公开(公告)号：US08710387B2

公开(公告)日：2014-04-29

申请号：US13204616

申请日：2011-08-05

申请人： Bily Wang ,  Kuei-Pao Chen ,  Hsin-Cheng Chen

发明人： Bily Wang ,  Kuei-Pao Chen ,  Hsin-Cheng Chen

IPC分类号： B07C5/00

CPC分类号： G01R31/01 ,  G01R31/2635

摘要： An LED package chip classification system includes a rotation unit for transporting a plurality of LED package chips, a chip test unit, and a chip classification unit. The rotation unit includes a rotary turntable, a plurality of receiving portions formed on the rotary turntable, and a plurality of suction-exhaust dual-purpose openings respectively disposed in the receiving portions. Each LED package chip has a positive electrode pad and a negative electrode pad disposed on the bottom side thereof. The chip test unit includes a chip test module adjacent to the rotation unit for testing each LED package chip. The chip classification unit includes a plurality of chip classification modules adjacent to the rotation unit for classifying the LED package chips. Therefore, the LED package chips can be classified by matching the rotation unit, the chip test unit, and the chip classification unit.

摘要翻译： LED封装芯片分类系统包括用于传输多个LED封装芯片的转动单元，芯片测试单元和芯片分类单元。 旋转单元包括旋转转盘，形成在旋转转台上的多个接收部分和分别设置在接收部分中的多个抽吸排气双重用途开口。 每个LED封装芯片具有设置在其底侧上的正极焊盘和负极焊盘。 芯片测试单元包括与旋转单元相邻的芯片测试模块，用于测试每个LED封装芯片。 芯片分类单元包括与用于分类LED封装芯片的旋转单元相邻的多个芯片分类模块。 因此，可以通过匹配旋转单元，芯片测试单元和芯片分类单元来分类LED封装芯片。

公开(公告)号：US20120285869A1

公开(公告)日：2012-11-15

申请号：US13204616

申请日：2011-08-05

申请人： BILY WANG ,  KUEI-PAO CHEN ,  HSIN-CHENG CHEN

发明人： BILY WANG ,  KUEI-PAO CHEN ,  HSIN-CHENG CHEN

IPC分类号： B07C5/344

CPC分类号： G01R31/01 ,  G01R31/2635

摘要： An LED package chip classification system includes a rotation unit for transporting a plurality of LED package chips, a chip test unit, and a chip classification unit. The rotation unit includes a rotary turntable, a plurality of receiving portions formed on the rotary turntable, and a plurality of suction-exhaust dual-purpose openings respectively disposed in the receiving portions. Each LED package chip has a positive electrode pad and a negative electrode pad disposed on the bottom side thereof The chip test unit includes a chip test module adjacent to the rotation unit for testing each LED package chip. The chip classification unit includes a plurality of chip classification modules adjacent to the rotation unit for classifying the LED package chips. Therefore, the LED package chips can be classified by matching the rotation unit, the chip test unit, and the chip classification unit.

摘要翻译： LED封装芯片分类系统包括用于传输多个LED封装芯片的转动单元，芯片测试单元和芯片分类单元。 旋转单元包括旋转转盘，形成在旋转转台上的多个接收部分和分别设置在接收部分中的多个抽吸排气双用途开口。 每个LED封装芯片具有设置在其底侧的正极焊盘和负极焊盘。芯片测试单元包括与用于测试每个LED封装芯片的旋转单元相邻的芯片测试模块。 芯片分类单元包括与用于分类LED封装芯片的旋转单元相邻的多个芯片分类模块。 因此，可以通过匹配旋转单元，芯片测试单元和芯片分类单元来分类LED封装芯片。

公开(公告)号：US20120205297A1

公开(公告)日：2012-08-16

申请号：US13170705

申请日：2011-06-28

申请人： Bily WANG ,  Kuei-Pao CHEN ,  Hsin-Cheng CHEN

发明人： Bily WANG ,  Kuei-Pao CHEN ,  Hsin-Cheng CHEN

IPC分类号： B07C5/00 ,  B07C5/344

CPC分类号： B07C5/00 ,  B07C5/344 ,  G01R31/01 ,  G01R31/2893

摘要： A packaged chip detection and classification device includes a rotation unit for transporting a plurality of packaged chips, a packaged chip detection unit, and a packaged chip classification unit. The rotation unit includes a rotary turntable, a plurality of receiving portions formed on the rotary turntable, and a plurality of suction-exhaust openings respectively formed in the receiving portions. Each receiving portion is used to selectively receive at least one of the packaged chips. The packaged chip detection unit includes a packaged chip detection module adjacent to the rotation unit for detecting each packaged chip. The packaged chip classification unit includes a packaged chip classification module adjacent to the rotation unit for classifying the packaged chips. Therefore, the packaged chip detection and classification device can be used to detect and classify no-lead packaged chips by matching the rotation unit, the packaged chip detection unit, and the packaged chip classification unit.

