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    Methods for attaching structures using ultraviolet and visible light curing adhesive
    2.
    发明授权
    Methods for attaching structures using ultraviolet and visible light curing adhesive 有权
    使用紫外线和可见光固化粘合剂连接结构的方法

    公开(公告)号：US09144938B2

    公开(公告)日：2015-09-29

    申请号：US13567949

    申请日：2012-08-06

    申请人： James R. Krogdahl

    发明人： James R. Krogdahl

    IPC分类号： G06K7/10 ,  B29C65/14 ,  B29C65/48 ,  B29C65/00 ,  B29C45/16 ,  B29L31/00 ,  B29C45/00

    CPC分类号： B29C65/1406 ,  B29C45/0001 ,  B29C45/1657 ,  B29C65/1409 ,  B29C65/1435 ,  B29C65/1441 ,  B29C65/149 ,  B29C65/1496 ,  B29C65/4845 ,  B29C66/1122 ,  B29C66/472 ,  B29C66/474 ,  B29C66/73361 ,  B29C2045/1664 ,  B29K2995/0025 ,  B29K2995/0027 ,  B29L2031/764 ,  Y10T428/24008

    摘要： An electronic device may be provided with electronic device structures such as housing structures and structures associated with electrical components. The electronic device structures may be attached to each other using ultraviolet and visible light curable adhesive. A layer of adhesive may be interposed between electronic device structures. A light source may generate ultraviolet light. The structures may include an ultraviolet-light-transparent structure through which the ultraviolet light passes to illuminate and cure the adhesive. The ultraviolet-light-transparent structure may form one of multiple shots of injection molded plastic in a device structure, may be formed using a plastic that is opaque at visible wavelengths, or may have a coating such as a metal coating to help reflect ultraviolet radiation onto the adhesive. Perforations in the coating may be used to pass ultraviolet radiation to the adhesive.

    摘要翻译： 电子设备可以设置有电子设备结构，例如与电气部件相关联的壳体结构和结构。 电子器件结构可以使用紫外线和可见光固化粘合剂彼此附接。 可以在电子器件结构之间插入一层粘合剂。 光源可产生紫外光。 该结构可以包括紫外光透射结构，紫外线通过该结构照射和固化粘合剂。 紫外光透明结构可以在器件结构中形成注射成型塑料的多次射击之一，可以使用在可见波长不透明的塑料形成，或者可以具有诸如金属涂层的涂层以帮助反射紫外线辐射 粘在胶上。 涂层中的穿孔可以用于将紫外线辐射传递到粘合剂。

    Methods for Attaching Structures Using Ultraviolet and Visible Light Curing Adhesive
    6.
    发明申请
    Methods for Attaching Structures Using Ultraviolet and Visible Light Curing Adhesive 有权
    使用紫外线和可见光固化粘合剂粘附结构的方法

    公开(公告)号：US20140036353A1

    公开(公告)日：2014-02-06

    申请号：US13567949

    申请日：2012-08-06

    申请人： James R. Krogdahl

    发明人： James R. Krogdahl

    IPC分类号： B32B3/06 ,  B29C71/04 ,  B29C45/16

    CPC分类号： B29C65/1406 ,  B29C45/0001 ,  B29C45/1657 ,  B29C65/1409 ,  B29C65/1435 ,  B29C65/1441 ,  B29C65/149 ,  B29C65/1496 ,  B29C65/4845 ,  B29C66/1122 ,  B29C66/472 ,  B29C66/474 ,  B29C66/73361 ,  B29C2045/1664 ,  B29K2995/0025 ,  B29K2995/0027 ,  B29L2031/764 ,  Y10T428/24008

    摘要： An electronic device may be provided with electronic device structures such as housing structures and structures associated with electrical components. The electronic device structures may be attached to each other using ultraviolet and visible light curable adhesive. A layer of adhesive may be interposed between electronic device structures. A light source may generate ultraviolet light. The structures may include an ultraviolet-light-transparent structure through which the ultraviolet light passes to illuminate and cure the adhesive. The ultraviolet-light-transparent structure may form one of multiple shots of injection molded plastic in a device structure, may be formed using a plastic that is opaque at visible wavelengths, or may have a coating such as a metal coating to help reflect ultraviolet radiation onto the adhesive. Perforations in the coating may be used to pass ultraviolet radiation to the adhesive.

