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    Methods for Attaching Structures Using Ultraviolet and Visible Light Curing Adhesive
    3.
    发明申请
    Methods for Attaching Structures Using Ultraviolet and Visible Light Curing Adhesive 有权
    使用紫外线和可见光固化粘合剂粘附结构的方法

    公开(公告)号：US20140036353A1

    公开(公告)日：2014-02-06

    申请号：US13567949

    申请日：2012-08-06

    申请人： James R. Krogdahl

    发明人： James R. Krogdahl

    IPC分类号： B32B3/06 ,  B29C71/04 ,  B29C45/16

    CPC分类号： B29C65/1406 ,  B29C45/0001 ,  B29C45/1657 ,  B29C65/1409 ,  B29C65/1435 ,  B29C65/1441 ,  B29C65/149 ,  B29C65/1496 ,  B29C65/4845 ,  B29C66/1122 ,  B29C66/472 ,  B29C66/474 ,  B29C66/73361 ,  B29C2045/1664 ,  B29K2995/0025 ,  B29K2995/0027 ,  B29L2031/764 ,  Y10T428/24008

    摘要： An electronic device may be provided with electronic device structures such as housing structures and structures associated with electrical components. The electronic device structures may be attached to each other using ultraviolet and visible light curable adhesive. A layer of adhesive may be interposed between electronic device structures. A light source may generate ultraviolet light. The structures may include an ultraviolet-light-transparent structure through which the ultraviolet light passes to illuminate and cure the adhesive. The ultraviolet-light-transparent structure may form one of multiple shots of injection molded plastic in a device structure, may be formed using a plastic that is opaque at visible wavelengths, or may have a coating such as a metal coating to help reflect ultraviolet radiation onto the adhesive. Perforations in the coating may be used to pass ultraviolet radiation to the adhesive.

    摘要翻译： 电子设备可以设置有电子设备结构，例如与电气部件相关联的壳体结构和结构。 电子器件结构可以使用紫外线和可见光固化粘合剂彼此附接。 可以在电子器件结构之间插入一层粘合剂。 光源可产生紫外光。 该结构可以包括紫外光透射结构，紫外线通过该结构照射和固化粘合剂。 紫外光透明结构可以在器件结构中形成注射成型塑料的多次射击之一，可以使用在可见波长不透明的塑料形成，或者可以具有诸如金属涂层的涂层以帮助反射紫外线辐射 粘在胶上。 涂层中的穿孔可以用于将紫外线辐射传递到粘合剂。

    Methods of joining device structures with adhesive
    4.
    发明授权
    Methods of joining device structures with adhesive 有权
    用粘合剂连接器件结构的方法

    公开(公告)号：US09266310B2

    公开(公告)日：2016-02-23

    申请号：US13329010

    申请日：2011-12-16

    申请人： James R. Krogdahl ,  James M. Cuseo

    发明人： James R. Krogdahl ,  James M. Cuseo

    IPC分类号： B29C65/00 ,  B32B17/10 ,  B32B37/00 ,  B32B38/00 ,  B31B1/60 ,  B32B37/12

    CPC分类号： B32B37/003 ,  B32B37/1284 ,  B32B2305/34 ,  B32B2457/00 ,  Y10T156/1002

    摘要： Structures such as layers of material associated with an electronic device may be assembled using adhesive. The adhesive may be dispensed onto the surface of an electronic device layer in liquid form. The liquid adhesive material may be a liquid pressure sensitive adhesive precursor material. Patterned structures such as touch sensor electrodes, black ink masking layers, and other structures may be formed on the electronic device layer. The use of liquid adhesive material may help the adhesive material flow over the edges of the patterned structures without forming bubbles or voids. Following application of the liquid pressure sensitive adhesive precursor material, the liquid pressure sensitive adhesive precursor material may be cured to form a solid layer of pressure sensitive adhesive. The layer of material on which the solid layer of pressure sensitive adhesive has been formed may then be vacuum laminated to an additional electronic device layer.

    摘要翻译： 可以使用粘合剂来组装诸如与电子设备相关联的材料层的结构。 粘合剂可以以液体形式分配到电子器件层的表面上。 液体粘合剂材料可以是液体压敏粘合剂前体材料。 可以在电子器件层上形成诸如触摸传感器电极，黑色墨水掩蔽层和其它结构的图案化结构。 使用液体粘合剂材料可以帮助粘合剂材料在图案化结构的边缘上流动，而不会形成气泡或空隙。 在施加液体压敏粘合剂前体材料之后，液体压敏粘合剂前体材料可以固化以形成压敏粘合剂的固体层。 已经形成了压敏粘合剂的固体层的材料层然后可以被真空层压到另外的电子器件层。

