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公开(公告)号:US06960494B2
公开(公告)日:2005-11-01
申请号:US10968890
申请日:2004-10-21
申请人: Hiroshi Funakura , Eiichi Hosomi , Yasuhiro Koshio , Tetsuya Nagaoka , Junya Nagano , Mitsuru Oida , Masatoshi Fukuda , Atsushi Kurosu , Kaoru Kawai , Osamu Yamagata
发明人: Hiroshi Funakura , Eiichi Hosomi , Yasuhiro Koshio , Tetsuya Nagaoka , Junya Nagano , Mitsuru Oida , Masatoshi Fukuda , Atsushi Kurosu , Kaoru Kawai , Osamu Yamagata
CPC分类号: H01L23/49894 , H01L23/3121 , H01L24/48 , H01L2224/16225 , H01L2224/45144 , H01L2224/48091 , H01L2224/48227 , H01L2224/48228 , H01L2924/00014 , H01L2924/01019 , H01L2924/01079 , H01L2924/181 , H01L2924/00 , H01L2924/00012 , H01L2224/0401 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要: A semiconductor package has (a) a package base, (b) package terminals formed on the package base and used to connect the semiconductor package to another device, (c) a wiring layer formed on the package base and electrically connected to the package terminals, (d) a semiconductor chip mounted on the package base and electrically connected to the wiring layer, (e) a low-elasticity resin layer formed between a resin mold and the wiring layer and between the package base and the resin mold, and (f) the resin mold sealing the package base, the wiring layer, the semiconductor chip, and the low-elasticity resin layer.
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公开(公告)号:US06836012B2
公开(公告)日:2004-12-28
申请号:US10108363
申请日:2002-03-29
申请人: Hiroshi Funakura , Eiichi Hosomi , Yasuhiro Koshio , Tetsuya Nagaoka , Junya Nagano , Mitsuru Oida , Masatoshi Fukuda , Atsushi Kurosu , Kaoru Kawai , Osamu Yamagata
发明人: Hiroshi Funakura , Eiichi Hosomi , Yasuhiro Koshio , Tetsuya Nagaoka , Junya Nagano , Mitsuru Oida , Masatoshi Fukuda , Atsushi Kurosu , Kaoru Kawai , Osamu Yamagata
IPC分类号: H01L2314
CPC分类号: H01L23/49894 , H01L23/3121 , H01L24/48 , H01L2224/16225 , H01L2224/45144 , H01L2224/48091 , H01L2224/48227 , H01L2224/48228 , H01L2924/00014 , H01L2924/01019 , H01L2924/01079 , H01L2924/181 , H01L2924/00 , H01L2924/00012 , H01L2224/0401 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要: A semiconductor package has (a) a package base, (b) package terminals formed on the package base and used to connect the semiconductor package to another device, (c) a wiring layer formed on the package base and electrically connected to the package terminals, (d) a semiconductor chip mounted on the package base and electrically connected to the wiring layer, (e) a low-elasticity resin layer formed between a resin mold and the wiring layer and between the package base and the resin mold, and (f) the resin mold sealing the package base, the wiring layer, the semiconductor chip, and the low-elasticity resin layer.
摘要翻译: 半导体封装具有(a)封装基座,(b)形成在封装基座上并用于将半导体封装连接到另一器件的封装端子,(c)形成在封装基座上并电连接到封装端子的布线层 ,(d)安装在封装基板上并电连接到布线层的半导体芯片,(e)在树脂模具和布线层之间以及封装基底和树脂模具之间形成的低弹性树脂层,和 f)树脂模具密封封装基座,布线层,半导体芯片和低弹性树脂层。
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公开(公告)号:US20050051810A1
公开(公告)日:2005-03-10
申请号:US10968890
申请日:2004-10-21
申请人: Hiroshi Funakura , Eiichi Hosomi , Yasuhiro Koshio , Tetsuya Nagaoka , Junya Nagano , Mitsuru Oida , Masatoshi Fukuda , Atsushi Kurosu , Kaoru Kawai , Osamu Yamagata
发明人: Hiroshi Funakura , Eiichi Hosomi , Yasuhiro Koshio , Tetsuya Nagaoka , Junya Nagano , Mitsuru Oida , Masatoshi Fukuda , Atsushi Kurosu , Kaoru Kawai , Osamu Yamagata
IPC分类号: H01L23/29 , H01L21/56 , H01L23/12 , H01L23/28 , H01L23/31 , H01L23/498 , H01L29/768
CPC分类号: H01L23/49894 , H01L23/3121 , H01L24/48 , H01L2224/16225 , H01L2224/45144 , H01L2224/48091 , H01L2224/48227 , H01L2224/48228 , H01L2924/00014 , H01L2924/01019 , H01L2924/01079 , H01L2924/181 , H01L2924/00 , H01L2924/00012 , H01L2224/0401 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要: A semiconductor package has (a) a package base, (b) package terminals formed on the package base and used to connect the semiconductor package to another device, (c) a wiring layer formed on the package base and electrically connected to the package terminals, (d) a semiconductor chip mounted on the package base and electrically connected to the wiring layer, (e) a low-elasticity resin layer formed between a resin mold and the wiring layer and between the package base and the resin mold, and (f) the resin mold sealing the package base, the wiring layer, the semiconductor chip, and the low-elasticity resin layer.
摘要翻译: 半导体封装具有(a)封装基座,(b)形成在封装基座上并用于将半导体封装连接到另一器件的封装端子,(c)形成在封装基座上并电连接到封装端子的布线层 ,(d)安装在封装基板上并电连接到布线层的半导体芯片,(e)在树脂模具和布线层之间以及封装基底和树脂模具之间形成的低弹性树脂层,和 f)树脂模具密封封装基座,布线层,半导体芯片和低弹性树脂层。
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