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    Vacuum hermetic organic packaging carrier
    1.
    发明授权
    Vacuum hermetic organic packaging carrier 有权
    真空密封有机包装载体

    公开(公告)号：US08421216B2

    公开(公告)日：2013-04-16

    申请号：US13111960

    申请日：2011-05-20

    申请人： Lung-Tai Chen ,  Tzong-Che Ho ,  Li-Chi Pan ,  Yu-Wen Fan

    发明人： Lung-Tai Chen ,  Tzong-Che Ho ,  Li-Chi Pan ,  Yu-Wen Fan

    IPC分类号： H01L23/12

    CPC分类号： H01L41/0533 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2924/16152 ,  H01L2924/00014

    摘要： A vacuum hermetic organic packaging carrier is provided. The organic packaging carrier includes an organic substrate, a conductive circuit layer, and an inorganic hermetic insulation film. The organic substrate has a first surface. The conductive circuit layer is located on the first surface and exposes a portion of the first surface. The inorganic hermetic insulation film at least covers the exposed first surface to achieve an effect of completely hermetically sealing the organic packaging carrier.

    摘要翻译： 提供真空密封有机包装载体。 有机包装载体包括有机基板，导电电路层和无机密封绝缘膜。 有机基板具有第一表面。 导电电路层位于第一表面上并暴露第一表面的一部分。 无机密封绝缘膜至少覆盖暴露的第一表面，以实现完全气密密封有机包装载体的效果。

    CAPACITIVE TRANSDUCER AND FABRICATION METHOD
    3.
    发明申请
    CAPACITIVE TRANSDUCER AND FABRICATION METHOD 有权
    电容式传感器和制造方法

    公开(公告)号：US20110150261A1

    公开(公告)日：2011-06-23

    申请号：US12643417

    申请日：2009-12-21

    申请人： Tzong-Che HO ,  Lung-Tai Chen ,  Yao-Jung Lee ,  Chao-Ta Huang ,  Li-Chi Pan ,  Yu-Sheng Hsieh

    发明人： Tzong-Che HO ,  Lung-Tai Chen ,  Yao-Jung Lee ,  Chao-Ta Huang ,  Li-Chi Pan ,  Yu-Sheng Hsieh

    IPC分类号： H04R9/08 ,  H01G7/00

    CPC分类号： H01G5/011 ,  H04R19/005 ,  H04R19/04 ,  H04R31/00

    摘要： A capacitive transducer and fabrication method are disclosed. The capacitive transducer includes a substrate, a first electrode mounted on the substrate, a cap having a through-hole and a cavity beside the through-hole, a second electrode mounted on the cap across the through-hole. The second electrode is deformable in response to pressure fluctuations applied thereto via the through-hole and defines, together with the first electrode, as a capacitor. The capacitor includes a capacitance variable with the pressure fluctuations and the cavity defines a back chamber for the deformable second electrode.

    摘要翻译： 公开了一种电容式换能器和制造方法。 所述电容式换能器包括基板，安装在所述基板上的第一电极，具有通孔和所述通孔旁边的空腔的盖，穿过所述通孔安装在所述盖上的第二电极。 第二电极响应于通过通孔施加到其上的压力波动而变形，并与第一电极一起限定为电容器。 电容器包括具有压力波动的电容变量，并且空腔限定用于可变形的第二电极的后室。

    Wafer level sensing package and manufacturing process thereof
    4.
    发明授权
    Wafer level sensing package and manufacturing process thereof 有权
    晶圆级感测封装及其制造工艺

    公开(公告)号：US07915065B2

    公开(公告)日：2011-03-29

    申请号：US12331539

    申请日：2008-12-10

    申请人： Lung-Tai Chen ,  Chun-Hsun Chu ,  Tzong-Che Ho ,  Bor-Chen Tsai

    发明人： Lung-Tai Chen ,  Chun-Hsun Chu ,  Tzong-Che Ho ,  Bor-Chen Tsai

    IPC分类号： H01L21/00

    CPC分类号： B81C1/00793 ,  B81B7/0054 ,  B81B2201/0292 ,  B81B2207/07 ,  B81C1/00182 ,  B81C2201/053 ,  H01L2224/0401 ,  H01L2224/05548 ,  H01L2224/13023 ,  H01L2924/1461 ,  H01L2924/00

    摘要： A wafer level sensing package and manufacturing process thereof are described. The process includes providing a wafer having sensing chips, in which each sensing chip has a sensing area and pads; forming a stress release layer on a wafer surface; cladding a photoresist layer on the stress release layer; patterning the photoresist layer to expose the pads and a portion of the stress release layer, without exposing opening areas of the sensing areas; forming a conductive metal layer of re-distributed pads on the portion of the stress release layer exposed by the photoresist layer; removing the photoresist layer; forming a re-cladding photoresist layer on the stress release layer and the conductive metal layer; forming holes in the re-cladding photoresist layer above the re-distributed pad area; and forming conductive bumps in the holes to electrically connect to the conductive metal layer.

