Method And Apparatus For Monitoring Plasma Conditions In An Etching Plasma Processing Facility
    2.
    发明申请
    Method And Apparatus For Monitoring Plasma Conditions In An Etching Plasma Processing Facility 审中-公开
    用于在蚀刻等离子体处理设备中监测等离子体条件的方法和装置

    公开(公告)号:US20080134757A1

    公开(公告)日:2008-06-12

    申请号:US11908668

    申请日:2006-03-15

    IPC分类号: G01N25/36

    摘要: A gas sensor and method of gas sensing, e.g., of a type as useful with downstream sensor elements for determining the plasma conditions (e.g., plasma etching end point) in a semiconductor etching facility that utilizes halogen-containing plasma and/or oxygen-containing plasma. Such sensor elements are capable of exhibiting temperature change in the presence of energetic gas species, e.g., fluorine, chlorine, iodine, bromine, oxygen, and derivatives and radicals thereof that are generated by the plasma, and correspondingly generating an output signal indicative of such temperature change for determination of the plasma conditions in the etching plasma processing facility.

    摘要翻译: 一种气体传感器和气体传感方法,例如,对于使用含卤素等离子体和/或含氧的半导体蚀刻设备中用于确定等离子体条件(例如,等离子体蚀刻终点)的下游传感器元件有用的类型 等离子体。 这样的传感器元件能够在由等离子体产生的能量气体物质例如氟,氯,碘,溴,氧及其衍生物和自由基的存在下表现出温度变化,并且相应地产生指示其的输出信号 用于确定蚀刻等离子体处理设备中的等离子体条件的温度变化。