Method of forming metallic fuse demanding lower laser power for circuit repair
    1.
    发明授权
    Method of forming metallic fuse demanding lower laser power for circuit repair 有权
    形成金属保险丝的方法,要求较低的激光功率进行电路修复

    公开(公告)号:US06177297B1

    公开(公告)日:2001-01-23

    申请号:US09227953

    申请日:1999-01-11

    IPC分类号: H01L2182

    摘要: An improved formation method produces a metallic fuse capable of lowering the laser power needed for carrying out circuit repair. The method includes forming a metallic fuse when the penultimate metallic layer is formed. Since the metallic fuse is not too far away from the top surface, the power of the laser beam necessary for repairing the circuit can be moderate. Furthermore, the laser beam is more focused because it travels a shorter distance to reach the fuse, thereby avoiding unnecessary dispersion through intermediate material. Moreover, since the metallic fuse itself is not too thick, only a low-power laser beam is needed to melt the metallic fuse.

    摘要翻译: 改进的形成方法产生能够降低执行电路修复所需的激光功率的金属保险丝。 该方法包括在倒数第二个金属层形成时形成金属熔丝。 由于金属保险丝距离顶表面不是太远,修理电路所需的激光束的功率可以适中。 此外,激光束由于其行进较短的距离而到达保险丝而被聚焦,从而避免了通过中间材料的不必要的分散。 此外,由于金属熔断器本身不太厚,所以仅需要低功率激光束来熔化金属熔断器。

    Method for fabricating an embedded dynamic random access memory using
self-aligned silicide technology
    2.
    发明授权
    Method for fabricating an embedded dynamic random access memory using self-aligned silicide technology 有权
    使用自对准硅化物技术制造嵌入式动态随机存取存储器的方法

    公开(公告)号:US6133130A

    公开(公告)日:2000-10-17

    申请号:US181530

    申请日:1998-10-28

    摘要: A method includes a self-aligned silicide (Salicide) technology in fabrication of an embedded dynamic random access memory (DRAM). On a silicon wafer, a first MOS transistor is formed in a logic device region, and second MOS transistor is formed in a memory device region. The improved method includes forming an insulating layer over the substrate at least covering the first (second) MOS transistor. A top portion of the insulating layer is removed to expose only a top portion of the first (second) gate structure. A portion of the insulating layer covering the first MOS transistor is removed to expose the first MOS transistor. Using the remaining insulating layer on the second MOS transistor as a mask, the Salicide fabrication process is performed to form a self-aligned silicide layer on the first interchangeable source/drain region, and the exposed top surface of the first (second) polysilicon gate structure.

    摘要翻译: 一种方法包括在嵌入式动态随机存取存储器(DRAM)的制造中的自对准硅化物(Salicide)技术。 在硅晶片上,第一MOS晶体管形成在逻辑器件区域中,第二MOS晶体管形成在存储器件区域中。 改进的方法包括在衬底上形成至少覆盖第一(第二)MOS晶体管的绝缘层。 去除绝缘层的顶部以仅露出第一(第二)栅极结构的顶部。 覆盖第一MOS晶体管的绝缘层的一部分被去除以暴露第一MOS晶体管。 使用第二MOS晶体管上的剩余绝缘层作为掩模,执行自对准硅化物制造工艺以在第一可互换源极/漏极区上形成自对准硅化物层,并且第一(第二)多晶硅栅极的暴露的顶表面 结构体。

    Single-shooting/continuous-shooting control switch for penumatic nail
guns
    3.
    发明授权
    Single-shooting/continuous-shooting control switch for penumatic nail guns 失效
    单枪/连续拍摄控制开关,用于阴茎指甲枪

