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公开(公告)号:US06960494B2
公开(公告)日:2005-11-01
申请号:US10968890
申请日:2004-10-21
申请人: Hiroshi Funakura , Eiichi Hosomi , Yasuhiro Koshio , Tetsuya Nagaoka , Junya Nagano , Mitsuru Oida , Masatoshi Fukuda , Atsushi Kurosu , Kaoru Kawai , Osamu Yamagata
发明人: Hiroshi Funakura , Eiichi Hosomi , Yasuhiro Koshio , Tetsuya Nagaoka , Junya Nagano , Mitsuru Oida , Masatoshi Fukuda , Atsushi Kurosu , Kaoru Kawai , Osamu Yamagata
CPC分类号: H01L23/49894 , H01L23/3121 , H01L24/48 , H01L2224/16225 , H01L2224/45144 , H01L2224/48091 , H01L2224/48227 , H01L2224/48228 , H01L2924/00014 , H01L2924/01019 , H01L2924/01079 , H01L2924/181 , H01L2924/00 , H01L2924/00012 , H01L2224/0401 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要: A semiconductor package has (a) a package base, (b) package terminals formed on the package base and used to connect the semiconductor package to another device, (c) a wiring layer formed on the package base and electrically connected to the package terminals, (d) a semiconductor chip mounted on the package base and electrically connected to the wiring layer, (e) a low-elasticity resin layer formed between a resin mold and the wiring layer and between the package base and the resin mold, and (f) the resin mold sealing the package base, the wiring layer, the semiconductor chip, and the low-elasticity resin layer.
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公开(公告)号:US06836012B2
公开(公告)日:2004-12-28
申请号:US10108363
申请日:2002-03-29
申请人: Hiroshi Funakura , Eiichi Hosomi , Yasuhiro Koshio , Tetsuya Nagaoka , Junya Nagano , Mitsuru Oida , Masatoshi Fukuda , Atsushi Kurosu , Kaoru Kawai , Osamu Yamagata
发明人: Hiroshi Funakura , Eiichi Hosomi , Yasuhiro Koshio , Tetsuya Nagaoka , Junya Nagano , Mitsuru Oida , Masatoshi Fukuda , Atsushi Kurosu , Kaoru Kawai , Osamu Yamagata
IPC分类号: H01L2314
CPC分类号: H01L23/49894 , H01L23/3121 , H01L24/48 , H01L2224/16225 , H01L2224/45144 , H01L2224/48091 , H01L2224/48227 , H01L2224/48228 , H01L2924/00014 , H01L2924/01019 , H01L2924/01079 , H01L2924/181 , H01L2924/00 , H01L2924/00012 , H01L2224/0401 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要: A semiconductor package has (a) a package base, (b) package terminals formed on the package base and used to connect the semiconductor package to another device, (c) a wiring layer formed on the package base and electrically connected to the package terminals, (d) a semiconductor chip mounted on the package base and electrically connected to the wiring layer, (e) a low-elasticity resin layer formed between a resin mold and the wiring layer and between the package base and the resin mold, and (f) the resin mold sealing the package base, the wiring layer, the semiconductor chip, and the low-elasticity resin layer.
摘要翻译: 半导体封装具有(a)封装基座,(b)形成在封装基座上并用于将半导体封装连接到另一器件的封装端子,(c)形成在封装基座上并电连接到封装端子的布线层 ,(d)安装在封装基板上并电连接到布线层的半导体芯片,(e)在树脂模具和布线层之间以及封装基底和树脂模具之间形成的低弹性树脂层,和 f)树脂模具密封封装基座,布线层,半导体芯片和低弹性树脂层。
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公开(公告)号:US20050051810A1
公开(公告)日:2005-03-10
申请号:US10968890
申请日:2004-10-21
申请人: Hiroshi Funakura , Eiichi Hosomi , Yasuhiro Koshio , Tetsuya Nagaoka , Junya Nagano , Mitsuru Oida , Masatoshi Fukuda , Atsushi Kurosu , Kaoru Kawai , Osamu Yamagata
发明人: Hiroshi Funakura , Eiichi Hosomi , Yasuhiro Koshio , Tetsuya Nagaoka , Junya Nagano , Mitsuru Oida , Masatoshi Fukuda , Atsushi Kurosu , Kaoru Kawai , Osamu Yamagata
IPC分类号: H01L23/29 , H01L21/56 , H01L23/12 , H01L23/28 , H01L23/31 , H01L23/498 , H01L29/768
CPC分类号: H01L23/49894 , H01L23/3121 , H01L24/48 , H01L2224/16225 , H01L2224/45144 , H01L2224/48091 , H01L2224/48227 , H01L2224/48228 , H01L2924/00014 , H01L2924/01019 , H01L2924/01079 , H01L2924/181 , H01L2924/00 , H01L2924/00012 , H01L2224/0401 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要: A semiconductor package has (a) a package base, (b) package terminals formed on the package base and used to connect the semiconductor package to another device, (c) a wiring layer formed on the package base and electrically connected to the package terminals, (d) a semiconductor chip mounted on the package base and electrically connected to the wiring layer, (e) a low-elasticity resin layer formed between a resin mold and the wiring layer and between the package base and the resin mold, and (f) the resin mold sealing the package base, the wiring layer, the semiconductor chip, and the low-elasticity resin layer.
