VDD pre-set of direct sense DRAM
    2.
    发明授权
    VDD pre-set of direct sense DRAM 有权
    VDD预置的直接感应DRAM

    公开(公告)号:US08238168B2

    公开(公告)日:2012-08-07

    申请号:US12770976

    申请日:2010-04-30

    IPC分类号: G11C11/34

    CPC分类号: G11C11/4091

    摘要: A direct sense memory array architecture and method of operation includes a plurality of memory cells where a bit-line restore voltage level is optimized to reduce memory cell leakage during a first inactive period, and a bit-line preset voltage level is optimized for signal sensing during a second active period. The architecture includes a sense head having of a pair of cross coupled gated inverters. Each of the gated inverters is responsive to a first and second gate control signal which can independently gate a power supply to the inverter circuit within each gated inverter. During the second active period, a first gated inverter senses the data state on the first bit-line, and a second gated inverter performs a preset and write-back function on the first bit-line.

    摘要翻译: 直接读出存储器阵列结构和操作方法包括多个存储器单元,其中位线恢复电压电平被优化以在第一非活动时段期间减少存储器单元泄漏,并且位线预设电压电平被优化用于信号感测 在第二个活跃期间。 该架构包括具有一对交叉耦合门控反相器的感测头。 每个门控逆变器响应于第一和第二门控制信号,该第一和第二门控制信号可以独立地对每个门控逆变器内的逆变器电路的电源供电。 在第二活动期间,第一选通逆变器检测第一位线上的数据状态,第二门控反相器在第一位线上执行预置和回写功能。

    Deep trench capacitor for SOI CMOS devices for soft error immunity
    3.
    发明授权
    Deep trench capacitor for SOI CMOS devices for soft error immunity 有权
    用于SOI CMOS器件的深沟槽电容器,用于软误差抗扰度

    公开(公告)号:US08133772B2

    公开(公告)日:2012-03-13

    申请号:US13075271

    申请日:2011-03-30

    IPC分类号: H01L21/8242

    摘要: A semiconductor structure is disclosed. The semiconductor structure includes an active semiconductor layer, a semiconductor device having a gate disposed on top of the active semiconductor layer, and source and drain regions and a body/channel region disposed within the active semiconductor layer, an insulator layer having a first and second side, the first side being adjacent to the active semiconductor layer, a substrate disposed adjacent to the second side of the insulator layer, a deep trench capacitor disposed under the body/channel region of the semiconductor device. The deep trench capacitor electrically connects with and contacts the body/channel region of the semiconductor device, and is located adjacent to the gate of the semiconductor device. The semiconductor structure increases a critical charge Qcrit, thereby reducing a soft error rate (SER) of the semiconductor device.

    摘要翻译: 公开了半导体结构。 半导体结构包括有源半导体层,具有设置在有源半导体层顶部的栅极的半导体器件以及设置在有源半导体层内的源极和漏极区域以及主体/沟道区域,具有第一和第二 所述第一侧与所述有源半导体层相邻,与所述绝缘体层的所述第二侧相邻配置的衬底,设置在所述半导体器件的所述主体/沟道区域下方的深沟槽电容器。 深沟槽电容器与半导体器件的主体/沟道区电连接并接触半导体器件的主体/沟道区,并且位于半导体器件的栅极附近。 半导体结构增加了临界电荷Qcrit,从而降低了半导体器件的软错误率(SER)。

    Reference level generation with offset compensation for sense amplifier
    4.
    发明授权
    Reference level generation with offset compensation for sense amplifier 有权
    用于读出放大器的偏移补偿的参考电平生成

    公开(公告)号:US08125840B2

    公开(公告)日:2012-02-28

    申请号:US12550848

    申请日:2009-08-31

    IPC分类号: G11C5/14 G11C7/00

    CPC分类号: G11C7/14 G11C7/065 G11C7/12

    摘要: An approach that provides reference level generation with offset compensation for a sense amplifier is described. In one embodiment, an arbitrary reference level is generated to provide an offset that compensates for device mismatch and voltage threshold of a sense amplifier.

