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公开(公告)号：US06869347B2
公开(公告)日：2005-03-22
申请号：US10794727
申请日：2004-03-05
CPC分类号： B24B37/08 , B24B19/08 , B24B19/22 , B24B19/226 , B24B37/013 , B24B37/04 , B24B49/12 , G02B6/2826
摘要： Fabrication techniques for polishing fibers engaged in grooves on substrates. A protection template assembly is disclosed to protect the unpolished portions of fibers. Chemical mechanical polishing may be used to achieve high fabrication throughput and high polishing uniformity. Optical monitoring may be used to monitor the polishing in real time.
摘要翻译： 用于抛光与衬底上凹槽接合的纤维的制造技术。 公开了保护模板组件以保护未抛光部分的纤维。 可以使用化学机械抛光来实现高制造生产率和高抛光均匀性。 光学监测可用于实时监测抛光。
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公开(公告)号：US06719608B1
公开(公告)日：2004-04-13
申请号：US10126930
申请日：2002-04-19
IPC分类号： B24B4900
CPC分类号： B24B37/08 , B24B19/08 , B24B19/22 , B24B19/226 , B24B37/013 , B24B37/04 , B24B49/12 , G02B6/2826
摘要： Fabrication techniques for polishing fibers engaged in grooves on substrates. A protection template assembly is disclosed to protect the unpolished portions of fibers. Chemical mechanical polishing may be used to achieve high fabrication throughput and high polishing uniformity. Optical monitoring may be used to monitor the polishing in real time.
摘要翻译： 用于抛光与衬底上凹槽接合的纤维的制造技术。 公开了保护模板组件以保护未抛光部分的纤维。 可以使用化学机械抛光来实现高制造生产率和高抛光均匀性。 光学监测可用于实时监测抛光。
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公开(公告)号：US06771874B2
公开(公告)日：2004-08-03
申请号：US10150401
申请日：2002-05-17
申请人： Joseph A. Levert , Michael Talmadge
发明人： Joseph A. Levert , Michael Talmadge
IPC分类号： G02B600
CPC分类号： G02B6/3636
摘要： A method of placing a fiber on a substrate includes holding at least one fiber under tension, aligning the held fiber with a groove formed into a substrate, moving the substrate towards the fiber to place the fiber in the groove, fixing the position of the fiber under tension in the groove, and releasing the fiber.
摘要翻译： 将纤维放置在基板上的方法包括：在拉伸下保持至少一根纤维，将保持的纤维与形成于基底中的凹槽对准，将基底朝向纤维移动以将纤维放置在凹槽中，固定纤维的位置 在槽内处于张力下，释放纤维。
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4.发明授权公开(公告)号：US06630433B2
公开(公告)日：2003-10-07
申请号：US09745266
申请日：2000-12-20
IPC分类号： C11D708
CPC分类号： C09G1/02 , C23F1/18 , C23F3/04 , C23F3/06 , H01L21/32115 , H01L21/3212 , H01L21/32134
摘要： Chemical mechanical planarization or spin etch planarization of surfaces of copper, tantalum and tantalum nitride is accomplished by means of the chemical formulations of the present invention. The chemical formulations may optionally include abrasive particles and which may be chemically reactive or inert. Contact or non-contact CMP may be performed with the present chemical formulations. Substantially 1:1 removal rate selectivity for Cu and Ta/TaN is achieved.
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公开(公告)号：US06407006B1
公开(公告)日：2002-06-18
申请号：US09549659
申请日：2000-04-14
IPC分类号： H01L2131
CPC分类号： B82Y10/00 , B82Y40/00 , G03F7/0002 , H01L21/31051
摘要： An apparatus for planarizing or patterning a dielectric film on a substrate is provided. The apparatus includes a press for applying contact pressure to an operably connected compression tool. The compression tool has a working face that is planar or patterned. A controller for regulating the position, timing and force applied by the compression tool to the dielectric film is also provided. There is also provided a support, with an optional workpiece holder for supporting the substrate and dielectric film during contact with the compression tool. Methods of using the apparatus, as well as planarized and/or patterned dielectric films are also provided.
摘要翻译： 提供了一种用于平坦化或图案化基板上的电介质膜的装置。 该装置包括用于向可操作地连接的压缩工具施加接触压力的压力机。 压缩工具具有平面或图案化的工作面。 还提供了一种用于调节压缩工具对电介质膜施加的位置，正时和力的控制器。 还提供了支撑件，其具有用于在与压缩工具接触期间支撑基板和电介质膜的可选的工件保持器。 还提供了使用该装置的方法，以及平面化和/或图案化的电介质膜。
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