公开(公告)号：US06913796B2

公开(公告)日：2005-07-05

申请号：US09952649

申请日：2001-09-14

申请人： Ralph Albano ,  Cory Bargeron ,  Ivan L. Berry, III ,  Jeff Bremmer ,  Phil Dembowski ,  Orlando Escorcia ,  Qingyuan Han ,  Nick Sbrockey ,  Carlo Waldfried

发明人： Ralph Albano ,  Cory Bargeron ,  Ivan L. Berry, III ,  Jeff Bremmer ,  Phil Dembowski ,  Orlando Escorcia ,  Qingyuan Han ,  Nick Sbrockey ,  Carlo Waldfried

IPC分类号： C08J9/36 ,  C01B33/12 ,  C23C16/56 ,  H01L21/312 ,  H01L21/314 ,  H01L21/316 ,  H05H1/24 ,  B05D3/06 ,  C08F2/52 ,  C08J7/18

CPC分类号： C01B33/126 ,  C23C16/56 ,  H01L21/02118 ,  H01L21/02126 ,  H01L21/02203 ,  H01L21/02216 ,  H01L21/02282 ,  H01L21/0234 ,  H01L21/3122 ,  H01L21/31695 ,  Y10T428/249953 ,  Y10T428/31663

摘要： Low dielectric constant porous materials with improved elastic modulus and hardness. The process of making such porous materials involves providing a porous dielectric material and plasma curing the porous dielectric material to produce a plasma cured porous dielectric material. Plasma curing of the porous dielectric material yields a material with improved modulus and hardness. The improvement in elastic modulus is typically greater than or about 50%, more typically greater than or about 100%, and more typically greater than or about 200%. The improvement in hardness is typically greater than or about 50%. The plasma cured porous dielectric material can optionally be post-plasma treated. The post-plasma treatment of the plasma cured porous dielectric material reduces the dielectric constant of the material while maintaining an improved elastic modulus and hardness as compared to the plasma cured porous dielectric material. The post-plasma treated, plasma cured porous dielectric material has a dielectric constant between about 1.1 and about 3.5 and an improved elastic modulus and hardness.

摘要翻译： 低介电常数多孔材料具有改善的弹性模量和硬度。 制造这种多孔材料的过程涉及提供多孔介电材料和等离子体固化多孔介电材料以产生等离子体固化的多孔电介质材料。 多孔介电材料的等离子体固化产生具有改善的模量和硬度的材料。 弹性模量的改善通常大于或约50％，更典型地大于或约100％，更典型地大于或约200％。 硬度的改善通常大于或约50％。 等离子体固化的多孔电介质材料可以任选地进行后等离子体处理。 与等离子体固化的多孔介电材料相比，等离子体固化的多孔介电材料的后等离子体处理降低了材料的介电常数，同时保持了改进的弹性模量和硬度。 后等离子体处理的等离子体固化的多孔介电材料的介电常数在约1.1和约3.5之间，并且具有改善的弹性模量和硬度。