公开(公告)号：US08993432B2

公开(公告)日：2015-03-31

申请号：US13297779

申请日：2011-11-16

申请人： Shang-Yun Hou ,  Wei-Cheng Wu ,  Hsien-Pin Hu ,  Jung Cheng Ko ,  Shin-Puu Jeng ,  Chen-Hua Yu ,  Kim Hong Chen

发明人： Shang-Yun Hou ,  Wei-Cheng Wu ,  Hsien-Pin Hu ,  Jung Cheng Ko ,  Shin-Puu Jeng ,  Chen-Hua Yu ,  Kim Hong Chen

IPC分类号： H01L21/44 ,  H01L21/66 ,  H01L21/768 ,  H01L23/00

CPC分类号： H05K1/115 ,  H01L21/76898 ,  H01L22/14 ,  H01L24/11 ,  H01L24/13 ,  H01L2224/0401 ,  H01L2224/0557 ,  H01L2224/1147 ,  H01L2224/13025 ,  H01L2224/13111 ,  H01L2224/13116 ,  H01L2224/13124 ,  H01L2224/13147 ,  H01L2224/13155 ,  H01L2224/13169 ,  H01L2924/00014 ,  H01L2924/01322 ,  H01L2924/12042 ,  H05K1/0298 ,  H05K2201/2081 ,  H01L2924/01082 ,  H01L2224/05552 ,  H01L2924/00

摘要： A method and apparatus for testing the electrical characteristics, such as electrical continuity, is provided. A substrate, such as a wafer or an interposer, having a plurality of through vias (TVs) is provided. Along one side of the substrate, a conductive layer electrically couples two or more of the TVs. Thereafter, the electrical characteristics of the TVs may be test by, for example, a probe card in electrical contact with the TVs on the other side of the substrate. During testing, current passes through a first TV from a first side of the substrate, to the conductive layer on a second side of the substrate, to a second TV, and back to the first side of the substrate through the second TV.

摘要翻译： 提供了用于测试诸如电连续性的电特性的方法和装置。 提供具有多个通孔（TV）的基板，例如晶片或插入件。 沿着衬底的一侧，导电层电耦合两个或更多个电视机。 此后，TV的电气特性可以通过例如与基板另一侧的TV电接触的探针卡进行测试。 在测试期间，电流从衬底的第一侧通过第一TV到衬底的第二侧上的导电层到第二个TV，并且通过第二个TV返回到衬底的第一侧。

公开(公告)号：US20130120018A1

公开(公告)日：2013-05-16

申请号：US13297779

申请日：2011-11-16

申请人： Shang-Yun Hou ,  Wei-Cheng Wu ,  Hsien-Pin Hu ,  Jung Cheng Ko ,  Shin-Puu Jeng ,  Chen-Hua Yu ,  Kim Hong Chen

发明人： Shang-Yun Hou ,  Wei-Cheng Wu ,  Hsien-Pin Hu ,  Jung Cheng Ko ,  Shin-Puu Jeng ,  Chen-Hua Yu ,  Kim Hong Chen

IPC分类号： G01R31/26 ,  H01L23/48 ,  H01L21/58

CPC分类号： H05K1/115 ,  H01L21/76898 ,  H01L22/14 ,  H01L24/11 ,  H01L24/13 ,  H01L2224/0401 ,  H01L2224/0557 ,  H01L2224/1147 ,  H01L2224/13025 ,  H01L2224/13111 ,  H01L2224/13116 ,  H01L2224/13124 ,  H01L2224/13147 ,  H01L2224/13155 ,  H01L2224/13169 ,  H01L2924/00014 ,  H01L2924/01322 ,  H01L2924/12042 ,  H05K1/0298 ,  H05K2201/2081 ,  H01L2924/01082 ,  H01L2224/05552 ,  H01L2924/00

摘要： A method and apparatus for testing the electrical characteristics, such as electrical continuity, is provided. A substrate, such as a wafer or an interposer, having a plurality of through vias (TVs) is provided. Along one side of the substrate, a conductive layer electrically couples two or more of the TVs. Thereafter, the electrical characteristics of the TVs may be test by, for example, a probe card in electrical contact with the TVs on the other side of the substrate. During testing, current passes through a first TV from a first side of the substrate, to the conductive layer on a second side of the substrate, to a second TV, and back to the first side of the substrate through the second TV.