    摘要翻译： 描述了晶片级感测封装及其制造工艺。 该过程包括提供具有感测芯片的晶片，其中每个感测芯片具有感测区域和焊盘; 在晶片表面上形成应力释放层; 在应力释放层上包覆光致抗蚀剂层; 图案化光致抗蚀剂层以暴露垫和应力释放层的一部分，而不暴露感测区域的开口区域; 在由光致抗蚀剂层暴露的应力释放层的部分上形成再分布焊盘的导电金属层; 去除光致抗蚀剂层; 在所述应力释放层和所述导电金属层上形成再包覆光致抗蚀剂层; 在再分布的焊盘区域上方的再包层光致抗蚀剂层中形成孔; 以及在所述孔中形成导电凸块以电连接到所述导电金属层。

    WAFER LEVEL SENSING PACKAGE AND MANUFACTURING PROCESS THEREOF
    5.
    发明申请
    WAFER LEVEL SENSING PACKAGE AND MANUFACTURING PROCESS THEREOF 有权
    WAFER水平感测包装及其制造工艺

    公开(公告)号：US20090124074A1

    公开(公告)日：2009-05-14

    申请号：US12331539

    申请日：2008-12-10

    申请人： Lung-Tai Chen ,  Chun-Hsun Chu ,  Tzong-Che Ho ,  Bor-Chen Tsai

    发明人： Lung-Tai Chen ,  Chun-Hsun Chu ,  Tzong-Che Ho ,  Bor-Chen Tsai

    IPC分类号： H01L21/768

    CPC分类号： B81C1/00793 ,  B81B7/0054 ,  B81B2201/0292 ,  B81B2207/07 ,  B81C1/00182 ,  B81C2201/053 ,  H01L2224/0401 ,  H01L2224/05548 ,  H01L2224/13023 ,  H01L2924/1461 ,  H01L2924/00

    摘要： A wafer level sensing package and manufacturing process thereof are described. The process includes providing a wafer having sensing chips, in which each sensing chip has a sensing area and pads; forming a stress release layer on a wafer surface; cladding a photoresist layer on the stress release layer; patterning the photoresist layer to expose the pads and a portion of the stress release layer, without exposing opening areas of the sensing areas; forming a conductive metal layer of re-distributed pads on the portion of the stress release layer exposed by the photoresist layer; removing the photoresist layer; forming a re-cladding photoresist layer on the stress release layer and the conductive metal layer; forming holes in the re-cladding photoresist layer above the re-distributed pad area; and forming conductive bumps in the holes to electrically connect to the conductive metal layer.

    摘要翻译： 描述了晶片级感测封装及其制造工艺。 该过程包括提供具有感测芯片的晶片，其中每个感测芯片具有感测区域和焊盘; 在晶片表面上形成应力释放层; 在应力释放层上包覆光致抗蚀剂层; 图案化光致抗蚀剂层以暴露垫和应力释放层的一部分，而不暴露感测区域的开口区域; 在由光致抗蚀剂层暴露的应力释放层的部分上形成再分布焊盘的导电金属层; 去除光致抗蚀剂层; 在所述应力释放层和所述导电金属层上形成再包覆光致抗蚀剂层; 在再分布的焊盘区域上方的再包层光致抗蚀剂层中形成孔; 并且在所述孔中形成导电凸块以电连接到所述导电金属层。

    Diaper
    6.
    发明申请
    Diaper 审中-公开
    尿布

    公开(公告)号：US20080074274A1

    公开(公告)日：2008-03-27

    申请号：US11654559

    申请日：2007-01-18

    申请人： Ying-Chiang Hu ,  Hung-Hsin Tsai ,  Chun-Hsun Chu ,  Tzong-Che Ho

    发明人： Ying-Chiang Hu ,  Hung-Hsin Tsai ,  Chun-Hsun Chu ,  Tzong-Che Ho

    IPC分类号： G08B23/00

    CPC分类号： A61F13/42

    摘要： The present invention provides a diaper including a body, a sensing module disposed on the body for detecting humidity of the body and wirelessly transmitting an electrical signal converted from the humidity and a receiving module for receiving the electrical signal transmitted by the sensing module and generating an alarm signal.

    摘要翻译： 本发明提供了一种尿布，其包括主体，设置在身体上用于检测身体湿度的无线传感器的感测模块，以及从湿度转换的电信号和接收模块，用于接收由感测模块发送的电信号， 报警信号。

    Side structure of a bare LED and backlight module thereof
    8.
    发明授权
    Side structure of a bare LED and backlight module thereof 有权
    裸LED及其背光模块的侧面结构

    公开(公告)号：US07312478B2

    公开(公告)日：2007-12-25

    申请号：US11023487

    申请日：2004-12-29

    申请人： Ra-Min Tain ,  Shyi-Ching Liau ,  Tzong-Che Ho

    发明人： Ra-Min Tain ,  Shyi-Ching Liau ,  Tzong-Che Ho

    IPC分类号： H01L29/22

    CPC分类号： H01L33/486 ,  H01L33/385 ,  H01L33/60 ,  H01L33/62 ,  H01L33/64 ,  H01L2924/0002 ,  H01L2924/00

    摘要： The present invention discloses a side structure of a bare LED and a backlight module thereof, wherein the backlight module is preferably a light source of a display device such as an LCD device. The backlight module includes a flat plate covered with a thermally conductive dielectric material, a plurality of the side structures of the bare LEDs placed on the flat plate and in contact with the thermally conductive dielectric material, and a plurality of reflection parts also placed on the flat plate, each side structure of each bare LED includes a bare LED and two electrically conductive materials coupled to two bonding pads of the side structure of the bare LED respectively, and positioned on the flat plate therefor.