    公开(公告)号:US5522532A

    公开(公告)日:1996-06-04

    申请号:US403616

    申请日:1995-03-14

    申请人: Jacob Chen

    发明人: Jacob Chen

    IPC分类号: B25C1/00 B25C1/04

    CPC分类号: B25C1/008 B25C1/04

    摘要: A single-shooting/continuous-shooting control switch installed in a pneumatic nail gun for controlling the firing of nails, the control switch including a first valve seat connected to a pneumatic pressure source, a second valve seat connected between the first valve seat and the firing pin of the pneumatic nail gun, a first valve rod moved by the trigger of the pneumatic nail gun to control the air passage between the first air valve seat and the second air valve seat, a second valve rod moved by the trigger of the pneumatic nail gun to control the air passage between the second air valve seat and the firing pin, and a stop block turned about the first valve rod between between a first position for letting the first valve rod be lifted by the trigger to stop the passage between the first air passage and the second air passage for a single-shooting operation, and a second position to stop the trigger from lifting the first valve rod for letting pneumatic pressure be continuosuly drawn from the first air valve seat into the second air valve seat for a continuous shooting operation.

    摘要翻译: 安装在气枪式喷枪中用于控制指甲点火的单次/连续拍摄控制开关,该控制开关包括连接到气动压力源的第一阀座,连接在第一阀座与第二阀座之间的第二阀座 气动钉枪的撞针,由气动钉枪触发器移动的第一阀杆,以控制第一空气阀座与第二空气阀座之间的空气通道,由气动扳机触发的第二阀杆 用于控制第二空气阀座和撞击销之间的空气通道的止动块,以及在第一位置之间转动第一阀杆的止动块,用于使第一阀杆由触发器提升以阻止第二阀杆之间的通道 第一空气通道和第二空气通道用于单次拍摄操作,并且第二位置用于停止触发器提升第一阀杆以使气动压力被连续抽出 从第一空气阀座进入第二空气阀座进行连续拍摄操作。

    Method of forming salicide in embedded dynamic random access memory
    4.
    发明授权
    Method of forming salicide in embedded dynamic random access memory 失效
    嵌入式动态随机存取存储器中形成自杀人的方法

    公开(公告)号:US06225155B1

    公开(公告)日:2001-05-01

    申请号:US09208602

    申请日:1998-12-08

    IPC分类号: H01L218234

    摘要: In a method of forming a salicide layer in an embedded dynamic random access memory, a thin oxide layer, a silicon nitride layer and a thick oxide layer are sequentially formed over a substrate after performing an annealing process to a source/drain region. The insulating layer on a gate and a source/drain region in a logic region and a gate in a memory region. Salicide layers are formed on the three regions mentioned above. Formation of the salicide layers can lower resistance of the three regions, increase speed and can avoid forming a salicide layer on the source/drain region in the memory region. Thus, current leakage can be avoided. In addition, the step of forming a salicide layer is conducted after the annealing process of the source/drain region, so problems of thermal stability and inter-diffusion of impurities in the polysilicon layer can also be solved.

    摘要翻译: 在嵌入式动态随机存取存储器中形成硅化物层的方法中,在对源极/漏极区域进行退火处理之后,在衬底上顺序地形成薄氧化物层,氮化硅层和厚氧化物层。 逻辑区域中的栅极和源极/漏极区域上的绝缘层以及存储区域中的栅极。 在上述三个区域上形成硅化物层。 自对准层的形成可以降低三个区域的电阻,提高速度,并且可以避免在存储区域的源极/漏极区域上形成自对准硅化物层。 因此,可以避免电流泄漏。 此外,在源极/漏极区域的退火处理之后进行形成硅化物层的步骤,因此也可以解决多晶硅层中的杂质的热稳定性和相互扩散问题。

    Manufacturing method of a bottom plate
    5.
    发明授权
    Manufacturing method of a bottom plate 失效
    底板的制造方法

    公开(公告)号:US06218239B1

    公开(公告)日:2001-04-17

    申请号:US09195168

    申请日:1998-11-17

    IPC分类号: H01L218242

    摘要: The invention provides a manufacturing method of forming a bottom plate for a capacitor on a substrate, wherein the substrate comprises a MOS transistor having a gate and a pair of source/drain regions. A crown-liked conductive plate is formed over an insulation oxide layer and a contact plug. The crown-liked conductive plate penetrates the insulation layer and the stop layer, wherein the bottom of the crown-like conductive plate is electrically connected to the contact plug. The crown-like conductive plate, served as the bottom plate for a DRAM capacitor, is composed of tungsten silicide or a combination of a tungsten nitride layer and a tungsten layer.

