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    Dynamic searching method and dynamic searching device of storage medium
    3.
    发明授权
    Dynamic searching method and dynamic searching device of storage medium 有权
    存储介质的动态搜索方法和动态搜索装置

    公开(公告)号：US07505672B2

    公开(公告)日：2009-03-17

    申请号：US10746009

    申请日：2003-12-26

    Applicant: Ji Na Lee

    Inventor： Ji Na Lee

    IPC: H04N5/91

    CPC classification number: G06F17/30852 ,  G11B27/105 ,  G11B27/107 ,  G11B27/28 ,  G11B2220/20 ,  G11B2220/90 ,  H04N5/783 ,  Y10S707/99933

    Abstract: Disclosed is a dynamic searching method including the steps of: extracting and storing index information of a stream receiving and storing an image source therein; extracting a shot change point from the index information; and performing a reproduction while varying a speed depending on a generation frequency of the shot change point.

    Abstract translation: 公开了一种动态搜索方法，包括以下步骤：提取和存储其中接收和存储图像源的流的索引信息; 从索引信息中提取镜头变化点; 并且根据拍摄改变点的生成频率改变速度进行再现。

    Side view light emitting diode package
    5.
    发明授权
    Side view light emitting diode package 有权
    侧视发光二极管封装

    公开(公告)号：US08013357B2

    公开(公告)日：2011-09-06

    申请号：US12495854

    申请日：2009-07-01

    Applicant: Kyoung-Il Park ,  Jin-Won Lee ,  Sun-Hong Kim ,  Min-Sik Kim ,  Ji-Na Lee

    Inventor： Kyoung-Il Park ,  Jin-Won Lee ,  Sun-Hong Kim ,  Min-Sik Kim ,  Ji-Na Lee

    IPC: H01L33/62 ,  H01L33/64

    CPC classification number: H01L33/62 ,  H01L33/486 ,  H01L33/642 ,  H01L33/647 ,  H01L2924/0002 ,  H01L2924/00

    Abstract: Provided is a side view light emitting diode package including a housing that includes a front side part and a rear side part integrally formed with the front side part, the front side part having a light emission part; and a lead frame that is located between the front side part and the rear side part, wherein the lead frame includes a first lead connected to a first electrode of a Light Emitting Diode (LED) chip and a second lead connected to a second electrode of the LED chip, wherein the front side part includes a first groove, a second groove, and a third groove, wherein the first lead and the second lead are extended through the first groove and the second groove, respectively, and a heat dissipation part is extended from the first lead through the third groove to an outside of the LED package.

    Abstract translation: 提供一种侧视发光二极管封装，其包括壳体，该壳体包括前侧部分和与前侧部分一体形成的后侧部分，前侧部分具有发光部分; 以及位于前侧部分和后侧部分之间的引线框架，其中引线框架包括连接到发光二极管（LED）芯片的第一电极的第一引线和连接到第二电极的第二引线 所述LED芯片，其中所述前侧部分包括第一凹槽，第二凹槽和第三凹槽，其中所述第一引线和所述第二引线分别延伸穿过所述第一凹槽和所述第二凹槽，并且散热部分 从第一引线延伸通过第三凹槽延伸到LED封装的外部。

    SIDE VIEW LIGHT EMITTING DIODE PACKAGE
    8.
    发明申请
    SIDE VIEW LIGHT EMITTING DIODE PACKAGE 有权
    侧视图发光二极管封装

    公开(公告)号：US20100001308A1

    公开(公告)日：2010-01-07

    申请号：US12495854

    申请日：2009-07-01

    Applicant: Kyoung-Il PARK ,  Jin-Won LEE ,  Sun-Hong KIM ,  Min-Sik KIM ,  Ji-Na LEE

    Inventor： Kyoung-Il PARK ,  Jin-Won LEE ,  Sun-Hong KIM ,  Min-Sik KIM ,  Ji-Na LEE

    IPC: H01L33/00

    CPC classification number: H01L33/62 ,  H01L33/486 ,  H01L33/642 ,  H01L33/647 ,  H01L2924/0002 ,  H01L2924/00

    Abstract: Provided is a side view light emitting diode package including a housing that includes a front side part and a rear side part integrally formed with the front side part, the front side part having a light emission part; and a lead frame that is located between the front side part and the rear side part, wherein the lead frame includes a first lead connected to a first electrode of a Light Emitting Diode (LED) chip and a second lead connected to a second electrode of the LED chip, wherein the front side part includes a first groove, a second groove, and a third groove, wherein the first lead and the second lead are extended through the first groove and the second groove, respectively, and a heat dissipation part is extended from the first lead through the third groove to an outside of the LED package.

    Abstract translation: 提供一种侧视发光二极管封装，其包括壳体，该壳体包括前侧部分和与前侧部分一体形成的后侧部分，前侧部分具有发光部分; 以及位于前侧部分和后侧部分之间的引线框架，其中引线框架包括连接到发光二极管（LED）芯片的第一电极的第一引线和连接到第二电极的第二引线 所述LED芯片，其中所述前侧部分包括第一凹槽，第二凹槽和第三凹槽，其中所述第一引线和所述第二引线分别延伸穿过所述第一凹槽和所述第二凹槽，并且散热部分 从第一引线延伸通过第三凹槽延伸到LED封装的外部。

    Light-emitting diode package
    9.
    发明申请
    Light-emitting diode package 有权
    发光二极管封装

    公开(公告)号：US20090189176A1

    公开(公告)日：2009-07-30

    申请号：US12078250

    申请日：2008-03-28

    Applicant: Sun-Hong KIM ,  Min-Sik KIM ,  Ji-Na LEE

    Inventor： Sun-Hong KIM ,  Min-Sik KIM ,  Ji-Na LEE

    IPC: H01L33/00

    CPC classification number: H01L33/60 ,  H01L33/486 ,  H01L2924/0002 ,  H01L2924/00

    Abstract: Disclosed is a light-emitting diode package. The light-emitting diode package includes an electrode pad on which a chip is placed; a housing having a window through which the chip is exposed; a housing wall defining the window; and an electrode lead extended from the electrode pad in a direction of the housing to be exposed outside a surface of the housing, wherein the housing wall formed in the direction comprises a first portion and a second portion thicker than the first portion to cover the electrode lead.

    Abstract translation: 公开了一种发光二极管封装。 发光二极管封装包括放置芯片的电极焊盘; 具有窗口的壳体，芯片暴露在该窗口中; 限定窗户的外壳壁; 以及从所述电极焊盘沿着所述壳体的方向延伸露出在所述壳体的表面外的电极引线，其中，沿所述方向形成的所述壳体壁包括比所述第一部分更厚以覆盖所述电极的第一部分和第二部分 铅。

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