公开(公告)号：US08502361B1

公开(公告)日：2013-08-06

申请号：US12964468

申请日：2010-12-09

申请人： John M. Nickelsen, Jr. ,  Pil Je Sung ,  Garry Pycroft

发明人： John M. Nickelsen, Jr. ,  Pil Je Sung ,  Garry Pycroft

IPC分类号： H01L23/495

CPC分类号： H01L31/02008 ,  H01L31/044 ,  H01L31/048 ,  H01L2924/0002 ,  H02S40/42 ,  Y02E10/50 ,  H01L2924/00

摘要： In accordance with the present invention, there is provided a CPV package which comprises a leadframe assembly, such leadframe assembly including multiple frames stacked on top of each other. A top frame of the leadframe assembly provides the electrical interconnect between the top or front surface of the receiver die and the bypass diode required to complete the circuit. The top frame also provides hook up wire interconnect pads for the completed CPV package. An exposed bottom surface of a bottom frame of the leadframe assembly defines a heat spreader which assists in thermal management. The fabrication of the CPV package to include multiple frames stacked on top of each other provides high thermal dissipation and high voltage isolation, while at the same providing a high level of reliability with a comparatively low manufacturing cost.

摘要翻译： 根据本发明，提供一种CPV封装，其包括引线框架组件，该引线框架组件包括彼此堆叠的多个框架的引线框架组件。 引线框架组件的顶部框架提供了接收器管芯的顶表面或前表面与完成电路所需的旁路二极管之间的电互连。 顶部框架还提供了用于完成的CPV封装的连接线互连焊盘。 引线框架组件的底部框架的暴露的底部表面限定了有助于热管理的散热器。 CPV封装的制造包括堆叠在彼此顶部的多个框架，提供高散热和高电压隔离，同时以相对较低的制造成本提供高水平的可靠性。

公开(公告)号：US5435481A

公开(公告)日：1995-07-25

申请号：US181724

申请日：1994-01-18

申请人： Francisco Da Costa Alves ,  William B. Mullen, III ,  John M. Nickelsen, Jr.

发明人： Francisco Da Costa Alves ,  William B. Mullen, III ,  John M. Nickelsen, Jr.

IPC分类号： B23K1/20 ,  H05K3/34

CPC分类号： B23K1/20 ,  H05K3/3436 ,  H05K3/3489 ,  H05K2201/10719 ,  H05K2201/10727 ,  H05K2201/10734 ,  H05K2203/0485 ,  H05K3/3442 ,  H05K3/3473 ,  Y02P70/613

摘要： A soldering process for use with solder clad printed circuit boards (10) uses a pin transfer means to apply a tacking agent to the substrate. An array of pins (24) is dipped into a film of tacking agent (22). The pins are removed from the tacking agent (26) carrying with them a predetermined amount of tacking agent. The pins are then contacted (27) to the printed circuit board and removed (28). During this process, a predetermined amount of tacking agent is deposited at selective locations on the printed circuit board. A component is placed (30) on the printed circuit board in the tacking agent and the circuit board and component are heated (40) in order to reflow the solder and effect the solder joint between the component and the board.

摘要翻译： 与焊料包覆印刷电路板（10）一起使用的焊接工艺使用引脚传输装置将粘合剂施加到基底上。 销（24）的阵列被浸入粘合剂（22）的膜中。 销钉从与其一起携带预定量的粘合剂的粘合剂（26）中移除。 然后将引脚接触（27）到印刷电路板并移除（28）。 在该过程中，预定量的定影剂沉积在印刷电路板上的选择性位置。 将一个部件（30）放置在定影剂中的印刷电路板上，并且电路板和部件被加热（40）以便回流焊料并且实现部件和板之间的焊接接头。