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1.发明授权Coated, heat-sealable aromatic polyimide film having superior compressive strength 失效具有优异的抗压强度的涂覆的，可热封的芳族聚酰亚胺膜
公开(公告)号：US5260413A
公开(公告)日：1993-11-09
申请号：US848189
申请日：1992-03-12
CPC分类号： H01B3/306 , C08K3/22 , Y10T428/25 , Y10T428/256 , Y10T428/294 , Y10T428/31721
摘要： An aromatic polyimide film coated with a thermally stable, heat-sealable thermoplastic polyimide for use as a wire insulation for superconducting magnets is disclosed. The inclusion of inorganic particles in the film improves compressive strength of the coated polyimide film.
摘要翻译： 公开了一种涂覆有用于超导磁体的导线绝缘体的热稳定的可热封热塑性聚酰亚胺的芳族聚酰亚胺膜。 在膜中包含无机颗粒改善了涂覆的聚酰亚胺膜的抗压强度。
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2.发明申请MULTILAYER FILM FOR ELECTRONIC CIRCUITRY APPLICATIONS AND METHODS RELATING THERETO 审中-公开电子电路用多层薄膜及其相关方法公开(公告)号：US20130011645A1
公开(公告)日：2013-01-10
申请号：US13348180
申请日：2012-01-11
IPC分类号： B32B27/08
CPC分类号： B32B27/08 , B32B27/18 , B32B27/281 , B32B2250/24 , H01L23/552 , H01L23/564 , H01L2924/0002 , H05K3/281 , H05K2201/0154 , H05K2201/0209 , Y10T428/269 , H01L2924/00
摘要： The present disclosure relates to a multilayer film for electronic circuitry applications, having advantageous barrier properties against unwanted electron and electromagnetic wave interference, and also protection against dirt or other similar-type unwanted foreign matter interference. The multilayer films of the present disclosure have at least three layers. The first outer layer contains a base polymer, a carbon black filler or pigment and a dielectric filler. The core layer is a polymer with less than 5 weight percent filler. The second outer is similar to the first outer layer and contains a base polymer, a low conductivity carbon black filler or pigment and a dielectric filler. The two outer layers can be the same or different. Optionally, additional layers can also be used between the two outer layers.
摘要翻译： 本公开涉及一种用于电子电路应用的多层膜，其具有防止不需要的电子和电磁波干扰的有利的屏障特性，以及防止灰尘或其它类似类型的不需要的异物干扰。 本公开的多层膜具有至少三层。 第一外层包含基础聚合物，炭黑填料或颜料和介电填料。 芯层是具有小于5重量％填料的聚合物。 第二外层类似于第一外层，并且包含基础聚合物，低导电性炭黑填料或颜料和介电填料。 两个外层可以相同或不同。 任选地，也可以在两个外层之间使用附加层。
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3.发明申请MULTILAYER FILM FOR ELECTRONIC CIRCUITRY APPLICATIONS AND METHODS RELATING THERETO 审中-公开电子电路用多层薄膜及其相关方法公开(公告)号：US20110287243A1
公开(公告)日：2011-11-24
申请号：US13146481
申请日：2010-03-01
CPC分类号： H05K3/281 , B32B27/08 , B32B27/20 , B32B27/281 , B32B27/285 , B32B27/288 , B32B27/34 , B32B27/36 , B32B2250/24 , B32B2264/102 , B32B2264/104 , B32B2264/108 , B32B2307/20 , B32B2307/204 , B32B2307/206 , B32B2307/212 , B32B2307/3065 , B32B2307/50 , B32B2307/584 , B32B2457/08 , H05K1/0218 , H05K9/0088 , H05K2201/0209 , H05K2201/0323 , Y10T428/269
摘要： The present disclosure relates to a multilayer film for electronic circuitry applications, having advantageous barrier properties against unwanted electron and electromagnetic wave interference, and also protection against dirt or other similar-type unwanted foreign matter interference. The multilayer films of the present disclosure have at least three layers. The first outer layer contains a polyimide base polymer, a carbon black filler and a dielectric filler. The core layer is a polyimide with less than 5 weight percent filler. The second outer is similar to the first outer layer and contains a polyimide base polymer, a low conductivity carbon black filler and a dielectric filler. The two outer layers can be the same or different. Optionally, additional layers can also be used between the two outer layers.
摘要翻译： 本公开涉及一种用于电子电路应用的多层膜，其具有防止不需要的电子和电磁波干扰的有利的屏障特性，以及防止灰尘或其它类似类型的不需要的异物干扰。 本公开的多层膜具有至少三层。 第一外层包含聚酰亚胺基聚合物，炭黑填料和介电填料。 核心层是具有小于5重量％填料的聚酰亚胺。 第二外部与第一外层类似，并且包含聚酰亚胺基聚合物，低电导率炭黑填料和介电填料。 两个外层可以相同或不同。 任选地，也可以在两个外层之间使用附加层。
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4.发明授权Coated, heat-sealable aromatic polyimide film having superior compressive strength 失效具有高压压缩强度的热封可热封芳族聚酰亚胺薄膜
公开(公告)号：US5106667A
公开(公告)日：1992-04-21
申请号：US475044
申请日：1990-02-05
IPC分类号： B32B7/02 , B32B27/00 , B32B27/20 , B32B27/34 , C08K3/22 , C08K7/18 , C08L77/00 , C08L79/08 , H01B3/30 , H01B12/02
CPC分类号： H01B3/306 , C08K3/22 , Y10S505/704 , Y10T428/239 , Y10T428/25 , Y10T428/252 , Y10T428/256 , Y10T428/294 , Y10T428/31721
摘要： An aromatic polyimide film coated with a thermally stable, heat-sealable thermoplastic polyimide for use as a wire insulation for superconducting magnets is disclosed. The inclusion of inorganic particles in the film improves compressive strength of the coated polyimide film.
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