摘要:
A structure forming a metal-insulator-metal (MIM) trench capacitor is disclosed. The structure comprises a multi-layer substrate having a metal layer and at least one dielectric layer. A trench is etched into the substrate, passing through the metal layer. The trench is lined with a metal material that is in contact with the metal layer, which comprises a first node of a capacitor. A dielectric material lines the metal material in the trench. The trench is filled with a conductor. The dielectric material that lines the metal material separates the conductor from the metal layer and the metal material lining the trench. The conductor comprises a second node of the capacitor.
摘要:
A direct sense memory array architecture and method of operation includes a plurality of memory cells where a bit-line restore voltage level is optimized to reduce memory cell leakage during a first inactive period, and a bit-line preset voltage level is optimized for signal sensing during a second active period. The architecture includes a sense head having of a pair of cross coupled gated inverters. Each of the gated inverters is responsive to a first and second gate control signal which can independently gate a power supply to the inverter circuit within each gated inverter. During the second active period, a first gated inverter senses the data state on the first bit-line, and a second gated inverter performs a preset and write-back function on the first bit-line.
摘要:
A semiconductor structure is disclosed. The semiconductor structure includes an active semiconductor layer, a semiconductor device having a gate disposed on top of the active semiconductor layer, and source and drain regions and a body/channel region disposed within the active semiconductor layer, an insulator layer having a first and second side, the first side being adjacent to the active semiconductor layer, a substrate disposed adjacent to the second side of the insulator layer, a deep trench capacitor disposed under the body/channel region of the semiconductor device. The deep trench capacitor electrically connects with and contacts the body/channel region of the semiconductor device, and is located adjacent to the gate of the semiconductor device. The semiconductor structure increases a critical charge Qcrit, thereby reducing a soft error rate (SER) of the semiconductor device.
摘要:
An approach that provides reference level generation with offset compensation for a sense amplifier is described. In one embodiment, an arbitrary reference level is generated to provide an offset that compensates for device mismatch and voltage threshold of a sense amplifier.
摘要:
A method for implementing dynamic refresh protocols for DRAM based cache includes partitioning a DRAM cache into a refreshable portion and a non-refreshable portion, and assigning incoming individual cache lines to one of the refreshable portion and the non-refreshable portion of the cache based on a usage history of the cache lines. Cache lines corresponding to data having a usage history below a defined frequency are assigned to the refreshable portion of the cache, and cache lines corresponding to data having a usage history at or above the defined frequency are assigned to the non-refreshable portion of the cache.
摘要:
According to an embodiment of the invention, a sense amplifier for, e.g., an array of DRAM data storage cells includes one or more amplifier stages connected together in series. The amplifier stages together form the sense amplifier for the DRAM array. Each amplifier stage includes an isolation capacitor to reduce to a relatively small value any mismatch between the threshold voltages of the transistors within each amplifier stage. A bitline from the DRAM array of memory cells connects to the first amplifier stage. An output from the last amplifier stage connects to a write back switch, the output of which connects to the bitline at the input of the first amplifier stage.
摘要:
According to an embodiment of the invention, a sense amplifier for, e.g., an array of DRAM data storage cells includes one or more amplifier stages connected together in series. The amplifier stages together form the sense amplifier for the DRAM array. Each amplifier stage includes an isolation capacitor to reduce to a relatively small value any mismatch between the threshold voltages of the transistors within each amplifier stage. A bitline from the DRAM array of memory cells connects to the first amplifier stage. An output from the last amplifier stage connects to a write back switch, the output of which connects to the bitline at the input of the first amplifier stage.
摘要:
A system to generate a reference for a charge pump may include a diode-connected transistor providing a reference voltage, and an output transistor. The system may also include a reference circuit to provide a current that is substantially temperature insensitive and the reference circuit delivers the current across the diode-connected transistor thereby enabling the reference voltage to move with processing of the diode-connected transistor.
摘要:
A deep trench containing a doped semiconductor fill portion having a first conductivity type doping and surrounded by a buried plate layer having a second conductivity type doping at a lower portion is formed in a semiconductor layer having a doping of the first conductivity type. A doped well of the second conductivity type abutting the buried plate layer is formed. The doped semiconductor fill portion functions as a temporary reservoir for electrical charges of the first conductivity type that are generated by a radiation particle, and the buried plate layer functions as a temporary reservoir for electrical charges of the second conductivity type. The buried plate layer and the doped semiconductor fill portion forms a capacitor, and provides protection from soft errors to devices formed in the semiconductor layer or the doped well.
摘要:
An integrated circuit having an integrated circuit and method for moving a failing address into a next available FAR by utilizing the functional compare circuitry during BIST of redundant memory elements. A method of is disclosed that includes: providing a set of FARs and an associated set of redundant elements, wherein each FAR maps to a corresponding redundant element; testing a set of elements and placing an address of each failing element into a FAR; testing each redundant element and marking a FAR as bad when a redundant element corresponding to the FAR fails; and readdressing the set of elements and placing an address of an element being readdressed in a new FAR when the address of the element being readdressed matches an address in a FAR that has been marked as bad.