摘要:
A method of manufacturing a semiconductor device includes first and second processes, the latter requiring more processing time. An apparatus for performing the semiconductor manufacturing process includes a first reactor, and a plurality of second reactors for each first reactor. A first group of wafers are subjected to the first process within the first reactor, and are then transferred into a second reactor as isolated from the outside air. The first group of wafers is subjected to the second process within the second reactor. At the same time, a second group of wafers are subjected to the first process within the first reactor. After the first process is completed, the second group of wafers is transferred into an unoccupied one of the second reactors as isolated from the outside air. There, the second group of wafers is subjected to the second process. Accordingly, process failures otherwise due to the exposure of the wafers are minimized, and productivity is high despite the difference in the processing times.
摘要:
A chemical vapor deposition apparatus includes a processing chamber formed by an external tube, and an internal tube installed inside the external tube, a wafer boat securable within the processing chamber, and a single gas diffusing nozzle extending vertically within the processing chamber. The gas diffusing nozzle includes an outer tubular member having a closed top end, a diaphragm dividing the interior of the tubular member into two regions disposed side by side, and columns of gas diffusing openings extending through the tubular member on opposite sides of the diaphragm, respectively. The gas infused through the gas diffusing nozzle is forced by the diaphragm to rise up one side region of the tubular member and then descend through the other side region. In this way, the gas is evenly distributed to the wafers situated in the boat. Accordingly, the reaction time necessary for the gas to form identical layers on the wafers is minimized, the quality and reliability of the wafers is improved, and the production rate is increased.
摘要:
A vacuum processing apparatus is provided with: a vacuum processing tank; a first gas introduction section that is constructed such that a first processing gas in a radical state is introduced into the vacuum processing tank and is guided to a semiconductor wafer; and a second gas introduction section that is constructed such that a second processing gas that reacts with the first processing gas is introduced into the vacuum processing tank and is guided to the semiconductor wafer. The second gas introduction section has two shower nozzles provided at positions on either side of an introduction pipe provided for the first gas introduction section. According to this vacuum processing apparatus, high speed processing of a number of processing objects can be achieved. Moreover, the in-plane uniformity of the processing objects after processing can be ensured.
摘要:
A method of manufacturing a semiconductor device includes first and second processes, the latter requiring more processing time. An apparatus for performing the semiconductor manufacturing process includes a first reactor, and a plurality of second reactors for each first reactor. A first group of wafers are subjected to the first process within the first reactor, and are then transferred into a second reactor as isolated from the outside air. The first group of wafers is subjected to the second process within the second reactor. At the same time, a second group of wafers are subjected to the first process within the first reactor. After the first process is completed, the second group of wafers is transferred into an unoccupied one of the second reactors as isolated from the outside air. There, the second group of wafers is subjected to the second process. Accordingly, process failures otherwise due to the exposure of the wafers are minimized, and productivity is high despite the difference in the processing times.
摘要:
The present invention relates to a semiconductor manufacturing furnace having a heat blocker mounted to an elevating plate of the furnace. The heat blocker prevents the internal temperature of the furnace from decreasing radically when a wafer boat is lowered from the processing chamber of the furnace by the elevating plate. The heat blocker includes a sealed case, a plurality of horizontally extending heat-reflecting plates disposed in the case, and a plurality of support pins for supporting and fixing the reflecting plates in place. The heat-reflecting plates reflect heat back up into the processing chamber, as the elevating plate lowers the wafer boat, to keep the internal temperature of the heater stable. This not only enhances the productivity of the manufacturing process but also enhances the uniformity of the processed wafers.
摘要:
A wiper blade includes a wiper strip for contacting a windshield glass of a vehicle, a lever assembly supporting the wiper strip to squeeze onto the windshield glass, and a cover member containing the lever assembly, wherein the lever assembly includes, a pair of first levers, each with both ends engaged with and point-supporting the wiper strip to form an engaging portion on the wiper strip respectively, and a pair of the second levers, each with one end hinge-coupled to a corresponding one of the first levers and with the other end coupled with the cover member and the wiper strip.
摘要:
A wiper blade assembly for a vehicle. The present invention relates to a wiper blade assembly, and more particularly to a wiper blade assembly which can prevent lifting and chattering of a wiper blade in order to perform stable wiping when the chide is driven at a high speed. Further, the present invention provides a wiper blade assembly including an adaptor part which can be coupled with various wiper arms.
摘要:
A wiper blade for a vehicle may include a secondary lever including a lever rivet hole, an adapter including a guide rib formed in the longitudinal direction thereof, a locking projection formed at the rear thereof, and an adapter rivet hole, a primary cover including a guide groove formed in the longitudinal direction thereof and into which the guide rib of the adapter is inserted, and a locking groove into which the locking projection of the adapter is inserted, and a hinge member penetrating the lever rivet hole and the adapter rivet hole and pivotally coupling the adapter and secondary lever.
摘要:
A wiper blade includes a wiper strip for contacting a windshield glass of a vehicle, a lever assembly supporting the wiper strip to squeeze onto the windshield glass, and a cover member containing the lever assembly, wherein the lever assembly includes, a pair of first levers, each with both ends engaged with and point-supporting the wiper strip to form an engaging portion on the wiper strip respectively, and a pair of the second levers, each with one end hinge-coupled to a corresponding one of the first levers and with the other end coupled with the cover member and the wiper strip.
摘要:
A wiper blade for a vehicle may include a secondary lever including a lever rivet hole, an adapter including a guide rib formed in the longitudinal direction thereof, a locking projection formed at the rear thereof, and an adapter rivet hole, a primary cover including a guide groove formed in the longitudinal direction thereof and into which the guide rib of the adapter is inserted, and a locking groove into which the locking projection of the adapter is inserted, and a hinge member penetrating the lever rivet hole and the adapter rivet hole and pivotally coupling the adapter and secondary lever.