摘要:
An interleaved LLC half-bridge series resonant converter having an integrated transformer includes a power supply, a magnetic core, a first converter, a second converter and an output load circuit. The magnetic core has first and second outer columns and a center column. The first converter includes a first switch circuit, a first resonant tank, a first transformer, and a first rectifier circuit. The first transformer is coupled to the first resonant tank and includes a first primary winding wound on the first outer column and a first secondary winding wound on the second outer column. The second converter includes a second switch circuit, a second resonant tank, a second transformer and a second rectifier circuit. The second transformer is coupled to the second resonant tank and includes a second primary winding wound on the first outer column and a second secondary winding wound on the second outer column.
摘要:
A sensing device comprises a substrate having an upper surface, a sensor member, at least an external conductive wire, and a standing-ring member. The sensor member, the external conductive wire and the stand-ring member are on the upper surface. The sensor member is located at the central area on the upper surface, and the standing-ring member surrounds the sensor member. The standing-ring member and the sensor member are electrically connected through the at least an external conductive wire.
摘要:
A packaging structure for integration of microelectronics and MEMS devices by 3D stacking is disclosed, which comprises: an ASIC unit, comprising a first substrate and a circuit layout formed on a surface of the first substrate, wherein a cavity is formed on the other surface and at least a through hole is formed on the ASIC unit; and a MEMS unit, comprising a second substrate and a micro sensor disposed on the second substrate; wherein the micro sensor is disposed in the cavity and there is a conductive material filling the through hole so that the ASIC unit and the MEMS unit can be electrically connected to each other when the ASIC unit is attached onto the MEMS unit.
摘要:
A variable optical attenuator and a method of manufacturing thereof are described. First, a bottom cladding is formed on a substrate. A waveguide structure having a core region and an attenuation region is subsequently formed on the bottom cladding by photolithography. A top cladding is then formed on the bottom cladding and the waveguide structure, and an electrode is next disposed thereon and is aligned above the attenuation region of the waveguide structure. Further, the waveguide structure is composed of a sol-gel material, which is obtained by mixing a solution of metal alkoxide with a solution of organically modified Si-alkoxide and heating the same.
摘要:
Disclosed is an integrated transformer used in a resonant converter. The integrated transformer includes a primary side circuit, a secondary side circuit and an integrated core. A first voltage received by the primary side circuit is converted to a second voltage due to the electromagnetic induction, and the second voltage is outputted by the secondary side circuit. The primary side circuit is configured on the integrated core. The integrated core includes many iron rings, and the iron rings have a common side. The common side of the iron rings is a center column of the integrated core, and the other sides of the iron rings are rim columns of the integrated core. The coils of the primary side circuit are configured respectively to the rim columns of the integrated core, and the coils of the primary side circuit are connected in serial.
摘要:
In the optical gas sensor of the application, a three-dimensional reaction chamber structure is used to replace the traditional simple structure, so that the performance of the gas sensor can be enhanced in a wafer-level size. Besides, a light source, a reaction chamber and a light detector are integrated into one wafer in an exemplary embodiment, so as to achieve the wafer-level integration. In addition, the optical gas sensor can detect various gases simultaneously and has wide application in fields such as home environment monitoring, industrial safety, and disease diagnosis and treatment.
摘要:
A capacitive sensor includes a substrate, at least one first electrode, at least one second electrode, a sensing device, at least one anchor base, at least one movable frame, and a plurality of spring members. The first and second electrodes are disposed on the substrate, and the anchor base surrounds the first and second electrodes and is disposed on the substrate. The movable frame surrounds the sensing device. Some of the spring members connect the movable frame and the sensing device, and the other spring members connect the movable frame and the anchor base. The sensing device and the first electrode are both sensing electrodes. The movable frame is disposed above the second electrode, and cooperates with the second electrode to act as a capacitive driver.
摘要:
A capacitive sensor includes a substrate, at least one first electrode, at least one second electrode, a sensing device, at least one anchor base, at least one movable frame, and a plurality of spring members. The first and second electrodes are disposed on the substrate, and the anchor base surrounds the first and second electrodes and is disposed on the substrate. The movable frame surrounds the sensing device. Some of the spring members connect the movable frame and the sensing device, and the other spring members connect the movable frame and the anchor base. The sensing device and the first electrode are both sensing electrodes. The movable frame is disposed above the second electrode, and cooperates with the second electrode to act as a capacitive driver.
摘要:
A sensing device comprises a substrate having an upper surface, a sensor member, at least an external conductive wire, and a standing-ring member. The sensor member, the external conductive wire and the stand-ring member are on the upper surface. The sensor member is located at the central area on the upper surface, and the standing-ring member surrounds the sensor member. The standing-ring member and the sensor member are electrically connected through the at least an external conductive wire.
摘要:
An interleaved LLC half-bridge series resonant converter having an integrated transformer includes a power supply, a magnetic core, a first converter, a second converter and an output load circuit. The magnetic core has first and second outer columns and a center column. The first converter includes a first switch circuit, a first resonant tank, a first transformer, and a first rectifier circuit. The first transformer is coupled to the first resonant tank and includes a first primary winding wound on the first outer column and a first secondary winding wound on the second outer column. The second converter includes a second switch circuit, a second resonant tank, a second transformer and a second rectifier circuit. The second transformer is coupled to the second resonant tank and includes a second primary winding wound on the first outer column and a second secondary winding wound on the second outer column.