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公开(公告)号:US06406640B1
公开(公告)日:2002-06-18
申请号:US09546714
申请日:2000-04-10
Applicant: Chan-lon Yang , Usha Raghuram , Kimberley A. Kaufman , Daniel Arnzen , James Nulty
Inventor: Chan-lon Yang , Usha Raghuram , Kimberley A. Kaufman , Daniel Arnzen , James Nulty
IPC: H01L2100
CPC classification number: H01L21/31116
Abstract: The present invention relates to a method of plasma etching and a method of operating a plasma etching apparatus in which a concentration of oxygen at flash striking is greater than a concentration during etching.
Abstract translation: 本发明涉及一种等离子体蚀刻方法和操作等离子体蚀刻装置的方法,其中闪光时的氧浓度大于蚀刻期间的浓度。
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公开(公告)号:US6165375A
公开(公告)日:2000-12-26
申请号:US935705
申请日:1997-09-23
Applicant: Chan-lon Yang , Usha Raghuram , Kimberley A. Kaufman , Daniel Arnzen , James Nulty
Inventor: Chan-lon Yang , Usha Raghuram , Kimberley A. Kaufman , Daniel Arnzen , James Nulty
IPC: H01L21/311 , B44C1/22
CPC classification number: H01L21/31116
Abstract: The present invention relates to a method of plasma etching and a method of operating a plasma etching apparatus.
Abstract translation: 等离子体蚀刻方法技术领域本发明涉及等离子体蚀刻方法和等离子体蚀刻装置的操作方法。
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公开(公告)号:US06214743B1
公开(公告)日:2001-04-10
申请号:US09326432
申请日:1999-06-04
Applicant: Jianmin Oiao , James Nulty
Inventor: Jianmin Oiao , James Nulty
IPC: H01L2100
CPC classification number: H01L21/76897 , H01L21/0332 , H01L21/31144
Abstract: According to one embodiment (100), a method of forming contacts may include forming structures that include sidewalls (102). A first insulating layer can be deposited (104). A second insulating layer can then be deposited over the first insulating layer (106). The second insulating layer can be patterned to form a hard etch mask (108). Contact holes can be etched through the second insulating layer using the hard etch mask as a contact hole etch mask (110). A second insulating layer can have a dielectric constant that is low with respect to other hard etch mask materials, such as silicon nitride. A hard etch mask formed from a second insulating layer can result in contact holes having lower aspect ratios than conventional approaches.
Abstract translation: 根据一个实施例(100),形成触点的方法可以包括形成包括侧壁(102)的结构。 可以沉积第一绝缘层(104)。 然后可以在第一绝缘层(106)上沉积第二绝缘层。 第二绝缘层可以被图案化以形成硬蚀刻掩模(108)。 可以使用硬蚀刻掩模作为接触孔蚀刻掩模(110),通过第二绝缘层蚀刻接触孔。 第二绝缘层可以具有相对于其它硬蚀刻掩模材料(例如氮化硅)低的介电常数。 由第二绝缘层形成的硬蚀刻掩模可导致与常规方法相比具有较低纵横比的接触孔。
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公开(公告)号:US20080110019A1
公开(公告)日:2008-05-15
申请号:US12008483
申请日:2008-01-11
Applicant: James Nulty , James Hunter , Alexander Herrera
Inventor: James Nulty , James Hunter , Alexander Herrera
IPC: H01R9/00
CPC classification number: G01R1/07314 , G01R1/0735 , G01R1/07371 , Y10T29/4913 , Y10T29/49147 , Y10T29/49153 , Y10T29/49155
Abstract: In one embodiment, a probe card for testing dice on a wafer includes a substrate, a number of cantilevers formed on a surface thereof, and a number of probes extending from unsupported ends of the cantilevers. The unsupported ends of the cantilevers project over cavities on the surface of the substrate. The probes have tips to contact pads on the dice under test. The probe card may include a compressive layer above the surface of the substrate with a number of holes through which the probes extend.
Abstract translation: 在一个实施例中,用于在晶片上测试骰子的探针卡包括基底,在其表面上形成的多个悬臂以及从悬臂的未支撑的端部延伸的多个探针。 悬臂的未支撑的端部突出在基板表面上的空腔上。 探针具有接触被测试骰子上的垫的提示。 探针卡可以包括在衬底的表面上方的压缩层,其具有探针延伸穿过的多个孔。
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公开(公告)号:US20050212540A1
公开(公告)日:2005-09-29
申请号:US11084671
申请日:2005-03-18
Applicant: James Nulty , James Hunter , Alexander Herrera
Inventor: James Nulty , James Hunter , Alexander Herrera
CPC classification number: G01R1/07314 , G01R1/0735 , G01R1/07371 , Y10T29/4913 , Y10T29/49147 , Y10T29/49153 , Y10T29/49155
Abstract: In one embodiment, a probe card for testing dice on a wafer includes a substrate, a number of cantilevers formed on a surface thereof, and a number of probes extending from unsupported ends of the cantilevers. The unsupported ends of the cantilevers project over cavities on the surface of the substrate. The probes have tips to contact pads on the dice under test. The probe card may include a compressive layer above the surface of the substrate with a number of holes through which the probes extend.
Abstract translation: 在一个实施例中,用于在晶片上测试骰子的探针卡包括基底,在其表面上形成的多个悬臂以及从悬臂的未支撑的端部延伸的多个探针。 悬臂的未支撑的端部突出在基板表面上的空腔上。 探针具有接触被测试骰子上的垫的提示。 探针卡可以包括在衬底的表面上方的压缩层,其具有探针延伸穿过的多个孔。
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