INTERLEAVED LLC HALF-BRIDGE SERIES RESONANT CONVERTER HAVING INTEGRATED TRANSFORMER

    公开(公告)号:US20200083818A1

    公开(公告)日:2020-03-12

    申请号:US16278394

    申请日:2019-02-18

    申请人: JING-YUAN LIN

    IPC分类号: H02M3/335 H02M1/42

    摘要: An interleaved LLC half-bridge series resonant converter having an integrated transformer includes a power supply, a magnetic core, a first converter, a second converter and an output load circuit. The magnetic core has first and second outer columns and a center column. The first converter includes a first switch circuit, a first resonant tank, a first transformer, and a first rectifier circuit. The first transformer is coupled to the first resonant tank and includes a first primary winding wound on the first outer column and a first secondary winding wound on the second outer column. The second converter includes a second switch circuit, a second resonant tank, a second transformer and a second rectifier circuit. The second transformer is coupled to the second resonant tank and includes a second primary winding wound on the first outer column and a second secondary winding wound on the second outer column.

    Structure and fabrication method of a sensing device
    2.
    发明授权
    Structure and fabrication method of a sensing device 有权
    感测装置的结构和制造方法

    公开(公告)号:US09133018B2

    公开(公告)日:2015-09-15

    申请号:US12572277

    申请日:2009-10-02

    IPC分类号: B81B7/00

    摘要: A sensing device comprises a substrate having an upper surface, a sensor member, at least an external conductive wire, and a standing-ring member. The sensor member, the external conductive wire and the stand-ring member are on the upper surface. The sensor member is located at the central area on the upper surface, and the standing-ring member surrounds the sensor member. The standing-ring member and the sensor member are electrically connected through the at least an external conductive wire.

    摘要翻译: 感测装置包括具有上表面的基底,传感器构件,至少外部导电线和驻环构件。 传感器构件,外部导电线和支架构件在上表面上。 传感器构件位于上表面的中央区域,并且立环构件围绕传感器构件。 站立环构件和传感器构件通过至少一个外部导线电连接。

    PACKAGING STRUCTURE FOR INTEGRATION OF MICROELECTRONICS AND MEMS DEVICES BY 3D STACKING AND METHOD FOR MANUFACTURING THE SAME
    3.
    发明申请
    PACKAGING STRUCTURE FOR INTEGRATION OF MICROELECTRONICS AND MEMS DEVICES BY 3D STACKING AND METHOD FOR MANUFACTURING THE SAME 审中-公开
    用于通过3D堆叠集成微电子和MEMS器件的封装结构及其制造方法

    公开(公告)号:US20100019393A1

    公开(公告)日:2010-01-28

    申请号:US12197519

    申请日:2008-08-25

    IPC分类号: H01L23/52 B23C1/00

    摘要: A packaging structure for integration of microelectronics and MEMS devices by 3D stacking is disclosed, which comprises: an ASIC unit, comprising a first substrate and a circuit layout formed on a surface of the first substrate, wherein a cavity is formed on the other surface and at least a through hole is formed on the ASIC unit; and a MEMS unit, comprising a second substrate and a micro sensor disposed on the second substrate; wherein the micro sensor is disposed in the cavity and there is a conductive material filling the through hole so that the ASIC unit and the MEMS unit can be electrically connected to each other when the ASIC unit is attached onto the MEMS unit.

    摘要翻译: 公开了一种用于通过3D堆叠集成微电子和MEMS器件的封装结构,其包括:ASIC单元,其包括形成在第一基板的表面上的第一基板和电路布局,其中在另一表面上形成空腔, 至少一个通孔形成在ASIC单元上; 以及MEMS单元,包括设置在所述第二基板上的第二基板和微传感器; 其中所述微传感器设置在所述空腔中,并且存在填充所述通孔的导电材料,使得当所述ASIC单元附接到所述MEMS单元上时,所述ASIC单元和所述MEMS单元可彼此电连接。

    Variable optical attenuator derived from sol-gel material and manufacturing method thereof
    4.
    发明授权
    Variable optical attenuator derived from sol-gel material and manufacturing method thereof 有权
    衍生自溶胶 - 凝胶材料的可变光衰减器及其制造方法

    公开(公告)号:US07142766B2

    公开(公告)日:2006-11-28

    申请号:US10940083

    申请日:2004-09-14

    IPC分类号: G02B6/00

    摘要: A variable optical attenuator and a method of manufacturing thereof are described. First, a bottom cladding is formed on a substrate. A waveguide structure having a core region and an attenuation region is subsequently formed on the bottom cladding by photolithography. A top cladding is then formed on the bottom cladding and the waveguide structure, and an electrode is next disposed thereon and is aligned above the attenuation region of the waveguide structure. Further, the waveguide structure is composed of a sol-gel material, which is obtained by mixing a solution of metal alkoxide with a solution of organically modified Si-alkoxide and heating the same.

    摘要翻译: 描述了可变光衰减器及其制造方法。 首先,在基板上形成底部包层。 随后通过光刻法在底部包层上形成具有芯区域和衰减区域的波导结构。 然后在底部包层和波导结构上形成顶部包层,并且接着将电极放置在其上并且在波导结构的衰减区域的上方对齐。 此外,波导结构由溶胶 - 凝胶材料组成,其通过将金属醇盐溶液与有机改性的Si-醇盐溶液混合并加热而获得。

    Integrated transformer
    5.
    发明授权

    公开(公告)号:US10211746B1

    公开(公告)日:2019-02-19

    申请号:US15867055

    申请日:2018-01-10

    申请人: Jing-Yuan Lin

    摘要: Disclosed is an integrated transformer used in a resonant converter. The integrated transformer includes a primary side circuit, a secondary side circuit and an integrated core. A first voltage received by the primary side circuit is converted to a second voltage due to the electromagnetic induction, and the second voltage is outputted by the secondary side circuit. The primary side circuit is configured on the integrated core. The integrated core includes many iron rings, and the iron rings have a common side. The common side of the iron rings is a center column of the integrated core, and the other sides of the iron rings are rim columns of the integrated core. The coils of the primary side circuit are configured respectively to the rim columns of the integrated core, and the coils of the primary side circuit are connected in serial.

