公开(公告)号：US07663234B2

公开(公告)日：2010-02-16

申请号：US11420453

申请日：2006-05-25

Applicant: Joseph Sun ,  Kuang-Chih Cheng ,  Ming-Chieh Chen ,  Kevin Lee ,  Jui-Hsiang Pan

Inventor： Joseph Sun ,  Kuang-Chih Cheng ,  Ming-Chieh Chen ,  Kevin Lee ,  Jui-Hsiang Pan

IPC: H01L21/00 ,  H01L23/48

CPC classification number: H01L27/14618 ,  H01L23/49816 ,  H01L23/4985 ,  H01L27/14621 ,  H01L27/14627 ,  H01L27/14634 ,  H01L27/14683 ,  H01L2224/05571 ,  H01L2224/05573 ,  H01L2224/05624 ,  H01L2224/05647 ,  H01L2224/13 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2924/16235 ,  H05K3/323 ,  H05K3/361 ,  H05K2201/0367 ,  Y10T29/49144 ,  H01L2924/00014 ,  H01L2924/00

Abstract: A package of a semiconductor device with a flexible wiring substrate and a method thereof are provided. The package of the semiconductor device includes a semiconductor substrate with at least one pad on a surface thereof, a bump bonded to the pad, an adhesive layer on the bump, and a flexible wiring substrate having at least one contact section being electrically connected with the bump by the adhesive layer. The present invention makes the flexible wiring substrate directly conductively attached onto the semiconductor substrate. The package size is shrunk and the cost down can be obtained.

Abstract translation: 提供具有柔性布线基板的半导体器件的封装及其方法。 该半导体器件的封装包括：半导体衬底，其表面上具有至少一个衬垫，与焊盘接合的凸块，凸块上的粘合剂层;以及柔性布线衬底，具有至少一个接触部分与 由粘合剂层撞击。 本发明使柔性布线基板直接导电地附着在半导体基板上。 包装尺寸缩小，可以降低成本。

公开(公告)号：US5392078A

公开(公告)日：1995-02-21

申请号：US72280

申请日：1993-06-04

Applicant: Ming-Chieh Chen

Inventor： Ming-Chieh Chen

IPC: G02C5/12

CPC classification number: G02C5/126 ,  G02C5/12

Abstract: An improved structure for nose pieces of spectacles, comprises two nose pieces made of soft plastic in concaved shapes and having their front faces planted with fine down and provided with a plurality of air permeable holes, a connecting axle integrally protruding from the nose piece with a protruding ball extending into a base and being able of automatic orientation adjustment and being pressed in the base by a pressing detent which in turn being pressed by a torsional spring, the structure each can be clamped onto a seat (on the spectacles) for a nose piece so as not to be subjected to falling off and is convenient for assembling, the nose piece with this structure can best fit to the bridge of a nose.

Abstract translation: 一种眼镜鼻片的改进结构，包括由软塑料制成的两个鼻片，凹形形状，其前面正面细细，并具有多个透气孔，从鼻片一体地突出的连接轴与 突出的球延伸到基座中并且能够自动定向调节并且通过按压定位器被按压在基座中，该按压定位器又被扭转弹簧按压，该结构每个可以被夹紧到座椅（在眼镜上）上用于鼻子 使其不会脱落，便于组装，具有这种结构的鼻片最适合鼻梁。

公开(公告)号：US07663693B2

公开(公告)日：2010-02-16

申请号：US10791410

申请日：2004-03-01

Applicant: Cheng-Kuang Sun ,  Kuang-Chih Cheng ,  Ming-Chieh Chen ,  Kuang-Shin Lee

Inventor： Cheng-Kuang Sun ,  Kuang-Chih Cheng ,  Ming-Chieh Chen ,  Kuang-Shin Lee

IPC: H04N5/225

CPC classification number: H04N5/2253 ,  H01L27/14618 ,  H01L27/14625 ,  H01L27/14634 ,  H01L27/14636 ,  H01L31/0203 ,  H01L2224/16225 ,  H04N2101/00 ,  H01L2224/48091 ,  H01L2924/00014

