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公开(公告)号：US08049115B2
公开(公告)日：2011-11-01
申请号：US11960709
申请日：2007-12-20
IPC分类号： H05K1/16
CPC分类号： H05K1/0274 , H05K1/111 , H05K1/181 , H05K1/182 , H05K2201/0108 , H05K2201/09072 , H05K2201/09954 , H05K2201/10121 , H05K2201/10477 , H05K2201/10727
摘要： A printed circuit board (PCB) adapted for mounting different kinds of light sensing modules thereon includes a lighting sensing area and a plurality of pads. The pads are disposed around the lighting sensing area, for configuring one light sensing module thereon. In the present invention, the PCB is suitable for different kinds of light sensing modules without redesign, which lowers the manufacturing cost of the PCB.
摘要翻译： 适于在其上安装不同种类的光感测模块的印刷电路板（PCB）包括照明感测区域和多个焊盘。 焊盘设置在照明感测区域周围，用于在其上配置一个光感测模块。 在本发明中，PCB不需要重新设计，适用于不同种类的感光模块，降低了PCB的制造成本。
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公开(公告)号：US20090101397A1
公开(公告)日：2009-04-23
申请号：US12168841
申请日：2008-07-07
申请人： Nan-Sheng Kuo , Jung-Kuei Chung , Chu-Lung Chien
发明人： Nan-Sheng Kuo , Jung-Kuei Chung , Chu-Lung Chien
CPC分类号： H05K3/3447 , H05K1/116 , H05K3/3468 , H05K2201/09381 , H05K2201/09781 , H05K2203/046
摘要： A printed circuit board (100) includes a plurality of through-holes (140) defined therein, a plurality of first solder pads (110) defined to surround the through-holes respectively, and a second solder pad (190). Each of the first solder pads includes a first soldering zone (112) for accommodating solder used in a soldering process and a second soldering zone (114) for receiving excess solder overflowing from the first soldering zone. The second soldering zone is in communication with and extends outward from the first soldering zone. The second solder pad is located on a tail end of the printed circuit board for receiving excess solder of the tail end during the soldering process.
摘要翻译： 印刷电路板（100）包括限定在其中的多个通孔（140），分别限定为围绕通孔的多个第一焊盘（110）和第二焊盘（190）。 每个第一焊盘包括用于容纳焊接工艺中使用的焊料的第一焊接区（112）和用于接收从第一焊接区溢出的多余焊料的第二焊接区（114）。 第二焊接区域与第一焊接区域连通并向外延伸。 第二焊盘位于印刷电路板的尾端，用于在焊接过程中接收尾端的多余焊料。
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公开(公告)号：US20080149367A1
公开(公告)日：2008-06-26
申请号：US11960709
申请日：2007-12-20
IPC分类号： H05K1/00
CPC分类号： H05K1/0274 , H05K1/111 , H05K1/181 , H05K1/182 , H05K2201/0108 , H05K2201/09072 , H05K2201/09954 , H05K2201/10121 , H05K2201/10477 , H05K2201/10727
摘要： A printed circuit board (PCB) adapted for mounting different kinds of light sensing modules thereon includes a lighting sensing area and a plurality of pads. The pads are disposed around the lighting sensing area, for configuring one light sensing module thereon. In the present invention, the PCB is suitable for different kinds of light sensing modules without redesign, which lowers the manufacturing cost of the PCB.
摘要翻译： 适于在其上安装不同种类的光感测模块的印刷电路板（PCB）包括照明感测区域和多个焊盘。 焊盘设置在照明感测区域周围，用于在其上配置一个光感测模块。 在本发明中，PCB不需要重新设计，适用于不同种类的感光模块，降低了PCB的制造成本。
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