    摘要翻译: 描述了一种为感测放大器提供具有偏移补偿的参考电平生成的方法。 在一个实施例中,产生任意参考电平以提供补偿读出放大器的器件失配和电压阈值的偏移。

    Method and system for implementing dynamic refresh protocols for DRAM based cache
    5.
    发明授权
    Method and system for implementing dynamic refresh protocols for DRAM based cache 有权
    用于实现基于DRAM的缓存动态刷新协议的方法和系统

    公开(公告)号:US08024513B2

    公开(公告)日:2011-09-20

    申请号:US11949904

    申请日:2007-12-04

    IPC分类号: G06F12/00

    CPC分类号: G06F12/0893 Y02D10/13

    摘要: A method for implementing dynamic refresh protocols for DRAM based cache includes partitioning a DRAM cache into a refreshable portion and a non-refreshable portion, and assigning incoming individual cache lines to one of the refreshable portion and the non-refreshable portion of the cache based on a usage history of the cache lines. Cache lines corresponding to data having a usage history below a defined frequency are assigned to the refreshable portion of the cache, and cache lines corresponding to data having a usage history at or above the defined frequency are assigned to the non-refreshable portion of the cache.

    摘要翻译: 一种用于实现基于DRAM的高速缓存的动态刷新协议的方法包括将DRAM高速缓存划分为可刷新部分和不可刷新部分,以及基于以下方式将输入的各个高速缓存行分配到高速缓存的可刷新部分和不可刷新部分之一: 高速缓存行的使用历史。 对应于具有低于定义频率的使用历史的数据的缓存线被分配给高速缓存的可刷新部分,并且与具有等于或高于定义频率的使用历史的数据相对应的高速缓存行被分配给高速缓存的不可刷新部分 。

    Capacitively isolated mismatch compensated sense amplifier
    6.
    发明授权
    Capacitively isolated mismatch compensated sense amplifier 有权
    电容隔离失配补偿感测放大器

    公开(公告)号:US08014218B2

    公开(公告)日:2011-09-06

    申请号:US12343554

    申请日:2008-12-24

    IPC分类号: G11C7/06

    摘要: According to an embodiment of the invention, a sense amplifier for, e.g., an array of DRAM data storage cells includes one or more amplifier stages connected together in series. The amplifier stages together form the sense amplifier for the DRAM array. Each amplifier stage includes an isolation capacitor to reduce to a relatively small value any mismatch between the threshold voltages of the transistors within each amplifier stage. A bitline from the DRAM array of memory cells connects to the first amplifier stage. An output from the last amplifier stage connects to a write back switch, the output of which connects to the bitline at the input of the first amplifier stage.

    摘要翻译: 根据本发明的实施例,用于例如DRAM数据存储单元的阵列的读出放大器包括串联连接在一起的一个或多个放大器级。 放大器级一起形成用于DRAM阵列的读出放大器。 每个放大器级包括隔离电容器,以将每个放大器级内的晶体管的阈值电压之间的失配降至相对较小的值。 存储器单元的DRAM阵列的位线连接到第一放大器级。 来自最后一个放大器级的输出端连接到写回开关,其回输开关在第一放大器级的输入处连接到位线。

    CAPACITIVELY ISOLATED MISMATCH COMPENSATED SENSE AMPLIFIER
    7.
    发明申请
    CAPACITIVELY ISOLATED MISMATCH COMPENSATED SENSE AMPLIFIER 有权
    电容式隔离失调补偿放大器

    公开(公告)号:US20100157698A1

    公开(公告)日:2010-06-24

    申请号:US12343554

    申请日:2008-12-24

    IPC分类号: G11C7/06

    摘要: According to an embodiment of the invention, a sense amplifier for, e.g., an array of DRAM data storage cells includes one or more amplifier stages connected together in series. The amplifier stages together form the sense amplifier for the DRAM array. Each amplifier stage includes an isolation capacitor to reduce to a relatively small value any mismatch between the threshold voltages of the transistors within each amplifier stage. A bitline from the DRAM array of memory cells connects to the first amplifier stage. An output from the last amplifier stage connects to a write back switch, the output of which connects to the bitline at the input of the first amplifier stage.