    Optical gas sensor
    6.
    发明授权
    Optical gas sensor 有权
    光学气体传感器

    公开(公告)号:US08896834B2

    公开(公告)日:2014-11-25

    申请号:US13553750

    申请日:2012-07-19

    IPC分类号: G01N21/00 G01J5/02 B05D3/06

    摘要: In the optical gas sensor of the application, a three-dimensional reaction chamber structure is used to replace the traditional simple structure, so that the performance of the gas sensor can be enhanced in a wafer-level size. Besides, a light source, a reaction chamber and a light detector are integrated into one wafer in an exemplary embodiment, so as to achieve the wafer-level integration. In addition, the optical gas sensor can detect various gases simultaneously and has wide application in fields such as home environment monitoring, industrial safety, and disease diagnosis and treatment.

    摘要翻译: 在本申请的光学气体传感器中,使用三维反应室结构来代替传统的简单结构,从而可以提高晶圆级尺寸的气体传感器的性能。 此外,在示例性实施例中,将光源,反应室和光检测器集成到一个晶片中,以便实现晶片级集成。 此外,光学气体传感器可以同时检测各种气体,并且广泛应用于家庭环境监测,工业安全和疾病诊断和治疗等领域。

    Capacitive sensor and manufacturing method thereof
    7.
    发明授权
    Capacitive sensor and manufacturing method thereof 有权
    电容式传感器及其制造方法

    公开(公告)号:US08104354B2

    公开(公告)日:2012-01-31

    申请号:US12877337

    申请日:2010-09-08

    IPC分类号: G01L9/12 H01L21/302

    摘要: A capacitive sensor includes a substrate, at least one first electrode, at least one second electrode, a sensing device, at least one anchor base, at least one movable frame, and a plurality of spring members. The first and second electrodes are disposed on the substrate, and the anchor base surrounds the first and second electrodes and is disposed on the substrate. The movable frame surrounds the sensing device. Some of the spring members connect the movable frame and the sensing device, and the other spring members connect the movable frame and the anchor base. The sensing device and the first electrode are both sensing electrodes. The movable frame is disposed above the second electrode, and cooperates with the second electrode to act as a capacitive driver.

    摘要翻译: 电容式传感器包括衬底,至少一个第一电极,至少一个第二电极,感测装置,至少一个锚定基座,至少一个可移动框架和多个弹簧构件。 第一电极和第二电极设置在基板上,锚固体围绕第一和第二电极并且设置在基板上。 可动框架围绕感测装置。 一些弹簧构件连接可动框架和感测装置,而另一个弹簧构件连接可动框架和锚固基座。 感测装置和第一电极都是感测电极。 可移动框架设置在第二电极上方,并与第二电极配合以用作电容式驱动器。

    CAPACITIVE SENSOR AND MANUFACTURING METHOD THEREOF
    8.
    发明申请
    CAPACITIVE SENSOR AND MANUFACTURING METHOD THEREOF 有权
    电容式传感器及其制造方法

    公开(公告)号:US20110154905A1

    公开(公告)日:2011-06-30

    申请号:US12877337

    申请日:2010-09-08

    IPC分类号: G01R27/26 H01L21/302 G01L9/12

    摘要: A capacitive sensor includes a substrate, at least one first electrode, at least one second electrode, a sensing device, at least one anchor base, at least one movable frame, and a plurality of spring members. The first and second electrodes are disposed on the substrate, and the anchor base surrounds the first and second electrodes and is disposed on the substrate. The movable frame surrounds the sensing device. Some of the spring members connect the movable frame and the sensing device, and the other spring members connect the movable frame and the anchor base. The sensing device and the first electrode are both sensing electrodes. The movable frame is disposed above the second electrode, and cooperates with the second electrode to act as a capacitive driver.

    摘要翻译: 电容式传感器包括衬底,至少一个第一电极,至少一个第二电极,感测装置,至少一个锚定基座,至少一个可移动框架和多个弹簧构件。 第一电极和第二电极设置在基板上,锚固体围绕第一和第二电极并且设置在基板上。 可动框架围绕感测装置。 一些弹簧构件连接可动框架和感测装置,而另一个弹簧构件连接可动框架和锚固基座。 感测装置和第一电极都是感测电极。 可移动框架设置在第二电极上方,并与第二电极配合以用作电容式驱动器。

    Interleaved LLC half-bridge series resonant converter having integrated transformer

    公开(公告)号:US10594225B1

    公开(公告)日:2020-03-17

    申请号:US16278394

    申请日:2019-02-18

    申请人: Jing-Yuan Lin

    IPC分类号: H02M3/335 H02M1/42

    摘要: An interleaved LLC half-bridge series resonant converter having an integrated transformer includes a power supply, a magnetic core, a first converter, a second converter and an output load circuit. The magnetic core has first and second outer columns and a center column. The first converter includes a first switch circuit, a first resonant tank, a first transformer, and a first rectifier circuit. The first transformer is coupled to the first resonant tank and includes a first primary winding wound on the first outer column and a first secondary winding wound on the second outer column. The second converter includes a second switch circuit, a second resonant tank, a second transformer and a second rectifier circuit. The second transformer is coupled to the second resonant tank and includes a second primary winding wound on the first outer column and a second secondary winding wound on the second outer column.