Transistors, methods of manufacturing the same and electronic devices including transistors
    1.
    发明授权
    Transistors, methods of manufacturing the same and electronic devices including transistors 有权
    晶体管,其制造方法以及包括晶体管的电子器件

    公开(公告)号:US08912536B2

    公开(公告)日:2014-12-16

    申请号:US13156906

    申请日:2011-06-09

    IPC分类号: H01L29/10 H01L29/786

    CPC分类号: H01L29/7869

    摘要: An oxide transistor includes: a channel layer formed of an oxide semiconductor; a source electrode contacting a first end portion of the channel layer; a drain electrode contacting a second end portion of the channel layer; a gate corresponding to the channel layer; and a gate insulating layer disposed between the channel layer and the gate. The oxide semiconductor includes hafnium-indium-zinc-oxide (HfInZnO). An electrical conductivity of a back channel region of the channel layer is lower than an electrical conductivity of a front channel region of the channel layer.

    摘要翻译: 氧化物晶体管包括:由氧化物半导体形成的沟道层; 与所述沟道层的第一端部接触的源电极; 漏极,与所述沟道层的第二端部接触; 对应于沟道层的栅极; 以及设置在沟道层和栅极之间的栅极绝缘层。 氧化物半导体包括铪 - 铟 - 锌 - 氧化物(HfInZnO)。 沟道层的背沟道区域的导电率低于沟道层的前沟道区域的导电率。

    Oxide thin film transistors and methods of manufacturing the same
    10.
    发明授权
    Oxide thin film transistors and methods of manufacturing the same 有权
    氧化物薄膜晶体管及其制造方法

    公开(公告)号:US08581244B2

    公开(公告)日:2013-11-12

    申请号:US13004981

    申请日:2011-01-12

    IPC分类号: H01L29/786 H01L21/34

    CPC分类号: H01L29/7869 B82Y10/00

    摘要: Example embodiments are directed to oxide thin film transistors and methods of manufacturing the oxide thin film transistors. The oxide thin film transistor includes an active region in a gate insulation layer and under a source and a drain in a bottom gate structure, thus improving electrical characteristics of the oxide thin film transistor.

    摘要翻译: 示例性实施例涉及氧化物薄膜晶体管和制造氧化物薄膜晶体管的方法。 氧化物薄膜晶体管包括栅极绝缘层中的有源区和底栅结构中的源极和漏极,从而改善氧化物薄膜晶体管的电特性。