    摘要翻译: 根据本发明的实施例,用于例如DRAM数据存储单元的阵列的读出放大器包括串联连接在一起的一个或多个放大器级。 放大器级一起形成用于DRAM阵列的读出放大器。 每个放大器级包括隔离电容器,以将每个放大器级内的晶体管的阈值电压之间的失配降至相对较小的值。 存储器单元的DRAM阵列的位线连接到第一放大器级。 来自最后一个放大器级的输出端连接到写回开关,其回输开关在第一放大器级的输入处连接到位线。

    SOFT ERROR PROTECTION STRUCTURE EMPLOYING A DEEP TRENCH
    9.
    发明申请
    SOFT ERROR PROTECTION STRUCTURE EMPLOYING A DEEP TRENCH 失效
    使用深度感应器的软错误保护结构

    公开(公告)号:US20090224304A1

    公开(公告)日:2009-09-10

    申请号:US12045190

    申请日:2008-03-10

    IPC分类号: H01L27/105 H01L21/8232

    摘要: A deep trench containing a doped semiconductor fill portion having a first conductivity type doping and surrounded by a buried plate layer having a second conductivity type doping at a lower portion is formed in a semiconductor layer having a doping of the first conductivity type. A doped well of the second conductivity type abutting the buried plate layer is formed. The doped semiconductor fill portion functions as a temporary reservoir for electrical charges of the first conductivity type that are generated by a radiation particle, and the buried plate layer functions as a temporary reservoir for electrical charges of the second conductivity type. The buried plate layer and the doped semiconductor fill portion forms a capacitor, and provides protection from soft errors to devices formed in the semiconductor layer or the doped well.

    摘要翻译: 在具有第一导电类型的掺杂的半导体层中形成包含掺杂半导体填充部分的深沟槽,该掺杂半导体填充部分具有第一导电类型掺杂并被由下部具有第二导电类型掺杂的掩埋板包围。 形成与掩埋板层相邻的第二导电类型的掺杂阱。 掺杂半导体填充部分用作由辐射颗粒产生的第一导电类型的电荷的临时储存器,并且掩埋板层用作第二导电类型的电荷的临时储存器。 掩埋板层和掺杂半导体填充部分形成电容器,并且提供对软错误的保护以防止在半导体层或掺杂阱中形成的器件。

    FAILING ADDRESS REGISTER AND COMPARE LOGIC FOR MULTI-PASS REPAIR OF MEMORY ARRAYS
    10.
    发明申请
    FAILING ADDRESS REGISTER AND COMPARE LOGIC FOR MULTI-PASS REPAIR OF MEMORY ARRAYS 审中-公开
    存储器阵列的多通道修复失败地址寄存器和比较逻辑

    公开(公告)号:US20090154270A1

    公开(公告)日:2009-06-18

    申请号:US11958697

    申请日:2007-12-18

    IPC分类号: G11C29/04

    摘要: An integrated circuit having an integrated circuit and method for moving a failing address into a next available FAR by utilizing the functional compare circuitry during BIST of redundant memory elements. A method of is disclosed that includes: providing a set of FARs and an associated set of redundant elements, wherein each FAR maps to a corresponding redundant element; testing a set of elements and placing an address of each failing element into a FAR; testing each redundant element and marking a FAR as bad when a redundant element corresponding to the FAR fails; and readdressing the set of elements and placing an address of an element being readdressed in a new FAR when the address of the element being readdressed matches an address in a FAR that has been marked as bad.

    摘要翻译: 一种集成电路,具有集成电路和方法,用于通过在冗余存储器元件的BIST期间利用功能比较电路将故障地址移动到下一个可用的FAR中。 公开了一种方法,其包括:提供一组FAR和相关的一组冗余元件,其中每个FAR映射到相应的冗余元件; 测试一组元素并将每个故障元素的地址放入FAR中; 当对应于FAR的冗余元素失败时,测试每个冗余元素并将FAR标记为不良; 并且当正被读取的元素的地址与已被标记为不良的FAR中的地址相匹配时,对元素集合进行重新排序并将被读取的元素的地址放置在新的FAR中。