摘要翻译： 封装芯片检测和分类装置包括用于传输多个封装芯片的转动单元，封装芯片检测单元和封装芯片分类单元。 旋转单元包括旋转转盘，形成在旋转转盘上的多个接收部分和分别形成在接收部分中的多个抽吸排气口。 每个接收部分用于选择性地接收至少一个封装的芯片。 封装芯片检测单元包括与用于检测每个封装芯片的旋转单元相邻的封装芯片检测模块。 封装芯片分类单元包括与旋转单元相邻的封装芯片分类模块，用于对封装芯片进行分类。 因此，封装芯片检测和分类装置可以通过匹配旋转单元，封装芯片检测单元和封装芯片分类单元来检测和分类无铅封装芯片。

公开(公告)号：US20090213474A1

公开(公告)日：2009-08-27

申请号：US12285035

申请日：2008-09-29

申请人： Bily Wang ,  Kuei-Pao Chen ,  Chih-Ming Wang ,  Jui-Wen Pan

发明人： Bily Wang ,  Kuei-Pao Chen ,  Chih-Ming Wang ,  Jui-Wen Pan

IPC分类号： G02B11/20

CPC分类号： G02B13/0095

摘要： An optical object distance simulation device for reducing total optical path includes: a lens, an achromatic lens set, a first image lens, and a second image lens. The achromatic lens set disposes beside one side of the lens, the first image lens disposes beside one side of the achromatic lens set, and the second image lens disposes beside one side of the first image lens. The achromatic lens set is composed of a first lens and a second lens. The first lens is a double-concave lens. The second lens is a double-convex lens. One concave face of the double-concave tightly contacts with one convex face of the double-convex lens. Therefore, the lens, the achromatic lens set, the first image lens, and the second image lens match with each other in order to simulate real object distance for reducing an object distance between a test camera lens and a corresponding chart.

摘要翻译： 用于减小总光路的光学物体距离模拟装置包括：透镜，消色差透镜组，第一图像透镜和第二图像透镜。 消色差透镜组位于透镜的一侧旁边，第一图像透镜配置在消色差透镜组的一侧旁边，第二图像透镜配置在第一图像透镜的一侧旁边。 消色差透镜组由第一透镜和第二透镜组成。 第一个镜头是双凹透镜。 第二透镜是双凸透镜。 双凹面的一个凹面与双凸透镜的一个凸面紧密接触。 因此，透镜，消色差透镜组，第一图像透镜和第二图像透镜彼此匹配，以便模拟实际物体距离，以减少测试相机镜头与相应图表之间的物体距离。

公开(公告)号：US07256603B1

公开(公告)日：2007-08-14

申请号：US11475147

申请日：2006-06-27

申请人： Bily Wang ,  Chung-Ho Chen ,  Kuei-Pao Chen

发明人： Bily Wang ,  Chung-Ho Chen ,  Kuei-Pao Chen

IPC分类号： G01R31/26

CPC分类号： G01R1/36 ,  G01R31/3004 ,  G01R31/31924

摘要： An apparatus for measuring the static parameters of integrated circuit is disclosed. When the apparatus is operated, the output mode is determined automatically according to the load of the integrated circuit. When the apparatus is operated in voltage output mode, the apparatus automatically limits the current. When the apparatus is operated at current output mode, the apparatus automatically limits the voltage. Therefore, the operation voltage and the operation current are stabilized. When the tested integrated circuit fails, the apparatus of the present invention can protect itself according to the stable operation voltage and operation current, and doesn't damage the tested integrated circuit.