Abstract: A camera module is provided. The camera module comprises: a lens; a holder having a lower portion, the holder holding the lens; a circuit board; and an image sensing and processing unit including an image sensing device and an optional signal processing device stacked on and electrically connected to the image sensing device, the image sensing and processing unit being packaged on one side of the circuit board; wherein the holder is fixed on the circuit board, the image sensing and processing unit inside the lower portion of the holder. Further, if the circuit board is a flexible circuit board, then a hard plate can be disposed on the other side of the flexible PCB corresponding to the image sensing and processing unit in order to enhance the mechanical strength.

Abstract translation: 提供相机模块。 相机模块包括：透镜; 具有下部的保持器，保持器保持透镜; 电路板; 以及图像感知和处理单元，其包括层叠在图像感测装置上并与其电连接的图像感测装置和可选的信号处理装置，所述图像感测处理单元被封装在所述电路板的一侧上; 其中，所述保持器固定在所述电路板上，所述图像感测处理单元位于所述保持器的下部内部。 此外，如果电路板是柔性电路板，则可以在对应于图像感测和处理单元的柔性PCB的另一侧上设置硬板，以增强机械强度。

公开(公告)号：US20060202333A1

公开(公告)日：2006-09-14

申请号：US11420453

申请日：2006-05-25

Applicant: JOSEPH SUN ,  KUANG-CHIH CHENG ,  MING-CHIEH CHEN ,  KEVIN LEE ,  JUI-HSIANG PAN

Inventor： JOSEPH SUN ,  KUANG-CHIH CHENG ,  MING-CHIEH CHEN ,  KEVIN LEE ,  JUI-HSIANG PAN

IPC: H01L21/00 ,  H01L23/48

CPC classification number: H01L27/14618 ,  H01L23/49816 ,  H01L23/4985 ,  H01L27/14621 ,  H01L27/14627 ,  H01L27/14634 ,  H01L27/14683 ,  H01L2224/05571 ,  H01L2224/05573 ,  H01L2224/05624 ,  H01L2224/05647 ,  H01L2224/13 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2924/16235 ,  H05K3/323 ,  H05K3/361 ,  H05K2201/0367 ,  Y10T29/49144 ,  H01L2924/00014 ,  H01L2924/00

Abstract: A package of a semiconductor device with a flexible wiring substrate and a method thereof are provided. The package of the semiconductor device includes a semiconductor substrate with at least one pad on a surface thereof, a bump bonded to the pad, an adhesive layer on the bump, and a flexible wiring substrate having at least one contact section being electrically connected with the bump by the adhesive layer. The present invention makes the flexible wiring substrate directly conductively attached onto the semiconductor substrate. The package size is shrunk and the cost down can be obtained.

Abstract translation: 提供具有柔性布线基板的半导体器件的封装及其方法。 该半导体器件的封装包括：半导体衬底，其表面上具有至少一个衬垫，与焊盘接合的凸块，凸块上的粘合剂层;以及柔性布线衬底，具有至少一个接触部分与 由粘合剂层撞击。 本发明使柔性布线基板直接导电地附着在半导体基板上。 包装尺寸缩小，可以降低成本。

公开(公告)号：US07303400B2

公开(公告)日：2007-12-04

申请号：US11050814

申请日：2005-01-27

Applicant: Joseph Sun ,  Kuang-Chih Cheng ,  Ming-Chieh Chen ,  Kevin Lee ,  Jui-Hsiang Pan

Inventor： Joseph Sun ,  Kuang-Chih Cheng ,  Ming-Chieh Chen ,  Kevin Lee ,  Jui-Hsiang Pan