    摘要翻译: 本发明提供一种在基板上形成用于电容器的底板的制造方法,其中所述基板包括具有栅极和一对源极/漏极区域的MOS晶体管。 冠状导电板形成在绝缘氧化物层和接触插塞上。 冠状导电板穿透绝缘层和阻挡层,其中冠状导电板的底部电连接到接触插塞。 用作DRAM电容器的底板的冠状导电板由硅化钨或氮化钨层和钨层的组合构成。

    Method of fabricating self-aligned contact in embedded DRAM
    6.
    发明授权
    Method of fabricating self-aligned contact in embedded DRAM 有权
    嵌入式DRAM中自对准接触的制作方法

    公开(公告)号:US06200848B1

    公开(公告)日:2001-03-13

    申请号:US09208612

    申请日:1998-12-08

    IPC分类号: H01L218242

    CPC分类号: H01L27/10888 H01L27/10894

    摘要: A method of fabricating a self-aligned contact. A substrate is defined as a memory region and a logic region. Metal oxide semiconductors and source/drain regions are respectively formed in the memory region and in the logic region. A defined dielectric layer is formed over the substrate. Contact holes are respectively formed in the memory region and in the logic region until the source/drain regions are exposed. Silicide layers are formed over the contact holes. Portions of the silicide layer extend to surface of the dielectric layer neighboring the contact holes. A defined inter-layer dielectric layer is formed over the substrate. Vias are respectively formed in the memory region and in the logic region. The vias are filled with conductive layers. The self-aligned contact is formed.

    摘要翻译: 一种制造自对准接触的方法。 衬底被定义为存储区域和逻辑区域。 金属氧化物半导体和源极/漏极区域分别形成在存储区域和逻辑区域中。 在衬底上形成限定的电介质层。 接触孔分别形成在存储区域和逻辑区域中,直到源极/漏极区域露出。 硅化物层形成在接触孔上。 硅化物层的一部分延伸到与接触孔相邻的电介质层的表面。 在衬底上形成限定的层间电介质层。 通孔分别形成在存储器区域和逻辑区域中。 通孔填充有导电层。 形成自对准接触。

    Method for forming polycide dual gate
    7.
    发明授权
    Method for forming polycide dual gate 失效
    多晶硅双栅极的形成方法

    公开(公告)号:US06197672B1

    公开(公告)日:2001-03-06

    申请号:US09208271

    申请日:1998-12-08

    IPC分类号: H01L213205

    CPC分类号: H01L21/28061 H01L29/4941

    摘要: A method for forming a dual polycide gate. A substrate that has an isolation structure is provided, a polysilicon layer (or an &agr;-Si layer) is deposited over the substrate, N-type and P-type dopants are implanted into the polysilicon layer to form a dual gate having an N-type gate and a P-type gate. An annealing step is performed to restore the surface crystal structure of the polysilicon layer, an oxide layer is deposited on the doped polysilicon layer, and a silicide layer is formed over the oxide layer. The silicide layer, the oxide layer and the polysilicon layer are defined to form a polycide gate, a lightly doped source/drain region is formed beside the gate in the substrate. A spacer is formed on the sidewall of the gate, and a heavily doped source/drain region is formed beside the spacer in the substrate.