    摘要翻译： 本发明公开了一种裸露LED的侧面结构及其背光模块，其中，背光模块优选为LCD装置等显示装置的光源。 背光模块包括被导热电介质材料覆盖的平板，放置在平板上并与导热介电材料接触的裸露LED的多个侧面结构，以及多个反射部分 平板，每个裸LED的每个侧面结构包括裸LED和分别耦合到裸LED的侧结构的两个焊盘的两个导电材料，并且定位在其平板上。

    3-D stackable semiconductor package
    9.
    发明授权
    3-D stackable semiconductor package 有权
    3-D可堆叠半导体封装

    公开(公告)号：US07119429B2

    公开(公告)日：2006-10-10

    申请号：US11074732

    申请日：2005-03-09

    申请人： Shu-Ming Chang ,  Tzong-Che Ho

    发明人： Shu-Ming Chang ,  Tzong-Che Ho

    IPC分类号： H01L23/02 ,  H01L23/48

    CPC分类号： H01L25/105 ,  H01L2224/04105 ,  H01L2224/12105 ,  H01L2224/32145 ,  H01L2224/73267 ,  H01L2225/1035 ,  H01L2225/1058 ,  H01L2225/1094 ,  H01L2924/0002 ,  H01L2924/3511 ,  H01L2924/00

    摘要： A 3-D stackable semiconductor package includes a first component and a second component. The semiconductor package is formed by stacking the back of the first component and the back of the second component together. The metal pads on the surfaces of the first component and the second component are redistributed to the edge of the first and the second components by a redistribution layer. A plurality of electric conduction posts is formed at the edge of the first and the second component to transmit electric signals between them. The semiconductor package transmits electric signals to the PCB by the electric conductive bumps.

    摘要翻译： 3-D可堆叠半导体封装包括第一部件和第二部件。 半导体封装通过将第一部件的背面和第二部件的背面堆叠在一起而形成。 第一部件和第二部件的表面上的金属焊盘通过再分布层重新分配到第一和第二部件的边缘。 在第一和第二部件的边缘处形成多个导电柱，以在它们之间传输电信号。 半导体封装通过导电凸块将电信号传输到PCB。

    Ultra thin package for electric acoustic sensor chip of micro electro mechanical system
    10.
    发明授权
    Ultra thin package for electric acoustic sensor chip of micro electro mechanical system 有权
    微电子机械系统电声传感器芯片超薄封装

    公开(公告)号：US08508022B2

    公开(公告)日：2013-08-13

    申请号：US12172900

    申请日：2008-07-14

    申请人： Tzong-Che Ho ,  Jason Pan ,  Pin Chang ,  Chin-Horng Wang ,  Jung-Tai Chen ,  Hsin-Li Lee ,  Kai-Hsiang Yen

    发明人： Tzong-Che Ho ,  Jason Pan ,  Pin Chang ,  Chin-Horng Wang ,  Jung-Tai Chen ,  Hsin-Li Lee ,  Kai-Hsiang Yen

    IPC分类号： H01L23/552 ,  H01L21/00 ,  H05K7/00

    CPC分类号： H04R19/005 ,  B81B7/0058 ,  B81B2201/0257 ,  H01L2924/0002 ,  H01L2924/00

    摘要： An ultra thin package for an electric acoustic sensor chip of a micro electro mechanical system is provided. A substrate has a first substrate surface and a second substrate surface opposite to the first substrate surface. At least one conductor bump is formed on the second substrate surface. An electric acoustic sensor chip having a first chip surface and a second chip surface opposite to the first chip surface is provided. The first chip surface is electrically connected to the conductor bump. The conductor bump is positioned between the second substrate surface and the first chip surface to create a space. The conductor bump is used for transferring a signal from the sensor chip to the substrate. An acoustic opening passing through the substrate is formed.

    摘要翻译： 提供了一种用于微机电系统的电声传感器芯片的超薄封装。 衬底具有与第一衬底表面相对的第一衬底表面和第二衬底表面。 在第二基板表面上形成至少一个导体凸块。 提供具有与第一芯片表面相对的第一芯片表面和第二芯片表面的电声传感器芯片。 第一芯片表面电连接到导体凸块。 导体凸块位于第二基板表面和第一芯片表面之间以产生空间。 导体凸块用于将信号从传感器芯片传送到基板。 形成通过基板的声学开口。