摘要翻译: 半导体封装具有(a)封装基座,(b)形成在封装基座上并用于将半导体封装连接到另一器件的封装端子,(c)形成在封装基座上并电连接到封装端子的布线层 ,(d)安装在封装基板上并电连接到布线层的半导体芯片,(e)在树脂模具和布线层之间以及封装基底和树脂模具之间形成的低弹性树脂层,和 f)树脂模具密封封装基座,布线层,半导体芯片和低弹性树脂层。
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公开(公告)号:US6087715A
公开(公告)日:2000-07-11
申请号:US336697
申请日:1999-06-21
申请人: Kanako Sawada , Hee Yeoul Yoo , Atsushi Kurosu , Kenji Takahashi
发明人: Kanako Sawada , Hee Yeoul Yoo , Atsushi Kurosu , Kenji Takahashi
IPC分类号: H01L21/60 , H01L21/607 , H01L23/31 , H01L23/495 , H01L23/50
CPC分类号: H01L24/97 , H01L23/3142 , H01L23/49503 , H01L23/49513 , H01L23/49586 , H01L24/32 , H01L2224/29007 , H01L2224/29111 , H01L2224/2919 , H01L2224/32014 , H01L2224/32245 , H01L2224/45144 , H01L2224/48091 , H01L2224/48247 , H01L2224/73265 , H01L2224/83385 , H01L2224/83855 , H01L2224/8388 , H01L2224/92247 , H01L2224/97 , H01L24/45 , H01L24/48 , H01L24/73 , H01L2924/01004 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01015 , H01L2924/01027 , H01L2924/01028 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/0105 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/0132 , H01L2924/0133 , H01L2924/0134 , H01L2924/0135 , H01L2924/078 , H01L2924/15151 , H01L2924/15747 , H01L2924/181 , H01L2924/3511
摘要: To provide a highly reliable semiconductor device which does not suffer from a crack in its package, a semiconductor chip 12 is mounted on a lead frame 11 with a bonding layer 13 between them, and they are sealed with a sealing resin 14. The lead frame 11 has a base member 11a essentially consisting of Cu and an oxide film 11b essentially consisting of an oxide of the base member 11a formed on the base member and having a thickness of about 50 nm or below. By controlling the oxide film 11b to a thickness of about 50 nm or below, an adhesion strength with the sealing resin 14 is improved greatly, so that a package crack does not occur even if a large thermal load is applied in a reflow process for mounting.
摘要翻译: 为了提供不会在其封装中遭受裂纹的高度可靠的半导体器件,半导体芯片12安装在引线框架11上,其间具有接合层13,并且用密封树脂14密封。引线框架 11具有基本上由Cu组成的基底部件11a和基本部件11a的氧化物基本上由氧化膜11b构成,该基底部件11a形成在基体上,厚度约为50nm以下。 通过将氧化膜11b控制到约50nm以下的厚度,与密封树脂14的密合强度大大提高,即使在用于安装的回流工艺中施加大的热负荷也不会发生封装裂缝 。
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公开(公告)号:US5937279A
公开(公告)日:1999-08-10
申请号:US63380
申请日:1998-04-21
申请人: Kanako Sawada , Hee Yeoul Yoo , Atsushi Kurosu , Kenji Takahashi
发明人: Kanako Sawada , Hee Yeoul Yoo , Atsushi Kurosu , Kenji Takahashi
IPC分类号: H01L21/60 , H01L21/607 , H01L23/31 , H01L23/495 , H01L23/50 , H01L21/44 , H01L21/48 , H01L21/50
CPC分类号: H01L24/97 , H01L23/3142 , H01L23/49503 , H01L23/49513 , H01L23/49586 , H01L24/32 , H01L2224/29007 , H01L2224/29111 , H01L2224/2919 , H01L2224/32014 , H01L2224/32245 , H01L2224/45144 , H01L2224/48091 , H01L2224/48247 , H01L2224/73265 , H01L2224/83385 , H01L2224/83855 , H01L2224/8388 , H01L2224/92247 , H01L2224/97 , H01L24/45 , H01L24/48 , H01L24/73 , H01L2924/01004 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01015 , H01L2924/01027 , H01L2924/01028 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/0105 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/0132 , H01L2924/0133 , H01L2924/0134 , H01L2924/0135 , H01L2924/078 , H01L2924/15151 , H01L2924/15747 , H01L2924/181 , H01L2924/3511
摘要: To provide a highly reliable semiconductor device which does not suffer from a crack in its package, a semiconductor chip 12 is mounted on a lead frame 11 with a bonding layer 13 between them, and they are sealed with a sealing resin 14. The lead frame 11 has a base member 11a essentially consisting of Cu and an oxide film 11b essentially consisting of an oxide of the base member 11a formed on the base member and having a thickness of about 50 nm or below. By controlling the oxide film 11b to a thickness of about 50 nm or below, an adhesion strength with the sealing resin 14 is improved greatly, so that a package crack does not occur even if a large thermal load is applied in a reflow process for mounting.
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