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    Portable emission microscope workstation for failure analysis
    2.
    发明授权
    Portable emission microscope workstation for failure analysis 失效
    便携式发射显微镜工作站进行故障分析

    公开(公告)号：US5892539A

    公开(公告)日：1999-04-06

    申请号：US555186

    申请日：1995-11-08

    Applicant: James Barry Colvin

    Inventor： James Barry Colvin

    IPC: G01R31/311 ,  G02B21/00 ,  H04N7/18

    CPC classification number: H04N7/183 ,  G01R31/311 ,  G02B21/0008

    Abstract: A more efficient portable emission microscope system comprising a cooled CCD camera coupled to microscope optics for detection of photon emissions from integrated circuits. Portability is achieved with a small light tight box and rubber boot combination which are used in conjunction with a probe station or portable stand. The optics are modified to contain an illuminating ring of light emitting diodes for sample illumination prior to or after emission acquisition. Sensitivity is increased by elevating the substrate temperature. In operation, an integrated circuit is enclosed by a rubber boot. An illuminated reference image is then obtained with the LEDs "on," and a background image is obtained with the LEDs "off." The background image represents illumination noise. The temperature of the circuit is then raised while the circuit is biased. Temperature elevation is accomplished by installing small power resistors at the base of an appropriate burn-in socket. This elevation in temperature causes photon emissions from faults in the circuit. An illumination image is then obtained which captures the photon emissions. The background image is then subtracted from the illumination image to filter the image. Finally, the illumination image is superimposed on the reference image to allow a user to determine the exact location of any failures.

    Abstract translation: 一种更高效的便携式发射显微镜系统，包括耦合到显微镜光学器件的冷却CCD照相机，用于检测集成电路的光子发射。 便携性通过与探头台或便携式支架结合使用的小型防光盒和橡胶靴组合实现。 光学器件被修改为在发射采集之前或之后包含用于样品照明的发光二极管的照明环。 通过提高衬底温度来增加灵敏度。 在操作中，集成电路由橡胶套包围。 然后在LED“开”的情况下获得照亮的参考图像，并且在LED“关闭”的情况下获得背景图像。 背景图像表示照明噪声。 然后在电路偏置时升高电路的温度。 温度升高通过在适当的老化插座的底部安装小功率电阻来实现。 这种温度升高导致电路中的故障发生光子。 然后获得捕获光子发射的照明图像。 然后从照明图像中减去背景图像以过滤图像。 最后，将照明图像叠加在参考图像上，以允许用户确定任何故障的确切位置。

    Emission microscopy system and method
    4.
    发明授权
    Emission microscopy system and method 有权
    发射显微镜系统及方法

    公开(公告)号：US6112004A

    公开(公告)日：2000-08-29

    申请号：US181117

    申请日：1998-10-28

    Applicant: James Barry Colvin

    Inventor： James Barry Colvin

    IPC: G02B6/42 ,  G02B6/06

    CPC classification number: G02B6/42 ,  G02B6/4249 ,  G02B6/4296 ,  Y10S385/902

    Abstract: An emission microscopy system with a coherent illuminator system and method wherein an incident energy beam is directed at an end of image conduit rotating around its axis. The incident energy beam may be generated by a laser or similar radiation source. A substantially cylindrically uniform radiation spot is obtained from the other end of the image conduit, which may be guided by waveguide means to an emission microscope used in IC failure analysis.

    Abstract translation: 具有相干照明器系统和方法的发射显微镜系统，其中入射能量束被引导到围绕其轴线旋转的图像导管的端部。 入射能量束可以由激光或类似的辐射源产生。 从图像导管的另一端获得基本上圆柱形均匀的辐射点，其可以由波导装置引导到IC故障分析中使用的发射显微镜。

    Coherent illumination system and method
    6.
    发明授权
    Coherent illumination system and method 有权
    相干照明系统及方法

    公开(公告)号：US06134365A

    公开(公告)日：2000-10-17

    申请号：US181261

    申请日：1998-10-28

    Applicant: James Barry Colvin

    Inventor： James Barry Colvin

    IPC: G02B6/36 ,  G02B6/42 ,  G02B6/06

    CPC classification number: G02B6/3604 ,  G02B6/4296 ,  G02B6/4249 ,  Y10S385/901 ,  Y10S385/902

    Abstract: A coherent illuminator system and method wherein an incident energy beam is directed at an end of image conduit rotating around its axis. The incident energy beam may be generated by a laser, maser, or similar radiation source. A substantially cylindrically uniform radiation spot is obtained from the other end of the image conduit, which may be guided by waveguide means to an application element such as, for example, an emission microscope or a medical instrument.

