公开(公告)号：US08309968B2

公开(公告)日：2012-11-13

申请号：US12847078

申请日：2010-07-30

Applicant: Jenn-Chang Hwang ,  Chwung-Shan Kou ,  Jian-You Lin

Inventor： Jenn-Chang Hwang ,  Chwung-Shan Kou ,  Jian-You Lin

IPC: H01L31/0312 ,  H01L29/47 ,  H01L21/28

CPC classification number: H01L29/872 ,  H01L29/1602 ,  H01L29/66143

Abstract: The present invention relates to a Schottky diode with a diamond rod, which comprises: a substrate with a gate layer formed thereon; a patterned insulating layer disposed on the gate layer, wherein the patterned insulating layer comprises a first contact region and a second contact region; a diamond rod disposed on the patterned insulating layer, wherein a first end of the diamond rod connects to the first contact region, and a second end of the diamond rod connects to the second contact region; a first electrode corresponding to the first contact region of the patterned insulating layer, and covering the first end of the diamond rod; and a second electrode corresponding to the second contact region of the patterned insulating layer, and covering the second end of the diamond rod, and a method for manufacturing the same.

Abstract translation: 本发明涉及具有金刚石棒的肖特基二极管，其包括：在其上形成栅极层的衬底; 设置在所述栅极层上的图案化绝缘层，其中所述图案化绝缘层包括第一接触区域和第二接触区域; 设置在所述图案化绝缘层上的金刚石棒，其中所述金刚石棒的第一端连接到所述第一接触区域，所述金刚石棒的第二端连接到所述第二接触区域; 第一电极对应于图案化绝缘层的第一接触区域，并覆盖金刚石棒的第一端; 以及对应于图案化绝缘层的第二接触区域并覆盖金刚石棒的第二端的第二电极及其制造方法。

公开(公告)号：US20110297962A1

公开(公告)日：2011-12-08

申请号：US12847078

申请日：2010-07-30

Applicant: Jenn-Chang HWANG ,  Chwung-Shan KOU ,  Jian-You LIN

Inventor： Jenn-Chang HWANG ,  Chwung-Shan KOU ,  Jian-You LIN

IPC: H01L29/872 ,  H01L21/04

CPC classification number: H01L29/872 ,  H01L29/1602 ,  H01L29/66143

Abstract: The present invention relates to a Schottky diode with a diamond rod, which comprises: a substrate with a gate layer formed thereon; a patterned insulating layer disposed on the gate layer, wherein the patterned insulating layer comprises a first contact region and a second contact region; a diamond rod disposed on the patterned insulating layer, wherein a first end of the diamond rod connects to the first contact region, and a second end of the diamond rod connects to the second contact region; a first electrode corresponding to the first contact region of the patterned insulating layer, and covering the first end of the diamond rod; and a second electrode corresponding to the second contact region of the patterned insulating layer, and covering the second end of the diamond rod, and a method for manufacturing the same.

Abstract translation: 本发明涉及具有金刚石棒的肖特基二极管，其包括：在其上形成栅极层的衬底; 设置在所述栅极层上的图案化绝缘层，其中所述图案化绝缘层包括第一接触区域和第二接触区域; 设置在所述图案化绝缘层上的金刚石棒，其中所述金刚石棒的第一端连接到所述第一接触区域，所述金刚石棒的第二端连接到所述第二接触区域; 第一电极对应于图案化绝缘层的第一接触区域，并覆盖金刚石棒的第一端; 以及对应于图案化绝缘层的第二接触区域并覆盖金刚石棒的第二端的第二电极及其制造方法。

公开(公告)号：US20130105204A1

公开(公告)日：2013-05-02

申请号：US13417869

申请日：2012-03-12

Applicant: Jenn-Chang HWANG ,  Chao-Ying HSIEH ,  Chwung-Shan KOU ,  Chung-Hwa WANG ,  Li-Shiuan TSAI ,  Lung-Kai MAO ,  Shih-Jie JIAN ,  Jian-You LIN ,  Chun-Yi LEE

Inventor： Jenn-Chang HWANG ,  Chao-Ying HSIEH ,  Chwung-Shan KOU ,  Chung-Hwa WANG ,  Li-Shiuan TSAI ,  Lung-Kai MAO ,  Shih-Jie JIAN ,  Jian-You LIN ,  Chun-Yi LEE

IPC: H05K1/03 ,  H05K1/02 ,  H05K1/09 ,  H05K3/00

CPC classification number: H05K1/0346 ,  H05K1/0393 ,  H05K3/0041 ,  H05K3/4676 ,  H05K2203/178 ,  Y10T29/49124

Abstract: A circuit board and a method for manufacturing the same are disclosed. The circuit board of the present invention comprises: a carrier board, wherein a first circuit layer is disposed on at least one surface of the carrier board, and the first circuit layer comprises plural conductive pads; a protein dielectric layer disposed on the surface of the carrier board and the first circuit layer, wherein the protein dielectric layer has plural openings to expose the conductive pads; and a second circuit layer disposed on a surface of the protein dielectric layer, wherein the second circuit layer comprises plural first conductive vias, and each first conductive via is correspondingly formed in the opening and electrically connects to the conductive pad.

Abstract translation: 公开了一种电路板及其制造方法。 本发明的电路板包括：承载板，其中第一电路层设置在载板的至少一个表面上，第一电路层包括多个导电焊盘; 设置在所述载体板和所述第一电路层的表面上的蛋白质电介质层，其中所述蛋白质介电层具有多个开口以暴露所述导电焊盘; 以及设置在所述蛋白质电介质层的表面上的第二电路层，其中所述第二电路层包括多个第一导电通孔，并且每个第一导电通孔相应地形成在所述开口中并且电连接到所述导电焊盘。