    摘要翻译： 电子设备可以设置有电子设备结构，例如与电气部件相关联的壳体结构和结构。 电子器件结构可以使用紫外线和可见光固化粘合剂彼此附接。 可以在电子器件结构之间插入一层粘合剂。 光源可产生紫外光。 该结构可以包括紫外光透射结构，紫外线通过该结构照射和固化粘合剂。 紫外光透明结构可以在器件结构中形成注射成型塑料的多次射击之一，可以使用在可见波长不透明的塑料形成，或者可以具有诸如金属涂层的涂层以帮助反射紫外线辐射 粘在胶上。 涂层中的穿孔可以用于将紫外线辐射传递到粘合剂。

    Method of curing using an electroluminescent light
    8.
    发明授权
    Method of curing using an electroluminescent light 失效
    使用电致发光的固化方法

    公开(公告)号：US07166008B2

    公开(公告)日：2007-01-23

    申请号：US10744260

    申请日：2003-12-22

    申请人： Robert J. Boettcher

    发明人： Robert J. Boettcher

    IPC分类号： H01J9/00

    CPC分类号： B29C65/3436 ,  B29C65/1403 ,  B29C65/1406 ,  B29C65/1409 ,  B29C65/1412 ,  B29C65/1416 ,  B29C65/1425 ,  B29C65/1483 ,  B29C65/149 ,  B29C65/4845 ,  B29C65/4865 ,  B29C66/1122 ,  B29C66/43 ,  B29C2035/0827 ,  B29C2035/0833 ,  B29K2995/0025 ,  Y10S428/917 ,  Y10T428/239

    摘要： Method of curing polymeric compositions using light from an electroluminescent light source. An electroluminescent wire light can be embedded into a curable polymer or adhesive composition and used for curing in circumstances in which UV or visible light from conventional lamps cannot reach the polymer or adhesive to be cured. It may also be used to cure polymer or adhesive coatings of unusual or irregular shapes. An electroluminescent wire light can be embedded in a curable adhesive or polymer compound around an irregular shape of boat hull components, and the emitted light used to cure the adhesive or polymer compound to bond the boat hull components.

    摘要翻译： 使用来自电致发光光源的光固化聚合物组合物的方法。 电致发光线灯可以嵌入可固化聚合物或粘合剂组合物中，并且用于在常规灯的UV或可见光不能到达要固化的聚合物或粘合剂的情况下固化。 它也可用于固化异常或不规则形状的聚合物或粘合剂涂层。 电致发光线灯可以嵌入围绕船体部件的不规则形状的可固化粘合剂或聚合物化合物中，并且所发射的光用于固化粘合剂或聚合物化合物以结合船体部件。

    Methods for assembling electronic devices by internally curing light-sensitive adhesive
    9.
    发明授权
    Methods for assembling electronic devices by internally curing light-sensitive adhesive 有权
    通过内部固化光敏胶来组装电子设备的方法

    公开(公告)号：US09456508B2

    公开(公告)日：2016-09-27

    申请号：US12790732

    申请日：2010-05-28

    申请人： Craig Matthew Stanley

    发明人： Craig Matthew Stanley

    IPC分类号： H05K7/00 ,  H05K5/00 ,  B29C45/16 ,  B29C65/48 ,  H05K3/32 ,  B29C65/00 ,  F16B11/00 ,  B29C65/14

    CPC分类号： H05K5/0004 ,  B29C45/16 ,  B29C65/1406 ,  B29C65/1435 ,  B29C65/149 ,  B29C65/4825 ,  B29C65/4845 ,  B29C66/1122 ,  B29C66/5326 ,  B29C66/542 ,  B29C66/61 ,  F16B11/006 ,  H05K3/321 ,  H05K2201/10106