摘要翻译： 公开了一种用于测量集成电路的静态参数的装置。 当设备运行时，根据集成电路的负载自动确定输出模式。 当设备在电压输出模式下工作时，设备自动限制电流。 当设备在当前输出模式下工作时，设备自动限制电压。 因此，工作电压和工作电流稳定。 当测试的集成电路出现故障时，本发明的装置可以根据稳定的工作电压和工作电流来保护自身，并且不会损坏被测集成电路。

公开(公告)号：US08873920B2

公开(公告)日：2014-10-28

申请号：US13425829

申请日：2012-03-21

申请人： Bily Wang ,  Kuei-Pao Chen ,  Hsin-Cheng Chen ,  Cheng-Chin Chiu

发明人： Bily Wang ,  Kuei-Pao Chen ,  Hsin-Cheng Chen ,  Cheng-Chin Chiu

IPC分类号： G02B6/00

CPC分类号： G02B6/4298 ,  G01J2001/4252 ,  G01R31/2635 ,  G02B6/3616 ,  G02B6/3644

摘要： A light-guiding cover structure includes a top cover unit and a light-guiding unit. The top cover unit has a plurality of receiving spaces formed therein. The light-guiding unit includes a plurality of light-guiding groups, wherein each light-guiding group includes a plurality of optical fiber cables received in the corresponding receiving space, and each optical fiber cable has two opposite ends exposed from the bottom surface of the top cover unit and respectively facing at least one light-emitting device and at least one light-sensing device that have been disposed under the top cover unit. Therefore, the optical fiber cables received in the corresponding receiving space, thus when the light-guiding cover structure is applied to the LED package chip classification system, the aspect of the LED package chip classification system can be enhanced.

摘要翻译： 导光罩结构包括顶盖单元和导光单元。 顶盖单元具有形成在其中的多个接收空间。 导光单元包括多个导光组，其中每个导光组包括容纳在相应接收空间中的多根光纤电缆，并且每根光纤电缆具有两个相对端从第 并且分别面向至少一个发光装置和已经设置在顶盖单元下的至少一个光感测装置。 因此，光纤电缆在相应的接收空间中被接收，因此当导光盖结构被应用于LED封装芯片分类系统时，可以提高LED封装芯片分类系统的方面。

公开(公告)号：US08686310B2

公开(公告)日：2014-04-01

申请号：US13170705

申请日：2011-06-28

申请人： Bily Wang ,  Kuei-Pao Chen ,  Hsin-Cheng Chen

发明人： Bily Wang ,  Kuei-Pao Chen ,  Hsin-Cheng Chen

IPC分类号： B07C5/344

CPC分类号： B07C5/00 ,  B07C5/344 ,  G01R31/01 ,  G01R31/2893

摘要： A packaged chip detection and classification device includes a rotation unit for transporting a plurality of packaged chips, a packaged chip detection unit, and a packaged chip classification unit. The rotation unit includes a rotary turntable, a plurality of receiving portions formed on the rotary turntable, and a plurality of suction-exhaust openings respectively formed in the receiving portions. Each receiving portion is used to selectively receive at least one of the packaged chips. The packaged chip detection unit includes a packaged chip detection module adjacent to the rotation unit for detecting each packaged chip. The packaged chip classification unit includes a packaged chip classification module adjacent to the rotation unit for classifying the packaged chips. Therefore, the packaged chip detection and classification device can be used to detect and classify no-lead packaged chips by matching the rotation unit, the packaged chip detection unit, and the packaged chip classification unit.

摘要翻译： 封装芯片检测和分类装置包括用于传输多个封装芯片的转动单元，封装芯片检测单元和封装芯片分类单元。 旋转单元包括旋转转盘，形成在旋转转盘上的多个接收部分和分别形成在接收部分中的多个抽吸排气口。 每个接收部分用于选择性地接收至少一个封装的芯片。 封装芯片检测单元包括与用于检测每个封装芯片的旋转单元相邻的封装芯片检测模块。 封装芯片分类单元包括与旋转单元相邻的封装芯片分类模块，用于对封装芯片进行分类。 因此，封装芯片检测和分类装置可以通过匹配旋转单元，封装芯片检测单元和封装芯片分类单元来检测和分类无铅封装芯片。

公开(公告)号：US08107720B2

公开(公告)日：2012-01-31

申请号：US12453636

申请日：2009-05-18

申请人： Bily Wang ,  Kuei-Pao Chen ,  Hsin-Cheng Chen ,  Ming-Hao Chou ,  Ren-Chun Ni

发明人： Bily Wang ,  Kuei-Pao Chen ,  Hsin-Cheng Chen ,  Ming-Hao Chou ,  Ren-Chun Ni

IPC分类号： G06K9/00

CPC分类号： G06T7/0006 ,  G06T2207/30164

摘要： A detection system for detecting appearances of many electronic elements includes a rotary module, a feeding module and a detection module. The rotary module has a base structure and a hollow transparent rotary structure disposed on the base structure. The feeding module is disposed beside one side of the hollow transparent rotary structure in order to sequentially guide the electronic elements to the top surface of the hollow transparent rotary structure. The detection module has a plurality of detection units sequentially disposed around the hollow transparent rotary structure. Each detection unit is composed of an image-sensing element for sensing the electronic elements, an image-capturing element for capturing surface images of the electronic elements and a classifying element for classifying the electronic elements.

