Method for manufacturing p-type GaN based thin film using nitridation
    1.
    发明授权
    Method for manufacturing p-type GaN based thin film using nitridation 有权
    使用氮化制造p型GaN基薄膜的方法

    公开(公告)号:US06294016B1

    公开(公告)日:2001-09-25

    申请号:US09421028

    申请日:1999-10-20

    Abstract: Disclosed is a method for manufacturing a high conductivity p-type GaN-based thin film superior in electrical and optical properties by use of nitridation and RTA (rapid thermal annealing) in combination. A GaN-based epitaxial layer is grown to a desired thickness while being doped with Mg dopant with a carrier gas of hydrogen by use of a MOCVD process. The film thus obtained is subjected to nitridation using nitrogen plasma and RTA in combination. The p-type GaN-based thin film exhibits high hole concentration as well as low resistivity, so that it can be used where high electrical, optical, thermal and structural properties are needed. The method finds application in the fabrication of blue/white LEDs, laser diodes and other electronic devices.

    Abstract translation: 公开了通过组合使用氮化和RTA(快速热退火)制造电性和光学性能优异的高导电性p型GaN基薄膜的方法。 通过使用MOCVD法,将GaN基外延层生长至期望的厚度,同时用氢气载体用Mg掺杂剂掺杂。 将这样得到的膜用氮等离子体和RTA组合进行氮化。 p型GaN基薄膜具有高的空穴浓度以及低电阻率,因此可以在需要高电,光,热和结构性能的情况下使用。 该方法可用于制造蓝/白LED,激光二极管和其他电子设备。

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