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公开(公告)号:US07017514B1
公开(公告)日:2006-03-28
申请号:US10006100
申请日:2001-12-03
IPC分类号: C23C16/511 , C23F1/00 , H01L21/306
CPC分类号: C23C16/452 , C23C16/45565 , C23C16/511 , H01J37/32357 , H01J37/32633 , H01L21/31116
摘要: An apparatus for managing plasma in wafer processing operations is disclosed which includes a housing having an internal region defined by an inner wall. The housing has an input port for supplying a plasma into the housing at a first end and an output port at a second end. The apparatus includes a hollow tube contained in the internal region within the housing. The hollow tube is defined by a wall that extends between the first end and the second end and contains a plurality of orifices generating a plurality of fluid paths through the wall. A fluid input is included supplying fluid into the internal region of the housing. The supplied fluid is capable of passing through the plurality of orifices, and the plasma supplied through the input port is capable of being mixed within the hollow tube with the supplied fluid. The output port at the second end of the housing enables the mixed plasma and fluid supply to exit the housing.
摘要翻译: 公开了一种用于在晶片处理操作中管理等离子体的装置,其包括具有由内壁限定的内部区域的壳体。 壳体具有用于在第一端处将等离子体供应到壳体中的输入端口和在第二端处的输出端口。 该装置包括容纳在壳体内的内部区域中的中空管。 中空管由在第一端和第二端之间延伸的壁限定,并且包含多个孔,其产生穿过壁的多个流体路径。 流体输入包括将流体供应到壳体的内部区域。 所提供的流体能够通过多个孔,并且通过输入端口供应的等离子体能够与所提供的流体在中空管内混合。 壳体第二端的输出端口可使混合的等离子体和液体供应离开外壳。