handshake. The GGSN then completes the four-way handshake. A GGSN creates an association between a first IP address and a first mobile entity and thereafter requests an IP address for a second mobile entity. In response thereto, the GGSN receives the first IP address, which the GGSN declines for the second mobile entity and reserves for the first mobile entity. The GGSN requests an IP address for the second mobile entity a second time and receives a second IP address that is different from the first IP address.

Abstract translation: GGSN接收与移动实体的会话创建相关联的请求。 GGSN开始一个进程（四次握手），用于获取移动实体的网络访问配置参数，并在四次握手完成之前响应该请求。 GGSN然后完成四次握手。 GGSN在第一IP地址和第一移动实体之间建立关联，之后请求第二移动实体的IP地址。 响应于此，GGSN接收第一个IP地址，GGSN拒绝第二个移动实体并为第一个移动实体保留。 GGSN第二次请求第二移动实体的IP地址，并接收与第一IP地址不同的第二IP地址。

公开(公告)号：US20060202333A1

公开(公告)日：2006-09-14

申请号：US11420453

申请日：2006-05-25

Applicant: JOSEPH SUN ,  KUANG-CHIH CHENG ,  MING-CHIEH CHEN ,  KEVIN LEE ,  JUI-HSIANG PAN

Inventor： JOSEPH SUN ,  KUANG-CHIH CHENG ,  MING-CHIEH CHEN ,  KEVIN LEE ,  JUI-HSIANG PAN

IPC: H01L21/00 ,  H01L23/48

CPC classification number: H01L27/14618 ,  H01L23/49816 ,  H01L23/4985 ,  H01L27/14621 ,  H01L27/14627 ,  H01L27/14634 ,  H01L27/14683 ,  H01L2224/05571 ,  H01L2224/05573 ,  H01L2224/05624 ,  H01L2224/05647 ,  H01L2224/13 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2924/16235 ,  H05K3/323 ,  H05K3/361 ,  H05K2201/0367 ,  Y10T29/49144 ,  H01L2924/00014 ,  H01L2924/00

Abstract: A package of a semiconductor device with a flexible wiring substrate and a method thereof are provided. The package of the semiconductor device includes a semiconductor substrate with at least one pad on a surface thereof, a bump bonded to the pad, an adhesive layer on the bump, and a flexible wiring substrate having at least one contact section being electrically connected with the bump by the adhesive layer. The present invention makes the flexible wiring substrate directly conductively attached onto the semiconductor substrate. The package size is shrunk and the cost down can be obtained.

Abstract translation: 提供具有柔性布线基板的半导体器件的封装及其方法。 该半导体器件的封装包括：半导体衬底，其表面上具有至少一个衬垫，与焊盘接合的凸块，凸块上的粘合剂层;以及柔性布线衬底，具有至少一个接触部分与 由粘合剂层撞击。 本发明使柔性布线基板直接导电地附着在半导体基板上。 包装尺寸缩小，可以降低成本。