IPC: H01R12/00

CPC classification number: H01L27/14618 ,  H01L23/49816 ,  H01L23/4985 ,  H01L27/14621 ,  H01L27/14627 ,  H01L27/14634 ,  H01L27/14683 ,  H01L2224/05571 ,  H01L2224/05573 ,  H01L2224/05624 ,  H01L2224/05647 ,  H01L2224/13 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2924/16235 ,  H05K3/323 ,  H05K3/361 ,  H05K2201/0367 ,  Y10T29/49144 ,  H01L2924/00014 ,  H01L2924/00

Abstract: A package of a semiconductor device with a flexible wiring substrate and a method thereof are provided. The package of the semiconductor device includes a semiconductor substrate with at least one pad on a surface thereof, a bump bonded to the pad, an adhesive layer on the bump, and a flexible wiring substrate having at least one contact section being electrically connected with the bump by the adhesive layer. The present invention makes the flexible wiring substrate directly conductively attached onto the semiconductor substrate. The package size is shrunk and the cost down can be obtained.

Abstract translation: 提供具有柔性布线基板的半导体器件的封装及其方法。 该半导体器件的封装包括：半导体衬底，其表面上具有至少一个衬垫，与焊盘接合的凸块，凸块上的粘合剂层;以及柔性布线衬底，具有至少一个接触部分与 由粘合剂层撞击。 本发明使柔性布线基板直接导电地附着在半导体基板上。 包装尺寸缩小，可以降低成本。

公开(公告)号：US20050190290A1

公开(公告)日：2005-09-01

申请号：US10791410

申请日：2004-03-01

Applicant: Cheng-Kuang Sun ,  Kuang-Chih Cheng ,  Ming-Chieh Chen ,  Kuang-Shin Lee

Inventor： Cheng-Kuang Sun ,  Kuang-Chih Cheng ,  Ming-Chieh Chen ,  Kuang-Shin Lee

IPC: H01L27/00 ,  H01L27/146 ,  H01L31/0203 ,  H04N1/00 ,  H04N5/225

CPC classification number: H04N5/2253 ,  H01L27/14618 ,  H01L27/14625 ,  H01L27/14634 ,  H01L27/14636 ,  H01L31/0203 ,  H01L2224/16225 ,  H04N2101/00 ,  H01L2224/48091 ,  H01L2924/00014

Abstract: A camera module is provided. The camera module comprises: a lens; a holder having a lower portion, the holder holding the lens; a circuit board; and an image sensing and processing unit including an image sensing device and an optional signal processing device stacked on and electrically connected to the image sensing device, the image sensing and processing unit being packaged on one side of the circuit board; wherein the holder is fixed on the circuit board, the image sensing and processing unit inside the lower portion of the holder. Further, if the circuit board is a flexible circuit board, then a hard plate can be disposed on the other side of the flexible PCB corresponding to the image sensing and processing unit in order to enhance the mechanical strength.

Abstract translation: 提供相机模块。 相机模块包括：透镜; 具有下部的保持器，保持器保持透镜; 电路板; 以及图像感知和处理单元，其包括层叠在图像感测装置上并与其电连接的图像感测装置和可选的信号处理装置，所述图像感测处理单元被封装在所述电路板的一侧上; 其中，所述保持器固定在所述电路板上，所述图像感测处理单元位于所述保持器的下部内部。 此外，如果电路板是柔性电路板，则可以在对应于图像感测和处理单元的柔性PCB的另一侧上设置硬板，以增强机械强度。

公开(公告)号：US20050161815A1

公开(公告)日：2005-07-28

申请号：US10764469

申请日：2004-01-27

Applicant: Joseph Sun ,  Kuang-Chih Cheng ,  Ming-Chieh Chen

Inventor： Joseph Sun ,  Kuang-Chih Cheng ,  Ming-Chieh Chen

IPC: H01L21/00 ,  H01L21/48 ,  H01L23/48 ,  H01L23/498 ,  H01L27/146 ,  H01L31/0203 ,  H05K3/32 ,  H05K3/36

CPC classification number: H01L27/14618 ,  H01L23/49816 ,  H01L23/4985 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48472 ,  H05K3/323 ,  H05K3/361 ,  H05K2201/0367 ,  H01L2924/00014 ,  H01L2924/00

Abstract: A package of a semiconductor device with a flexible wiring substrate and a method thereof are provided. The package of the semiconductor device includes a semiconductor substrate with at least one pad on a surface thereof, a bump bonded to the pad, an adhesive layer on the bump, and a flexible wiring substrate having at least one contact section being electrically connected with the bump by the adhesive layer. The present invention makes the flexible wiring substrate directly conductively attached onto the semiconductor substrate. The package size is shrunk and the cost down can be obtained.