    摘要翻译: 一种形成双重多晶硅栅极的方法。 提供具有隔离结构的衬底,在衬底上沉积多晶硅层(或α-Si层),将N型和P型掺杂剂注入到多晶硅层中以形成具有N- 型门和P型门。 执行退火步骤以恢复多晶硅层的表面晶体结构,在掺杂多晶硅层上沉积氧化物层,并且在氧化物层上形成硅化物层。 硅化物层,氧化物层和多晶硅层被定义为形成多晶硅栅极,在衬底的栅极旁边形成轻掺杂的源极/漏极区域。 在栅极的侧壁上形成间隔物,并且在衬底中的间隔物旁边形成重掺杂的源/漏区。

    Manufacturing method capable of preventing corrosion of metal oxide semiconductor
    8.
    发明授权
    Manufacturing method capable of preventing corrosion of metal oxide semiconductor 有权
    能够防止金属氧化物半导体的腐蚀的制造方法

    公开(公告)号:US06177334B1

    公开(公告)日:2001-01-23

    申请号:US09203024

    申请日:1998-12-01

    IPC分类号: H01L2120

    摘要: A manufacturing method is capable of preventing corrosion of a metal oxide semiconductor. The manufacturing method sequentially forms a polysilicon layer, a silicide layer and a top cap layer over a substrate, and then etching to form a gate structure. Next, a rapid thermal process is carried out to form an oxide layer over the exposed sidewalls of the silicide layer. Finally, the substrate is cleaned, and then of a source/drain region having a lightly doped drain structure is formed on each side of the gate.

    摘要翻译: 制造方法能够防止金属氧化物半导体的腐蚀。 制造方法在衬底上顺序地形成多晶硅层,硅化物层和顶盖层,然后蚀刻以形成栅极结构。 接下来,进行快速热处理以在硅化物层的暴露的侧壁上形成氧化物层。 最后,清洗衬底,然后在栅极的每一侧形成具有轻掺杂漏极结构的源/漏区。

    Exhaust hood mounting structure for pneumatic nail guns
    9.
    发明授权
    Exhaust hood mounting structure for pneumatic nail guns 失效
    气动钉枪排气罩安装结构

    公开(公告)号:US5560528A

    公开(公告)日:1996-10-01

    申请号:US439018

    申请日:1995-05-11

    申请人: Jacob Chen

    发明人: Jacob Chen

    IPC分类号: B25C1/04

    CPC分类号: B25C1/047

    摘要: An exhaust hood mounting structure for pneumatic nail guns, including an exhaust hood mounted on the exhaust port of a pneumatic nail gun and having a center countersunk hole, a locating cup mounted within the center countersunk hole on the exhaust hood and having a center through hole, a screw inserted through the center through hole on the locating cup and the center countersunk hole on the exhaust hood and then threaded into a screw hole on the pneumatic nail gun within the exhaust port, wherein a corrugated spring is mounted around the screw and retained between the exhaust hood and the locating cup for permitting the exhaust hood to be turned round the screw to the desired angle by hand and retained in the adjusted position when released from hand.

    摘要翻译: 一种用于气动钉枪的排气罩安装结构,包括安装在气动钉枪排气口上的排气罩,并具有中心埋头孔,定位杯安装在排气罩上的中心沉孔内,并具有中心通孔 ,一个穿过定位杯的中心通孔和排气罩上的中心沉孔插入的螺钉,然后拧入排气口内的气动钉枪上的螺孔,其中一个波纹弹簧安装在螺钉周围并保持 在排气罩和定位杯之间,用于允许排气罩用手旋转到所需的角度,并且在从手上释放时保持在调节位置。

    Method of fabricating well
    10.
    发明授权
    Method of fabricating well 失效
    制作方法

    公开(公告)号:US06297133B1

    公开(公告)日:2001-10-02

    申请号:US09123737

    申请日:1998-07-28

    IPC分类号: H01L21265

    摘要: A method of manufacturing wells comprises the step of providing a p-type substrate and then sequentially forming a p-well and n-well with low dosage in the p-type substrate. Thereafter, energy is used to dope n-type ions into the p-well. The triple well formed in the present invention has low dosage ions, hence the DRAM formed on the triple well in subsequent process can have a faster refresh time.

    摘要翻译: 制造井的方法包括提供p型衬底,然后在p型衬底中以低剂量顺序形成p阱和n-阱的步骤。 此后,使用能量将n型离子掺杂到p阱中。 在本发明中形成的三重阱具有低剂量离子,因此在后续工艺中形成在三阱上的DRAM可以具有更快的刷新时间。