    Abstract translation: 一种相干照明系统和方法，其中入射能量束指向围绕其轴线旋转的图像导管的端部。 入射能量束可以由激光，激光器或类似的辐射源产生。 从图像导管的另一端获得基本上圆柱形的均匀的辐射点，其可以由波导装置引导到诸如发射显微镜或医疗器械的施加元件。

    Integrated circuit failure analysis using color voltage contrast
    7.
    发明授权
    Integrated circuit failure analysis using color voltage contrast 失效
    集成电路故障分析采用彩色电压对比度

    公开(公告)号：US5970167A

    公开(公告)日：1999-10-19

    申请号：US744372

    申请日：1996-11-07

    Applicant: James Barry Colvin

    Inventor： James Barry Colvin

    IPC: G01R31/307 ,  G06T7/00 ,  G06K9/00

    CPC classification number: G06T7/001 ,  G01R31/307 ,  G06T2207/10061 ,  G06T2207/30148

    Abstract: A method and apparatus for analyzing failures in integrated circuits. A first image is obtained using an emission or electron microscope while an integrated circuit is operating under a first set of conditions. The image is integrated for improved resolution with a camera in front of the microscope screen or with a digitizer coupled to receive video signals from the microscope. The first image is digitized and stored in a first channel of an RGB digitizer board and displayed on a display screen. A second image is obtained in the same way and is digitized and stored in a second channel of the RGB digitizer board and displayed on the display screen. The remaining channel of the RGB digitizer board is coupled to receive live images. The resulting combined image appears as a black and white image so long as the images are aligned. Any differences between the three images will appear conspicuously in color. The input logic levels to the integrated circuit are changed. Nodes having changed logic levels will appear in color in the display because they will only affect the third channel. In addition, the displayed image will simultaneously show nodes which have not changed states in different shades of grey depending upon the unchanged logic level. The displayed image may then be compared to a previously obtained reference image from an integrated circuit known to not have any defects. Any differences between the two images will indicate the exact location of a failure or defect.

    Abstract translation: 一种用于分析集成电路故障的方法和装置。 当集成电路在第一组条件下运行时，使用发射或电子显微镜获得第一图像。 该图像被集成，用于在显微镜屏幕前方具有相机以提高分辨率，或者使用耦合以从显微镜接收视频信号的数字转换器。 第一个图像被数字化并存储在RGB数字转换器板的第一通道中并显示在显示屏上。 以相同的方式获得第二个图像，并将其数字化并存储在RGB数字转换器板的第二个通道中，并显示在显示屏上。 RGB数字转换器板的剩余通道被耦合以接收实时图像。 只要图像对齐，所得到的组合图像就显示为黑白图像。 三个图像之间的任何差异将显得显眼。 集成电路的输入逻辑电平发生变化。 具有改变的逻辑电平的节点将在显示器中显示为彩色，因为它们将仅影响第三通道。 此外，显示的图像将同时显示根据不变的逻辑电平，不同状态的节点不同的灰度。 然后可以将所显示的图像与已知不具有任何缺陷的集成电路与先前获得的参考图像进行比较。 两个图像之间的任何差异将指示故障或缺陷的确切位置。

    Wire-to-wire bonding system and method
    8.
    发明授权
    Wire-to-wire bonding system and method 有权
    线对线接合系统和方法

    公开(公告)号：US06245586B1

    公开(公告)日：2001-06-12

    申请号：US09415517

    申请日：1999-10-07

    Applicant: James Barry Colvin

    Inventor： James Barry Colvin

    IPC: H01L2166

    CPC classification number: G01N1/32 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2924/15311 ,  H01L2924/00014 ,  H01L2924/00

    Abstract: A system and method for preparing semiconductor samples for analytical techniques such as backside emission microscopy. Samples may be prepared from a wafer or packaged die. In package form, the package is affixed to a polishing jig such that the backside of the die is oriented to face a polishing wheel. The package material is removed until die attach paddle and the backside of the die are exposed. The material is further removed until a selected thinness of the die is obtained. If the package's leadframe or a portion thereof remains after the removal of package material, a suitable testing fixture is attached thereto. If the leadframe is sacrificed, wire spots on the polished side of the semiconductor die are wire-to-wire bonded to a second leadframe's conductive fingers. In wafer form, the die is separated and encapsulated with a suitable substantially rigid material to form a substantially rigid body that is affixed to the polishing jig.