    摘要： Assemblies of structures such as electronic device assemblies may be connected using light-cured liquid adhesive such as ultraviolet-light-cured adhesive. Light sources such as ultraviolet-light light-emitting diodes may be mounted to a substrate such as a printed circuit board substrate. The substrate may be mounted to an assembly formed from a plurality of structures. The structures may be connected to each other to form an interior cavity within which the substrate and light-emitting diodes are contained. A connector may be included in the assembly. The connector may have input-output pins. Conductive paths may couple the input-output pins to the light-emitting diodes in the cavity. A tool may be used to apply signals to the light-emitting diodes to activate the light-emitting diodes. The light-emitting diodes produce light that cures the adhesive. The light-emitting diodes may be disabled by blowing a fuse after the adhesive has been cured.

    摘要翻译： 诸如电子器件组件的结构的组件可以使用诸如紫外光固化的粘合剂之类的光固化液体粘合剂来连接。 诸如紫外光发光二极管的光源可以安装到诸如印刷电路板基板的基板上。 衬底可以安装到由多个结构形成的组件上。 这些结构可以彼此连接以形成内部空腔，其中包含基板和发光二极管。 连接器可以包括在组件中。 连接器可能具有输入输出引脚。 导电路径可以将输入输出引脚耦合到空腔中的发光二极管。 可以使用工具将信号施加到发光二极管以激活发光二极管。 发光二极管产生固化粘合剂的光。 在粘合剂固化之后，可以通过吹入熔丝来禁止发光二极管。

    STRUCTURE INCLUDING A LIGHT-CURABLE ADHESIVE AND ASSOCIATED METHOD FOR ASSEMBLING AND CURING SAME
    10.
    发明申请
    STRUCTURE INCLUDING A LIGHT-CURABLE ADHESIVE AND ASSOCIATED METHOD FOR ASSEMBLING AND CURING SAME 审中-公开
    包含可固化粘合剂的结构及其组装和固化的相关方法

    公开(公告)号：US20160096353A1

    公开(公告)日：2016-04-07

    申请号：US14508551

    申请日：2014-10-07

    申请人： The Boeing Company

    发明人： Kathy L. Ferguson ,  Terry R. Walker

    IPC分类号： B32B37/18 ,  B32B38/00 ,  B32B37/12

    CPC分类号： B32B37/18 ,  B29C35/0272 ,  B29C65/1406 ,  B29C65/1467 ,  B29C65/149 ,  B29C65/4845 ,  B29C66/1122 ,  B29C66/5326 ,  B29C66/721 ,  B29C73/10 ,  B29C2035/0827 ,  B29L2031/30 ,  B29L2031/3076 ,  B32B37/1284 ,  B32B38/0008 ,  B32B2037/1253

    摘要： A structure is provided that is at least partially adhered by a light-curable adhesive. The structure includes first and second structural components disposed in a facing relationship. The structure also includes a light-curable adhesive impregnated within at least one of the first and second structural components or disposed between the first and second structural components. The structure of this example embodiment further includes one or more side-emitting light guiding members, such as side-emitting optical fibers, positioned between the first and second structural components and in communication with the light-curable adhesive. The one or more side-emitting light guiding members are configured to emit light along a length of the one or more side-emitting light guiding members. Corresponding methods to assemble the structure and to cure the light-curable adhesive within the structure are also provided.

    摘要翻译： 提供至少部分地被光可固化粘合剂粘附的结构。 该结构包括以面对关系设置的第一和第二结构部件。 该结构还包括浸渍在第一和第二结构部件中的至少一个中的光可固化粘合剂，或者设置在第一和第二结构部件之间。 该示例性实施例的结构还包括位于第一和第二结构部件之间并与光可固化粘合剂连通的一个或多个侧发光导光部件，例如侧发射光纤。 一个或多个侧面发射导光构件被配置为沿着一个或多个侧面发射导光构件的长度发光。 还提供了组合结构并固化结构内光固化粘合剂的相应方法。