摘要翻译： 用于检测许多电子元件的外观的检测系统包括旋转模块，馈送模块和检测模块。 旋转模块具有底座结构和设置在基座结构上的中空透明旋转结构。 馈送模块设置在中空透明旋转结构的一侧旁边，以便顺序地将电子元件引导到中空透明旋转结构的顶表面。 检测模块具有多个依次设置在中空透明旋转结构周围的检测单元。 每个检测单元由用于感测电子元件的图像感测元件，用于捕获电子元件的表面图像的图像捕获元件和用于分类电子元件的分类元件组成。

公开(公告)号：US07898663B2

公开(公告)日：2011-03-01

申请号：US12285191

申请日：2008-09-30

申请人： Bily Wang ,  Kuei-Pao Chen ,  Chih-Ming Wang

发明人： Bily Wang ,  Kuei-Pao Chen ,  Chih-Ming Wang

IPC分类号： G01J3/40 ,  G01B9/00

CPC分类号： G01J1/10 ,  G01J1/0271 ,  G01J1/04 ,  G01J1/0411 ,  G01J1/0422 ,  G01J1/08 ,  G01J2001/083 ,  G01M11/0264 ,  G02B19/0028 ,  G02B19/0066 ,  G02B27/0977 ,  G02B27/0994

摘要： A uniform light generating system for testing an image-sensing device includes a light-generating unit, a light-transmitting unit, a light-diffusing unit, and a lens unit. The light-generating unit has a substrate and a plurality of light-emitting elements electrically disposed on the substrate. The light-transmitting unit has one side communicated with the light-generating unit for receiving and uniformizing light beams projected from the light-emitting elements. The light-diffusing unit has one side disposed on the other side of the light-transmitting unit for receiving and diffusing the light beams that have passed through the light-transmitting unit. The lens unit is disposed on the other side of the light-diffusing unit for transmitting the light beams that have passed through the light-diffusing unit to the image-sensing device.

摘要翻译： 用于测试图像感测装置的均匀光产生系统包括发光单元，光发射单元，光漫射单元和透镜单元。 光产生单元具有基板和电气设置在基板上的多个发光元件。 光发射单元具有与发光单元连通的用于接收并均匀化从发光元件投射的光束的一侧。 光漫射单元的一侧设置在透光单元的另一侧，用于接收并扩散已经通过光发射单元的光束。 透镜单元设置在光漫射单元的另一侧，用于将已经通过光漫射单元的光束传输到图像感测装置。

公开(公告)号：US20090190124A1

公开(公告)日：2009-07-30

申请号：US12285191

申请日：2008-09-30

申请人： Bily Wang ,  Kuei-Pao Chen ,  Chih-Ming Wang

发明人： Bily Wang ,  Kuei-Pao Chen ,  Chih-Ming Wang

IPC分类号： G01J1/10 ,  G02B27/40

CPC分类号： G01J1/10 ,  G01J1/0271 ,  G01J1/04 ,  G01J1/0411 ,  G01J1/0422 ,  G01J1/08 ,  G01J2001/083 ,  G01M11/0264 ,  G02B19/0028 ,  G02B19/0066 ,  G02B27/0977 ,  G02B27/0994

摘要： A uniform light generating system for testing an image-sensing device includes a light-generating unit, a light-transmitting unit, a light-diffusing unit, and a lens unit. The light-generating unit has a substrate and a plurality of light-emitting elements electrically disposed on the substrate. The light-transmitting unit has one side communicated with the light-generating unit for receiving and uniformizing light beams projected from the light-emitting elements. The light-diffusing unit has one side disposed on the other side of the light-transmitting unit for receiving and diffusing the light beams that have passed through the light-transmitting unit. The lens unit is disposed on the other side of the light-diffusing unit for transmitting the light beams that have passed through the light-diffusing unit to the image-sensing device.

摘要翻译： 用于测试图像感测装置的均匀光产生系统包括发光单元，光发射单元，光漫射单元和透镜单元。 光产生单元具有基板和电气设置在基板上的多个发光元件。 光发射单元具有与发光单元连通的用于接收并均匀化从发光元件投射的光束的一侧。 光漫射单元的一侧设置在透光单元的另一侧，用于接收并扩散已经通过光发射单元的光束。 透镜单元设置在光漫射单元的另一侧，用于将已经通过光漫射单元的光束传输到图像感测装置。