公开(公告)号：US20050161756A1

公开(公告)日：2005-07-28

申请号：US11050814

申请日：2005-01-27

Applicant: Joseph Sun ,  Kuang-Chih Cheng ,  Ming-Chieh Chen ,  Kevin Lee ,  Jui-Hsiang Pan

Inventor： Joseph Sun ,  Kuang-Chih Cheng ,  Ming-Chieh Chen ,  Kevin Lee ,  Jui-Hsiang Pan

IPC: H01L21/00 ,  H01L21/48 ,  H01L23/48 ,  H01L23/498 ,  H01L27/146 ,  H01L31/0203 ,  H05K3/32 ,  H05K3/36

CPC classification number: H01L27/14618 ,  H01L23/49816 ,  H01L23/4985 ,  H01L27/14621 ,  H01L27/14627 ,  H01L27/14634 ,  H01L27/14683 ,  H01L2224/05571 ,  H01L2224/05573 ,  H01L2224/05624 ,  H01L2224/05647 ,  H01L2224/13 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2924/16235 ,  H05K3/323 ,  H05K3/361 ,  H05K2201/0367 ,  Y10T29/49144 ,  H01L2924/00014 ,  H01L2924/00

Abstract: A package of a semiconductor device with a flexible wiring substrate and a method thereof are provided. The package of the semiconductor device includes a semiconductor substrate with at least one pad on a surface thereof, a bump bonded to the pad, an adhesive layer on the bump, and a flexible wiring substrate having at least one contact section being electrically connected with the bump by the adhesive layer. The present invention makes the flexible wiring substrate directly conductively attached onto the semiconductor substrate. The package size is shrunk and the cost down can be obtained.

Abstract translation: 提供具有柔性布线基板的半导体器件的封装及其方法。 该半导体器件的封装包括：半导体衬底，其表面上具有至少一个衬垫，与焊盘接合的凸块，凸块上的粘合剂层;以及柔性布线衬底，具有至少一个接触部分与 由粘合剂层撞击。 本发明使柔性布线基板直接导电地附着在半导体基板上。 包装尺寸缩小，可以降低成本。

公开(公告)号：USD734086S1

公开(公告)日：2015-07-14

申请号：US29492436

申请日：2014-05-30

Applicant: Shun-Chuan Tseng ,  Chang-Xin Ye ,  Ming-Chieh Chen

Designer： Shun-Chuan Tseng ,  Chang-Xin Ye ,  Ming-Chieh Chen

公开(公告)号：US5357681A

公开(公告)日：1994-10-25

申请号：US192643

申请日：1994-02-07

Applicant: Ming-Chieh Chen

Inventor： Ming-Chieh Chen

IPC: B43L11/08 ,  B43L11/00

CPC classification number: B43L11/08

Abstract: A gear socket structure for a designing rule, of which the gear socket is a round cylinder, having a given height; the wall of the gear socket is provided with two leaf springs; the top of each leaf spring has an inward catch hook; the gear socket can accommodate a plurality of gears, which are held in place by means of the catch hooks without falling out unintentionally.

Abstract translation: 用于设计规则的齿轮座结构，其齿轮座是具有给定高度的圆筒; 齿轮座的壁上设有两个板簧; 每个板簧的顶部有一个向内的钩钩; 齿轮座可以容纳多个齿轮，这些齿轮通过抓钩保持在适当位置，而不会无意中掉落。