    Abstract translation: 用于制备用于分析技术例如背面发射显微镜的半导体样品的系统和方法。 样品可以从晶片或包装的模具制备。 在包装形式中，包装被固定到抛光夹具上，使得模具的背面定向成面向抛光轮。 去除包装材料，直到裸片附着桨和裸片的背面露出。 进一步去除材料，直到获得所选择的模具薄度。 如果包装的引线框架或其一部分在去除包装材料之后仍然存在，则将合适的测试夹具附接到其上。 如果引线架被牺牲，则半导体管芯的抛光侧上的导线点线对线接合到第二引线框架的导电指状物。 在晶片形式中，模具被分离并用合适的基本上刚性的材料包封以形成固定到抛光夹具上的基本刚性的主体。

    Elimination of vibration by vibration coupling in microscopy applications
    9.
    发明授权
    Elimination of vibration by vibration coupling in microscopy applications 失效
    通过显微镜应用中的振动耦合消除振动

    公开(公告)号：US5764409A

    公开(公告)日：1998-06-09

    申请号：US638638

    申请日：1996-04-26

    Applicant: James Barry Colvin

    Inventor： James Barry Colvin

    IPC: G01R31/302 ,  G01R31/307 ,  G02B21/00 ,  G02B21/24 ,  G02B27/64 ,  H01L21/66 ,  F16F7/00 ,  H01J37/285

    CPC classification number: G01R31/307 ,  G02B21/0016 ,  G02B27/64

    Abstract: A portable emission microscope for analyzing failures in an integrated circuit chip while the chip is contained within a wafer sorter. A base for the microscope is placed over an opening in the wafer sorter. A translational apparatus is attached to the base for lowering a charge coupled device camera into an opening in the wafer sorter. A compact housing containing microscope optics is coupled to the camera. Also, a flexible rubber boot is coupled to the microscope optics for shielding extraneous light from entering the camera. A vibration reducing apparatus is coupled to the microscope optics for preventing movement of the camera relative to the chip. The vibration reducing apparatus fits within the rubber boot and is a rigid, hollow cylinder having an adjustable length. The microscope optics view the chip through the cylinder. The cylinder is adjusted such that when the camera is lowered into position over the chip, the microscope optics are an appropriate distance from the chip, the cylinder presses against, and firmly contacts, the surface surrounding the chip, preventing movement of the camera relative to the chip, while the rubber boot resiliently conforms to the surface surrounding the chip. A illumination system selectively illuminates the chip with one of two illumination sources. A first illumination source is a fibre optic ring housed within the rubber boot. A second illumination source illuminates the integrated circuit through the microscope objective lens.

    Abstract translation: 一种便携式发射显微镜，用于在晶片分选器中包含芯片时分析集成电路芯片中的故障。 将显微镜的底座放置在晶片分选器的开口上。 平台装置附接到基座，用于将电荷耦合的装置照相机降低到晶片分选器的开口中。 包含显微镜光学元件的紧凑外壳与相机相连。 此外，柔性橡胶靴耦合到显微镜光学器件，用于屏蔽外来光线进入照相机。 减振装置耦合到显微镜光学器件，以防止照相机相对于芯片的移动。 减振装置装配在橡胶护罩内，并且是具有可调节长度的刚性中空圆筒。 显微镜光学通过圆柱体观察芯片。 调节圆柱体，使得当相机下降到芯片上方的位置时，显微镜光学元件距离芯片适当的距离，圆柱体挤压并牢固地接触芯片周围的表面，从而防止相机相对于 芯片，而橡胶靴弹性地符合芯片周围的表面。 照明系统用两个照明源中的一个选择性地照亮芯片。 第一照明源是容纳在橡胶靴内的光纤环。 第二个照明源通过显微镜物镜照亮集成电路。

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