    Methods of Joining Device Structures with Adhesive
    6.
    发明申请
    Methods of Joining Device Structures with Adhesive 有权
    用粘合剂连接装置结构的方法

    公开(公告)号：US20130153128A1

    公开(公告)日：2013-06-20

    申请号：US13329010

    申请日：2011-12-16

    申请人： James R. Krogdahl ,  James M. Cuseo

    发明人： James R. Krogdahl ,  James M. Cuseo

    IPC分类号： B32B37/26 ,  B32B37/10 ,  B32B38/14 ,  B32B38/04 ,  B32B38/08

    CPC分类号： B32B37/003 ,  B32B37/1284 ,  B32B2305/34 ,  B32B2457/00 ,  Y10T156/1002

    摘要： Structures such as layers of material associated with an electronic device may be assembled using adhesive. The adhesive may be dispensed onto the surface of an electronic device layer in liquid form. The liquid adhesive material may be a liquid pressure sensitive adhesive precursor material. Patterned structures such as touch sensor electrodes, black ink masking layers, and other structures may be formed on the electronic device layer. The use of liquid adhesive material may help the adhesive material flow over the edges of the patterned structures without forming bubbles or voids. Following application of the liquid pressure sensitive adhesive precursor material, the liquid pressure sensitive adhesive precursor material may be cured to form a solid layer of pressure sensitive adhesive. The layer of material on which the solid layer of pressure sensitive adhesive has been formed may then be vacuum laminated to an additional electronic device layer.

    摘要翻译： 可以使用粘合剂来组装诸如与电子设备相关联的材料层的结构。 粘合剂可以以液体形式分配到电子器件层的表面上。 液体粘合剂材料可以是液体压敏粘合剂前体材料。 可以在电子器件层上形成诸如触摸传感器电极，黑色墨水掩蔽层和其它结构的图案化结构。 使用液体粘合剂材料可以帮助粘合剂材料在图案化结构的边缘上流动，而不会形成气泡或空隙。 在施加液体压敏粘合剂前体材料之后，液体压敏粘合剂前体材料可以固化以形成压敏粘合剂的固体层。 已经形成了压敏粘合剂的固体层的材料层然后可以被真空层压到另外的电子器件层。

    Methods for attaching structures using ultraviolet and visible light curing adhesive
    8.
    发明授权
    Methods for attaching structures using ultraviolet and visible light curing adhesive 有权
    使用紫外线和可见光固化粘合剂连接结构的方法

    公开(公告)号：US09144938B2

    公开(公告)日：2015-09-29

    申请号：US13567949

    申请日：2012-08-06

    申请人： James R. Krogdahl

    发明人： James R. Krogdahl

    IPC分类号： G06K7/10 ,  B29C65/14 ,  B29C65/48 ,  B29C65/00 ,  B29C45/16 ,  B29L31/00 ,  B29C45/00

    CPC分类号： B29C65/1406 ,  B29C45/0001 ,  B29C45/1657 ,  B29C65/1409 ,  B29C65/1435 ,  B29C65/1441 ,  B29C65/149 ,  B29C65/1496 ,  B29C65/4845 ,  B29C66/1122 ,  B29C66/472 ,  B29C66/474 ,  B29C66/73361 ,  B29C2045/1664 ,  B29K2995/0025 ,  B29K2995/0027 ,  B29L2031/764 ,  Y10T428/24008

    摘要： An electronic device may be provided with electronic device structures such as housing structures and structures associated with electrical components. The electronic device structures may be attached to each other using ultraviolet and visible light curable adhesive. A layer of adhesive may be interposed between electronic device structures. A light source may generate ultraviolet light. The structures may include an ultraviolet-light-transparent structure through which the ultraviolet light passes to illuminate and cure the adhesive. The ultraviolet-light-transparent structure may form one of multiple shots of injection molded plastic in a device structure, may be formed using a plastic that is opaque at visible wavelengths, or may have a coating such as a metal coating to help reflect ultraviolet radiation onto the adhesive. Perforations in the coating may be used to pass ultraviolet radiation to the adhesive.

    摘要翻译： 电子设备可以设置有电子设备结构，例如与电气部件相关联的壳体结构和结构。 电子器件结构可以使用紫外线和可见光固化粘合剂彼此附接。 可以在电子器件结构之间插入一层粘合剂。 光源可产生紫外光。 该结构可以包括紫外光透射结构，紫外线通过该结构照射和固化粘合剂。 紫外光透明结构可以在器件结构中形成注射成型塑料的多次射击之一，可以使用在可见波长不透明的塑料形成，或者可以具有诸如金属涂层的涂层以帮助反射紫外线辐射 粘在胶上。 涂层中的穿孔可以用于将紫外线辐射传递到粘合剂。